Hot-melt adhesive

US10030178B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10030178-B2
Application numberUS-201515127117-A
CountryUS
Kind codeB2
Filing dateMar 20, 2015
Priority dateMar 25, 2014
Publication dateJul 24, 2018
Grant dateJul 24, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Provided are a hot-melt adhesive having high flowability in a molten state and exhibiting high adhesion strength in bonding PP nonwoven fabrics and further exhibiting high adhesion strength in bonding PE film-PP nonwoven fabric, and a base polymer for a hot-melt adhesive. The hot-melt adhesive contains (A) a propylene-based polymer satisfying the following (Ai) to (Aiv), and (B) an olefin-based copolymer satisfying the following (Bi) and (Bii); and the base polymer for a hot-melt adhesive consists of a mixture of (A) a propylene-based polymer satisfying the following (Ai) to (Aiv) and (B) an olefin-based copolymer satisfying the following (Bi) and (Bii) and satisfies the following (1) and (2). (Ai) the melting point is 120° C. or lower, (Aii) the Mw is 10,000 to 150,000, (Aiii) the Mw/Mn is 2.5 or less, (Aiv) the penetration is 8 or less, (Bi) the penetration is 15 or more, (Bii) the melting point is 90° C. or higher, (1) the tensile elastic modulus at 23° C. is 400 MPa or less, and (2) the semi-crystallization time at 23° C. is 20 minutes or less.

First claim

Opening claim text (preview).

The invention claimed is: 1. A hot-melt adhesive, comprising: (A) a propylene-based polymer satisfying conditions (Ai) to (Aiv): (Ai) the melting point is 120° C. or lower, (Aii) Mw is 10,000 to 150,000, (Aiii) Mw/Mn is 2.5 or less, (Aiv) the penetration is 8 or less; and (B) an olefin-based copolymer satisfying conditions (Bi) and (Bii): (Bi) penetration is 15 or more, and (Bii) melting point is 90° C. or higher; wherein the olefin-based copolymer (B) is a copolymer of propylene, ethylene and 1-butene. 2. The hot-melt adhesive according to claim 1 , wherein the olefin-based copolymer (B) further satisfies condition (Biii): (Biii) Mw/Mn is 2.5 or more and 6.0 or less. 3. The hot-melt adhesive according to claim 1 , wherein the melting point of the propylene-based polymer (A) is 110° C. or lower. 4. The hot-melt adhesive according to claim 1 , wherein the melting point of the olefin-based copolymer (B) is 90 to 160° C. 5. The hot-melt adhesive according to claim 1 , wherein a ratio by mass of the propylene-based polymer (A) to the olefin-based copolymer (B) [(A)/(B)] is 99/1 to 50/50. 6. The hot-melt adhesive according to claim 1 , further comprising at least one selected from the group consisting of (C) a tackifier resin, (D) an oil and (E) a wax. 7. The hot-melt adhesive according to claim 1 , wherein a mixture of the propylene-based polymer (A) and the olefin-based copolymer (B) satisfies conditions (1) and (2): (1) tensile elastic modulus at 23° C. is 400 MPa or less, and (2) semi-crystallization time at 23° C. is 20 minutes or less. 8. The hot-melt adhesive according to claim 1 , wherein a mixture of the propylene-based polymer (A) and the olefin-based copolymer (B) satisfies condition (3): (3) elongation at break at 23° C. is 150% or more and 1,000% or less. 9. A base polymer for a hot-melt adhesive, the base polymer comprising a mixture of (A) a propylene-based polymer satisfying conditions (Ai) to (Aiv): (Ai) the melting point is 120° C. or lower, (Aii) Mw is 10,000 to 150,000, (Aiii) Mw/Mn is 2.5 or less, (Aiv) the penetration is 8 or less; and (B) an olefin-based copolymer satisfying conditions (Bi) and (Bii): (Bi) the penetration is 15 or more, (Bii) the melting point is 90° C. or higher, and which satisfies conditions (1) and (2): (1) tensile elastic modulus at 23° C. is 400 MPa or less, and (2) semi-crystallization time at 23° C. is 20 minutes or less. 10. The base polymer according to claim 9 , satisfying condition (3): (3) elongation at break at 23° C. is 150% or more and 1,000% or less.

Assignees

Inventors

Classifications

  • C09J123/12Primary

    Polypropene · CPC title

  • Elastomeric} ethylene-propylene or ethylene-propylene-diene copolymers {, e.g. EPR and EPDM rubbers · CPC title

  • Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers · CPC title

  • Copolymers of propene (C08L23/16 takes precedence) · CPC title

  • organic · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10030178B2 cover?
Provided are a hot-melt adhesive having high flowability in a molten state and exhibiting high adhesion strength in bonding PP nonwoven fabrics and further exhibiting high adhesion strength in bonding PE film-PP nonwoven fabric, and a base polymer for a hot-melt adhesive. The hot-melt adhesive contains (A) a propylene-based polymer satisfying the following (Ai) to (Aiv), and (B) an olefin-based…
Who is the assignee on this patent?
Idemitsu Kosan Co
What technology area does this patent fall under?
Primary CPC classification C09J123/12. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jul 24 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).