Gas barrier film
US-9219018-B2 · Dec 22, 2015 · US
US10030113B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10030113-B2 |
| Application number | US-201515301213-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 27, 2015 |
| Priority date | Mar 31, 2014 |
| Publication date | Jul 24, 2018 |
| Grant date | Jul 24, 2018 |
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The invention provides a gas barrier film with low deterioration in the gas barrier property before and after high-temperature hot water treatment. The gas barrier film has a gas barrier coating film, formed as a composite film comprising a network structure having a mesh structure with Si—O—Si bonds as the basic lattice and a water-soluble polymer crystallized as microcrystals, incorporated into the mesh of the network structure, wherein a barrier coating agent, obtained by mixing a condensate solution of an alkoxysilane hydrolysate prepared as a mixed solution in which the proportion of bonded states of the silicon atoms of the condensate with Q1 and Q2 structures is at least 60% of the total silicon atoms, with a crystalline water-soluble polymer, is coated on a base material film, either after forming or without forming an aluminum oxide vapor deposition film, to form a coating layer.
Opening claim text (preview).
The invention claimed is: 1. A gas barrier film having a base material made of a polymer resin composition, on which is layered a nanocomposite film comprising dispersed polymer microcrystals and a network structure of siloxane bonds stably holding them, wherein the nanocomposite film is formed from a polymer resin and a partial hydrolytic condensate of an alkoxysilane, wherein the proportion of Q1 and Q2 structures of the bonded states of the silicon atoms of the alkoxysilane hydrolytic condensate is at least 60% of the total silicon atoms. 2. A gas barrier film according to claim 1 , wherein the dispersed polymer microcrystals are of a water-soluble polymer. 3. A gas barrier film according to claim 1 , wherein the partial hydrolytic condensate is obtained by hydrolysis of an alkoxysilane with the general formula Si(OR) 4 (where R is an alkyl group) under conditions with a pH 1.5 to 3.0 and a liquid temperature of between 5° C. and 30° C. 4. A gas barrier film according to claim 1 wherein, when the bonded states of the silicon atoms in the nanocomposite film have been analyzed by laser Raman spectroscopy, the ratio A 425 /A 490 of the area intensity (A 425 ) at 425 cm −1 (peak due to the network structure) and the area intensity (A 490 ) at 490 cm −1 (peak not contributing to the network structure) is between 2.0 and 3.0, inclusive. 5. A gas barrier film according to claim 1 wherein, when the state of the water-soluble polymer in the nanocomposite film has been analyzed by CP/MAS using a solid 13 C-NMR device, waveform separation of the peak for 70 ppm from the spectrum obtained at 66 to 75 ppm is performed and the peak area ratio (A 70 ppm /A 66-75 ppm )× 100 is 40% or greater. 6. A gas barrier film according to claim 1 , wherein the hydrogen relaxation time obtained using a solid 13 C-NMR device, based on the molecular mobility of the water-soluble polymer in the nanocomposite film, is 2.0 msec or longer. 7. A gas barrier film according to claim 1 , wherein the nanocomposite film has a hardness of 1.0 GPa or greater as measured by a nanoindentation method after 500 hours of storage under conditions of 60° C., 90% RH. 8. A method for producing a gas barrier film according to claim 1 , in which a partial hydrolytic condensate of an alkoxysilane with the general formula Si(OR) 4 (where R is an alkyl group) is copresent with a water-soluble polymer, is coated onto a base material comprising a polymer resin composition, and then heat treatment is carried out at least twice to form a nanocomposite film comprising polymer microcrystals and a siloxane bond network holding them. 9. A method for producing a gas barrier film according to claim 8 , wherein the first heat treatment is treatment that removes the solvent and forms a coating film, and the temperature conditions for the second heat treatment are lower temperature than the temperature conditions for the first heat treatment. 10. A method for producing a gas barrier film according to claim 8 , wherein the temperature (T) for the first heat treatment is in the range of (T bp )° C.−(T bp ) +100° C., where T bp is the boiling point of the solvent used in the solution in which the partial hydrolytic condensate of an alkoxysilane represented by the general formula Si(OR) 4 (where R is an alkyl group), and the water-soluble polymer are copresent, and the temperature for the second heat treatment is in the range of (T g-coat )° C.−(T g-base )° C., where T g-coat is the glass transition temperature of the water-soluble polymer and T g-base is the glass transition temperature of the base material film. 11. A method for producing a gas barrier film according to claim 8 , wherein the heating time for the second heat treatment is longer than the heating time for the first heat treatment, the heating time for the second heat treatment being 1 to 300 hours. 12. A method for producing a gas barrier film according to claim 8 , wherein the heating time for the second heat treatment is 50 to 200 hours. 13. A packaging material having a heat-sealable resin layered on the surface of a nanocomposite film according to claim 1 , via an adhesive layer. 14. A packaging material according to claim 13 , wherein the packaging material is to be used in a retort sterilization packaging. 15. A packaging material having a heat-sealable resin layered on the surface of a nanocomposite film according to claim 1 via an adhesive layer, after having formed a printed layer. 16. A gas barrier film having a base material made of a polymer resin composition with a vapor deposition layer made of aluminum oxide provided over it, and further layered on the vapor deposition layer, a nanocomposite film comprising dispersed polymer microcrystals and a network structure of siloxane bonds stably holding them, wherein the nanocomposite film is formed from a polymer resin and a partial hydrolytic condensate of an alkoxysilane, wherein the proportion of Q1 and Q2 structures of the bonded states of the silicon atoms of the alkoxysilane hydrolytic condensate is at least 60% of the total silicon atoms. 17. A gas barrier film according to claim 16 , wherein the nanocomposite film has a hardness of 1.0 GPa or greater as measured by a nanoindentation method after retort sterilization treatment at 135° C. for 30 minutes. 18. A gas barrier film according to claim 16 , wherein the vapor deposition layer is formed by holding the surface of the plastic base material in a voltage-applied state between a plasma pretreatment roller and plasma supply means for plasma pretreatment, and then continuously forming an inorganic oxide vapor deposition film composed mainly of aluminum oxide. 19. A gas barrier film according to claim 18 , wherein the plasma pretreatment is plasma pretreatment using a roller-type continuous vapor deposition film-forming apparatus comprising, in a continuous manner, a pretreatment chamber in which the surface of a plastic base material to be provided with a vapor deposition film is subjected to plasma treatment, and a film-forming chamber in which the vapor deposition film is formed, the plasma pretreatment being designed such that there are situated a pretreatment roller and plasma supply means and magnetic field-forming means facing the pretreatment roller, the supplied plasma source gas is introduced as plasma near the base material surface, with a gap being formed that traps the plasma, and the plasma treatment is carried out while holding in a voltage-applied state between the plasma pretreatment roller and the plasma supply means. 20. An adhesiveness-reinforced and moist heat-resistant gas barrier film according to claim 18 , wherein the pretreatment by plasma is treatment in which the surface of the plastic base material on which the vapor deposition film is to be provided is treatment using a roller-type continuous vapor deposition film-forming apparatus having a separated plasma pretreatment chamber and vapor deposition film-forming chamber, under conditions with a plasma strength per unit area of 100-8000 W sec/m 2 . 21. A gas barrier film according to claim 16 , having Al—C covalent bonds at the interface between the plastic base material and the inorganic oxide vapor deposition film composed mainly of aluminum oxide. 22. A method for producing a gas barrier film according to claim 16 , wherein a vapor deposition layer comprising aluminum oxide is formed on a base material comprising a polymer resin composition, and a solution in which a partial hydrolytic condensate of
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