Laser dicing glass wafers using advanced laser sources
US-2024409449-A1 · Dec 12, 2024 · US
US10029940B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-10029940-B1 |
| Application number | US-201514614117-A |
| Country | US |
| Kind code | B1 |
| Filing date | Feb 4, 2015 |
| Priority date | Feb 4, 2014 |
| Publication date | Jul 24, 2018 |
| Grant date | Jul 24, 2018 |
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The roughness of a separation surface formed along a process path along which a plurality of laser-induced channels is formed in a substrate can be controlled through process parameters. Laser pulse power can be varied to vary the resulting roughness. Higher laser pulse power can form larger laser-induced channels, enabling larger inter-channel spacing and/or higher roughness in applications where it is desired. Lower laser pulse power can be employed to achieve smoother separation surfaces when desired.
Opening claim text (preview).
The invention claimed is: 1. A method comprising: forming a plurality of laser-induced channels in a substrate along a process path such that the plurality of laser-induced channels extend between a first surface and an opposing second surface of the substrate, at least partially defining a separation surface; separating the substrate into a first portion and a second portion along the process path such that the separation surface of each of the first portion and the second portion has a roughness in a range from 0.6 to 3.7 micron Ra; and controlling the roughness of the separation surfaces by adjusting a process parameter, the process parameter including at least one of a size of a diameter of the laser-induced channels or a spacing between adjacent laser-induced channels. 2. The method of claim 1 , wherein forming the plurality of laser-induced channels in the substrate along the process path includes delivering a pulse of laser light to the substrate at an intended laser-induced channel location, and wherein controlling the roughness of the separation surfaces by adjusting the process parameter includes adjusting an amount of available energy in the pulse of laser light. 3. The method of claim 1 , wherein controlling the roughness of the separation surfaces by adjusting a process parameter comprises adjusting a speed of a laser spot along the process path. 4. The method of claim 1 , wherein controlling the roughness of the separation surfaces by adjusting a process parameter comprises adjusting a laser pulse frequency. 5. The method of claim 1 , wherein forming the plurality of laser-induced channels in the substrate along the process path includes delivering a pulse of laser light to the substrate at an intended laser-induced channel location, and wherein controlling the roughness of the separation surfaces by adjusting the process parameter includes adjusting a shape of a focal energy distribution in a focal region located to coincide with the substrate. 6. A product, comprising: a substrate having: a first surface; an opposing second surface; and a plurality of laser-induced channels extending between the first surface and the opposing second surface, the plurality of laser-induced channels at least partially defining a separation surface that extends between the first surface and the opposing second surface, wherein each of the plurality of laser-induced channels at least one of has a target diameter or is spaced a target distance from adjacent laser-induced channels to provide a roughness of the separation surface upon separation in a range from 0.6 to 3.7 micron Ra. 7. The product of claim 6 , wherein the target diameter of the laser-induced channels is in a range from 1 to 8 microns. 8. The product of claim 6 , wherein the target distance between the adjacent laser-induced channels is in a range from 1 to 40 microns. 9. The product of claim 6 , wherein the substrate is glass. 10. The product of claim 6 , wherein each of the plurality of laser-induced channels has the target diameter and is spaced the target distance. 11. A product, comprising: a substrate having: a first surface; an opposing second surface; and a plurality of laser-induced channels extending between the first surface and the opposing second surface, the plurality of laser-induced channels at least partially defining a separation surface that extends between the first surface and the opposing second surface, wherein a roughness of the separation surface upon separation is a function of at least one of the size of the diameter of the laser-induced channels or the spacing between adjacent laser-induced channels such that the roughness of the separation surface is in a range from 0.6 to 3.7 micron Ra, and wherein at least one of (i) the diameter of the laser-induced channels is in a range from 1 to 8 microns or (ii) the spacing between the adjacent laser-induced channels is between 1 and 40 microns.
Scoring using a focussed radiation beam, e.g. laser · CPC title
for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks · CPC title
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