Micromechanical component including a diffusion stop channel

US10029911B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10029911-B2
Application numberUS-201715401808-A
CountryUS
Kind codeB2
Filing dateJan 9, 2017
Priority dateJan 16, 2016
Publication dateJul 24, 2018
Grant dateJul 24, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for manufacturing a micromechanical component is provided including a substrate and including a cap, which is connected to the substrate and, together with the substrate, encloses a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity, the cap together with the substrate enclosing a second cavity, a second pressure prevailing and a second gas mixture having a second chemical composition being enclosed in the second cavity. A recess situated essentially between the first cavity and the second cavity is formed for diverting at least one first particle type of the first gas mixture and/or at least one second particle type of the second gas mixture.

First claim

Opening claim text (preview).

What is claimed is: 1. A micromechanical component, comprising: a substrate; and a cap connected to the substrate, the cap, together with the substrate, enclosing a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity, the cap, together with the substrate enclosing a second cavity, a second pressure prevailing and a second gas mixture having a second chemical composition being enclosed in the second cavity, the substrate or the cap including a sealed access opening; wherein the micromechanical component includes a recess situated between the first cavity and the second cavity for diverting at least one of: i) at least one first particle type of the first gas mixture, and ii) at least one second particle type of the second gas mixture, wherein the recess is situated at least partially in a bond layer, which is situated between the substrate and the cap, wherein the recess is formed as a slit-shaped break in the bond connection. 2. The micromechanical component as recited in claim 1 , wherein the recess is situated at least partially in a layer, which is situated between the substrate and the cap. 3. The micromechanical component as recited in claims 2 , wherein the recess is situated at least partially in an additional layer, which is situated between the substrate and the cap. 4. The micromechanical component as recited in claims 1 , wherein the recess is situated at least partially in at least one of the substrate and the cap.

Assignees

Inventors

Classifications

  • of static structures · CPC title

  • B81B7/0041Primary

    maintaining a controlled atmosphere with techniques not provided for in B81B7/0038 · CPC title

  • Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration · CPC title

  • Packages · CPC title

  • maintaining a controlled atmosphere with processes not provided for in B81C1/00285 · CPC title

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Frequently asked questions

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What does patent US10029911B2 cover?
A method for manufacturing a micromechanical component is provided including a substrate and including a cap, which is connected to the substrate and, together with the substrate, encloses a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity, the cap together with the substrate enclosing a second cavity, a sec…
Who is the assignee on this patent?
Bosch Gmbh Robert
What technology area does this patent fall under?
Primary CPC classification B81B7/0041. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 24 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).