Micromechanical sensor unit and method for manufacturing micromechanical sensor units
US-2015123217-A1 · May 7, 2015 · US
US10029911B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10029911-B2 |
| Application number | US-201715401808-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 9, 2017 |
| Priority date | Jan 16, 2016 |
| Publication date | Jul 24, 2018 |
| Grant date | Jul 24, 2018 |
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A method for manufacturing a micromechanical component is provided including a substrate and including a cap, which is connected to the substrate and, together with the substrate, encloses a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity, the cap together with the substrate enclosing a second cavity, a second pressure prevailing and a second gas mixture having a second chemical composition being enclosed in the second cavity. A recess situated essentially between the first cavity and the second cavity is formed for diverting at least one first particle type of the first gas mixture and/or at least one second particle type of the second gas mixture.
Opening claim text (preview).
What is claimed is: 1. A micromechanical component, comprising: a substrate; and a cap connected to the substrate, the cap, together with the substrate, enclosing a first cavity, a first pressure prevailing and a first gas mixture having a first chemical composition being enclosed in the first cavity, the cap, together with the substrate enclosing a second cavity, a second pressure prevailing and a second gas mixture having a second chemical composition being enclosed in the second cavity, the substrate or the cap including a sealed access opening; wherein the micromechanical component includes a recess situated between the first cavity and the second cavity for diverting at least one of: i) at least one first particle type of the first gas mixture, and ii) at least one second particle type of the second gas mixture, wherein the recess is situated at least partially in a bond layer, which is situated between the substrate and the cap, wherein the recess is formed as a slit-shaped break in the bond connection. 2. The micromechanical component as recited in claim 1 , wherein the recess is situated at least partially in a layer, which is situated between the substrate and the cap. 3. The micromechanical component as recited in claims 2 , wherein the recess is situated at least partially in an additional layer, which is situated between the substrate and the cap. 4. The micromechanical component as recited in claims 1 , wherein the recess is situated at least partially in at least one of the substrate and the cap.
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