License plate validation

US10029650B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10029650-B2
Application numberUS-201715681171-A
CountryUS
Kind codeB2
Filing dateAug 18, 2017
Priority dateApr 7, 2015
Publication dateJul 24, 2018
Grant dateJul 24, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A license plate validation system for a vehicle is disclosed. This license plate validation system includes: a radio frequency identification (RFID) reader located inside the vehicle and configured to read from an RFID-enabled license plate on the vehicle upon detecting an attempt to start the vehicle; and a microcontroller coupled to the RFID reader and configured to receive, from the RFID reader, information obtained from the RFID-enabled license plate and subsequently determine, based at least on the received information, whether the vehicle is properly registered. In some embodiments, the microcontroller and the RFID reader are integrated as a single electronic module.

First claim

Opening claim text (preview).

What is claimed is: 1. A radio frequency identification (RFID)-enabled license plate, comprising: a metal plate comprising a first cutout portion defining a first hole in the metal plate and a second cutout portion defining a second hole in the metal plate; and a RFID assembly integrated with the metal plate and positioned across the first hole defined by the first cutout portion, the RFID assembly comprising a RFID chip and an antenna, wherein the RFID assembly further comprises: a front cover attached to a first side of the metal plate and covering the first hole defined by the first cutout portion; and a back cover attached to a second side of the metal plate opposite to the front cover and covering the first hole defined by the first cutout portion such that the first cutout portion is positioned between the front cover and the back cover; wherein the RFID chip is sandwiched between the front cover and the back cover; and further wherein dimensions, spacing and locations of the first cutout portion and the second cutout portion are configured such that a slot antenna is formed from the metal plate, the first cutout portion, the second cutout portion and the RFID assembly and the slot antenna resonates at multiple frequencies. 2. The RFID-enabled license plate of claim 1 , wherein the multiple frequencies include a high frequency (HF) band and an ultra-high frequency (UHF) band. 3. The RFID-enabled license plate of claim 1 , wherein the first cutout portion and the second cutout portion are filled with a non-metal material. 4. The RFID-enabled license plate of claim 3 , wherein the non-metal material is flush with respect to both a front surface of the metal plate and a back surface of the metal plate. 5. The RFID-enabled license plate of claim 1 , wherein the RFID chip is affixed to the at least one of the front cover and the back cover using at least one of adhesives and very high bond (VHB). 6. The RFID-enabled license plate of claim 1 , wherein the antenna of the RFID assembly is inductively coupled with the metal plate. 7. The RFID-enabled license plate of claim 1 , wherein the front cover is affixed to the first side of the metal plate using a first set of adhesives which follow a perimeter of the front cover; wherein the back cover is affixed to the second side of the metal plate using a second set of adhesives which follow a perimeter of the back cover, and wherein the first and second sets of adhesives seal off spaces between the front cover and the first side of the metal plate and between the back cover and the second side of the metal plate. 8. The RFID-enabled license plate of claim 7 , wherein the first and second sets of adhesives include VHBs. 9. The RFID-enabled license plate of claim 1 , wherein the antenna comprises an antenna loop electrically coupled to the RFID chip, and the RFID chip and the antenna loop are disposed on a substrate. 10. The RFID-enabled license plate of claim 9 , wherein the RFID assembly further comprises a protective film layer which is attached to the substrate to form a weather-proof enclosure for the RFID chip and the antenna loop. 11. The RFID-enabled license plate of claim 9 , wherein the RFID assembly further comprises at least one tear guide. 12. A radio frequency identification (RFID) assembly, comprising: a radio frequency identification (RFID) chip and an antenna which is electrically coupled to the RFID chip, wherein the RFID chip and the antenna are disposed on a substrate, the substrate comprising a first cutout portion defining a first hole in the substrate and a second cutout portion defining a second hole in the substrate; a front cover attached to a first side of the substrate and covering the first hole defined by the first cutout portion; and a back cover attached to a second side of the substrate opposite to the front cover and covering the first hole defined by the first cutout portion such that the first cutout portion is positioned between the front cover and the back cover, wherein the RFID chip is sandwiched between the front cover and the back cover and is affixed to at least one of the front cover and the back cover, and further wherein dimensions, spacing and locations of the first cutout portion and the second cutout portion are configured such that a slot antenna is formed from the substrate, the first cutout portion, the second cutout portion and the RFID assembly and the slot antenna resonates at multiple frequencies. 13. The RFID assembly of claim 12 , further comprising a protective film layer attached to the substrate to form a weather-proof enclosure for the RFID chip and the antenna. 14. The RFID assembly of claim 13 , wherein the protective film layer comprises polyethylene terephthalate (PET). 15. The RFID assembly of claim 13 , wherein the protective film layer is welded to the substrate around the perimeter of substrate. 16. The RFID assembly of claim 15 , wherein the protective film layer is welded to the substrate using one of the following: laser welding and sonic welding. 17. The RFID assembly of claim 12 , wherein one of the front cover and the back cover includes a heat stake. 18. The RFID assembly of claim 17 , wherein the RFID chip is attached to the one of the front cover and the back cover using the heat stake. 19. The RFID assembly of claim 18 , wherein the other of the front cover and the back cover includes an energy director. 20. The RFID assembly of claim 19 , wherein the RFID chip is attached to the other of the front cover and the back cover at the energy director.

Assignees

Inventors

Classifications

  • Special arrangements for circuits, e.g. for protecting identification code in memory (protection against unauthorised use of computer memory G06F12/14) · CPC title

  • Physical layout of the record carrier · CPC title

  • Antenna details (antennas for wireless devices, e.g. RFID tags, in general H01Q1/22) · CPC title

  • B60R25/24Primary

    using electronic identifiers containing a code not memorised by the user · CPC title

  • the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object · CPC title

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Frequently asked questions

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What does patent US10029650B2 cover?
A license plate validation system for a vehicle is disclosed. This license plate validation system includes: a radio frequency identification (RFID) reader located inside the vehicle and configured to read from an RFID-enabled license plate on the vehicle upon detecting an attempt to start the vehicle; and a microcontroller coupled to the RFID reader and configured to receive, from the RFID rea…
Who is the assignee on this patent?
Neology Inc
What technology area does this patent fall under?
Primary CPC classification B60R25/24. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 24 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).