Flux, substrate and manufacturing method, and device
US-2024282737-A1 · Aug 22, 2024 · US
Metal wiring bonding structure and production method therefor
US10029328B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10029328-B2 |
| Application number | US-201715461930-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 17, 2017 |
| Priority date | Mar 29, 2016 |
| Publication date | Jul 24, 2018 |
| Grant date | Jul 24, 2018 |
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Abstract
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A metal wiring bonding structure 100 comprises contacts 753 of connection FPC 75 and heater lands 46 of a sheet heater 30 to be bonded by a solder bonding member 766. A connection FPC 75 includes contact opposed lands 754 formed of metal and disposed at positions respectively opposed to the plurality of contacts 753 on a surface of a support layer 751 opposite from a surface on which metal wires 750 are provided. In addition to base surfaces 461 opposed to the contacts 753, the heater lands 46 respectively include extended surfaces 462 opposed to imaginary extended portions 753b imaginarily extended ahead from the contacts 753. A solder bonding member 756 covers surfaces of the contact opposed lands 754, a distal end surface of the connection FPC 75, and the extended surfaces 462 of the heater lands 46, and is filled in a bonding space C.
First claim
Opening claim text (preview).
What is claimed is: 1. A metal wiring bonding structure including: a first member having a plurality of first metal wires between a first support layer formed of resin and a first covering layer formed of resin, and first contacts serving as end portions of the first metal wires and exposed from the first covering layer; a second member having a plurality of second contacts on a surface of a second support layer formed of resin, the second contacts being respectively disposed op…
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Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Operations & Transport · mapped topic
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Frequently asked questions
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- What does patent US10029328B2 cover?
- A metal wiring bonding structure 100 comprises contacts 753 of connection FPC 75 and heater lands 46 of a sheet heater 30 to be bonded by a solder bonding member 766. A connection FPC 75 includes contact opposed lands 754 formed of metal and disposed at positions respectively opposed to the plurality of contacts 753 on a surface of a support layer 751 opposite from a surface on which metal wire…
- Who is the assignee on this patent?
- Ngk Insulators Ltd
- What technology area does this patent fall under?
- Primary CPC classification H05K3/34. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jul 24 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).