Three dimensional printer

Patent metadata

Field	Value
Publication number	US-10029308-B2
Application number	US-201514804833-A
Country	US
Kind code	B2
Filing date	Jul 21, 2015
Priority date	Sep 5, 2014
Publication date	Jul 24, 2018
Grant date	Jul 24, 2018

Abstract

A lamination molding apparatus which can remove the non-sintered material powder after completion of lamination molding easily and with less time after completion of laminating/molding, is provided. According to embodiments of the present invention, a lamination molding apparatus to conduct lamination molding using a material powder, including: a chamber filled with an inert gas having a predetermined concentration; a molding table provided in the chamber, the molding table being capable of moving vertically; a powder retaining wall surrounding the molding table so as to retain the material powder supplied on the molding table; and a powder discharging section provided on or below the powder retaining wall, the powder discharging section being capable of discharging the material powder, is provided.

First claim

What is claimed is:

1. A lamination molding apparatus to conduct lamination molding using a material powder, comprising:
a base having a molding region;
a chamber, covering the molding region, filled with an inert gas having a predetermined concentration;
a molding table provided in the chamber, the molding table being capable of moving vertically;
a powder retaining wall surrounding the molding table so as to retain the material powder supplied on the molding table;
at least a pair of powder discharging sections, opposing each other across the molding table, provided on or below the powder retaining wall, the powder discharging section being capable of discharging the material powder by its weight, and
an upper wiper disposed on the periphery of the molding table and slidably in contact with the powder retaining wall when the molding table is moved, wherein:
the molding table and the powder retaining wall are not directly in contact with each other.

2. The lamination molding apparatus of claim 1 , further comprising a bucket to receive the material powder discharged from the powder discharging section.

3. The lamination molding apparatus of claim 1 , further comprising a chute to guide the material powder discharged from the powder discharging section to the bucket.

4. The lamination molding apparatus of claim 3 , further comprising a chute guide fixed to the chute to guide the material powder discharged from the powder discharging section to the chute.

5. The lamination molding apparatus of claim 3 , further comprising:
a driving mechanism partition to surround a driving mechanism of the molding table; and
a lower wiper fixed to the chute provided at a position lower than the chute, the lower wiper sliding on the driving mechanism partition during movement of the molding table.

6. The lamination molding apparatus of claim 1 , wherein the powder discharging section is provided below a lower limit of a stroke of the molding table during the lamination molding.

Assignees

• Sodick Co Ltd

Inventors

• Kawada Shuichi
• Muranaka Katsutaka
• Okazaki Shuji

Classifications

• B29C64/205

  Means for applying layers · CPC title

• B29C64/245

  Platforms or substrates (support structures intended to be sacrificed after manufacture B29C64/40) · CPC title

• B29C64/371

  using an environment other than air, e.g. inert gas · CPC title

• B22F12/38

  Housings, e.g. machine housings · CPC title

• B22F10/77

  of gas · CPC title