Suspension board with circuit and producing method thereof

Patent metadata

Field	Value
Publication number	US-10028378-B2
Application number	US-201615373573-A
Country	US
Kind code	B2
Filing date	Dec 9, 2016
Priority date	Dec 11, 2015
Publication date	Jul 17, 2018
Grant date	Jul 17, 2018

Abstract

A suspension board with circuit includes a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider. The base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region, and the thickness of the terminal region is thicker than that of the circumferential region.

First claim

What is claimed is:

1. A suspension board with circuit comprising:
a metal supporting board, a base insulating layer disposed at one side in a thickness direction of the metal supporting board, and a conductor layer disposed at one side in the thickness direction of the base insulating layer and including a connecting terminal electrically connected to a slider, wherein:
the base insulating layer includes a first base insulating layer disposed at the one side in the thickness direction of the metal supporting board and a second base insulating layer covering the first base insulating layer and disposed at the one side in the thickness direction of the metal supporting board,
the base insulating layer has a terminal region, when projected in the thickness direction, overlapped with at least the connecting terminal and a circumferential region not overlapped with the terminal region and around the terminal region,
in an entire region of the base insulating layer, the conductor layer is not located between the first base insulating layer and the second base insulating layer, and
the thickness of the terminal region is thicker than that of the circumferential region.

2. The suspension board with circuit according to claim 1 , wherein
the terminal region includes
a first terminal region-insulating layer made of the first base insulating layer and disposed at the one side in the thickness direction of the metal supporting board and
a second terminal region-insulating layer made of the second base insulating layer and disposed at one side in the thickness direction of the first terminal region-insulating layer; and
the circumferential region includes at least a second circumferential region-insulating layer made of the second base insulating layer and disposed at the one side in the thickness direction of the metal supporting board.

3. The suspension board with circuit according to claim 2 further comprising:
a cover insulating layer covering the conductor layer so as to expose the connecting terminal and disposed at the one side in the thickness direction of the base insulating layer and a pedestal supporting the slider, wherein
the pedestal includes
a first base pedestal layer made of the first base insulating layer and disposed at the one side in the thickness direction of the metal supporting board,
a second base pedestal layer made of the second base insulating layer and disposed at one side in the thickness direction of the first base pedestal layer, and
a cover pedestal layer made of the cover insulating layer and disposed at one side in the thickness direction of the second base pedestal layer.

4. The suspension board with circuit according to claim 1 , wherein
the terminal region includes
a first terminal region-insulating layer made of the first base insulating layer and disposed at the one side in the thickness direction of the metal supporting board and
a second terminal region-insulating layer made of the second base insulating layer and disposed at one side in the thickness direction of the first terminal region-insulating layer; and
the circumferential region includes at least a first circumferential region-insulating layer made of the first base insulating layer and disposed at the one side in the thickness direction of the metal supporting board.

5. The suspension board with circuit according to claim 4 further comprising:
a cover insulating layer covering the conductor layer so as to expose the connecting terminal and disposed at the one side in the thickness direction of the base insulating layer and a pedestal supporting the slider, wherein
the pedestal includes
a first base pedestal layer made of the first base insulating layer and disposed at the one side in the thickness direction of the metal supporting board,
a second base pedestal layer made of the second base insulating layer and disposed at one side in the thickness direction of the first base pedestal layer, and
a cover pedestal layer made of the cover insulating layer and disposed at one side in the thickness direction of the second base pedestal layer.

Assignees

• Nitto Denko Corp

Inventors

• Tanabe Hiroyuki
• Terada Naohiro
• Sugimoto Yuu
• Yamauchi Daisuke

Classifications

• H05K3/4007

  Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465) · CPC title

• G11B5/484

  Integrated arm assemblies, e.g. formed by material deposition or by etching from single piece of metal or by lamination of materials forming a single arm/suspension/head unit · CPC title

• G11B5/4853

  Constructional details of the electrical connection between head and arm · CPC title

• H05K1/111

  Pads for surface mounting, e.g. lay-out · CPC title

• H05K1/05 Primary

  Insulated {conductive substrates, e.g. insulated} metal substrate · CPC title