System and method for an acoustic transducer and environmental sensor package

Patent metadata

Field	Value
Publication number	US-10028052-B2
Application number	US-201715620354-A
Country	US
Kind code	B2
Filing date	Jun 12, 2017
Priority date	Mar 18, 2015
Publication date	Jul 17, 2018
Grant date	Jul 17, 2018

Abstract

According to an embodiment, a transducer package includes a circuit board including a port, a lid disposed over the port, an acoustic transducer disposed over the port and including a membrane, and an environmental transducer disposed at the circuit board in the port. The lid encloses a first region, and the membrane separates the port from the first region. Other embodiments include corresponding systems, apparatus, and structures, each configured to perform the actions or steps of corresponding embodiment methods.

First claim

What is claimed is:

1. A transducer system comprising:
an acoustic transducer in fluid communication with an external port;
a plurality of environmental transducers in fluid communication with the external port;
an analog amplifier coupled to the acoustic transducer;
a first analog to digital converter (ADC);
a multiplexer with a plurality of inputs and an output, wherein the plurality of inputs are respectively coupled to the plurality of environmental transducers and the output is coupled to the first ADC;
a second ADC coupled to the analog amplifier; and
a single reference voltage circuit coupled to the acoustic transducer and the plurality of environmental transducers.

2. The transducer system of claim 1 , wherein the first ADC, the second ADC, the multiplexer, and the single reference voltage circuit are formed on a same integrated circuit.

3. The transducer system of claim 2 , wherein an environmental transducer of the plurality of environmental transducers is formed on the same integrated circuit.

4. The transducer system of claim 1 , further comprising an interface circuit, wherein the interface circuit is configured to output an analog acoustic signal from the analog amplifier and a digital environmental signal from the first ADC.

5. The transducer system of claim 1 , wherein the acoustic transducer comprises a MEMS microphone.

6. The transducer system of claim 1 , wherein each environmental transducer of the plurality of environmental transducers comprises a sensor selected from a group comprising a microfabricated humidity sensor, a microfabricated pressure sensor, a microfabricated temperature sensor, and a microfabricated gas sensor.

7. The transducer system of claim 1 , further comprising a printed circuit board (PCB), wherein
the PCB comprises a port formed in the PCB that is in fluid communication with the external port, and
the acoustic transducer is disposed over the port in the PCB.

8. The transducer system of claim 7 , wherein an environmental transducer of the plurality of environmental transducers is directly attached to the PCB.

9. The transducer system of claim 8 , wherein the environmental transducer of the plurality of environmental transducers is directly attached to the PCB in the port in the PCB.

10. The transducer system of claim 7 , wherein an environmental transducer of the plurality of environmental transducers is integrated in the acoustic transducer.

11. A transducer system comprising:
an acoustic transducer in fluid communication with an external port;
a plurality of environmental transducers in fluid communication with the external port;
an analog amplifier coupled to the acoustic transducer;
a first analog to digital converter (ADC);
a multiplexer with a plurality of inputs and an output, wherein the plurality of inputs are respectively coupled to the plurality of environmental transducers and the output is coupled to the first ADC; and
a printed circuit board (PCB), wherein the PCB comprises a port formed in the PCB that is in fluid communication with the external port, and wherein the acoustic transducer is disposed over the port in the PCB.

12. The transducer system of claim 11 , wherein an environmental transducer of the plurality of environmental transducers is directly attached to the PCB.

13. The transducer system of claim 12 , wherein the environmental transducer of the plurality of environmental transducers is directly attached to the PCB in the port in the PCB.

14. The transducer system of claim 11 , wherein an environmental transducer of the plurality of environmental transducers is integrated in the acoustic transducer.

15. The transducer system of claim 11 , further comprising an interface circuit, wherein the interface circuit is configured to output an analog acoustic signal from the analog amplifier and a digital environmental signal from the first ADC.

16. The transducer system of claim 11 , wherein the acoustic transducer comprises a MEMS microphone.

17. The transducer system of claim 11 , wherein each environmental transducer of the plurality of environmental transducers comprises a sensor selected from a group comprising a microfabricated humidity sensor, a microfabricated pressure sensor, a microfabricated temperature sensor, and a microfabricated gas sensor.

Assignees

• Infineon Technologies Ag

Inventors

• Kopetz Andreas
• Wiesbauer Andreas
• Helm Roland
• Mandl Christian
• Walther Arnaud

Classifications

• H04R19/04

  Microphones (H04R19/01 takes precedence) · CPC title

• G01L1/16

  using properties of piezoelectric devices · CPC title

• G01N27/04

  by investigating resistance · CPC title

• G01N27/12

  of a solid body in dependence upon absorption of a fluid; of a solid body in dependence upon reaction with a fluid {, for detecting components in the fluid} · CPC title

• H04R19/005 Primary

  using semiconductor materials · CPC title