Integration of wireless charging coil to a chassis

Patent metadata

Field	Value
Publication number	US-10027160-B2
Application number	US-201615081341-A
Country	US
Kind code	B2
Filing date	Mar 25, 2016
Priority date	Mar 25, 2016
Publication date	Jul 17, 2018
Grant date	Jul 17, 2018

Abstract

A method is provided for forming a wireless charging electronic device. An embodiment of the method includes integrating a coil and a collector plate to a chassis of the electronic device to wirelessly charge the electronic device.

First claim

What is claimed is:

1. A method of forming a wireless charging device, the method comprising:
providing a coil for wireless charging;
providing a collector plate; and
injection molding the coil and the collector plate to a chassis of the wireless charging device to form an integrated chassis.

2. The method of claim 1 , wherein the providing a coil includes stamping the coil.

3. The method of claim 1 , wherein the providing a collector plate includes stamping the collector plate.

4. The method of claim 1 , wherein the injection molding the coil and the collector plate includes inserting molding of the coil and the collector plate to the chassis of the wireless charging device.

5. The method of claim 4 , wherein the inserting molding of the coil and the collector plate to the chassis includes:
attaching the coil to a structural carrier to form a structural assembly; and
insert molding the structural assembly to the chassis to form an injection molded housing.

6. The method of claim 5 , wherein the inserting molding of the coil and the collector plate to the chassis further includes:
attaching the collector plate to the injection molded housing.

7. The method of claim 1 , wherein the injection molding the coil and the collector plate includes:
attaching the coil and the collector plate to the chassis to form a single structural assembly; and
insert molding the single structural assembly to the chassis.

8. The method of claim 1 , further comprising providing a ferrite layer on the coil.

9. The method of claim 1 , further comprising providing a controller board on the chassis.

10. The method of claim 9 , wherein the controller board is provided on the collector plate such that the collector plate is between the chassis and the controller board.

11. A method of forming a wireless charging device, the method comprising;
providing a chassis of the wireless charging device;
providing an electro-less plating of a coil to the chassis; and
providing an electro-plating of the coil to the chassis to integrate the coil to the chassis and provide an integrated chassis.

12. The method of claim 11 , further comprising:
providing an electro-less plating of a collector plate to the chassis; and
providing electro-plating of the collector plate to the chassis to integrate the collector plate to the integrated chassis.

13. The method of claim 11 , further comprising providing mask areas on the chassis.

14. The method of claim 13 , wherein the mask areas are provided on an inner surface of the chassis.

15. An electronic device to provide wireless charging, the electronic device comprising:
a chassis having a power receiving unit to wirelessly receive power, the power receiving unit including a charging coil and a collector plate integrated into the chassis;
wherein the power receiving unit includes a controller board disposed on the collector plate.

16. The electronic device of claim 15 , wherein the collector plate is substantially planar with the charging coil.

17. The electronic device of claim 15 , wherein the power receiving unit is directly insert molded into the chassis.

18. An electronic device to provide wireless charging, the electronic device comprising:
a chassis having a power receiving unit to wirelessly receive power, the power receiving unit including a charging coil and a collector plate integrated into the chassis;
wherein the chassis has a first surface that defines a first plane and a second surface that defines a second plane, wherein the coil is provided at the chassis between the first plane and the second plane, and wherein the collector plate is provided between the first plane and the second plane.

19. The electronic device of claim 18 , wherein the power receiving unit includes a ferrite layer, wherein the ferrite layer is provided between the coil and the first plane of the chassis, and wherein an insulating layer is provided between the coil and the ferrite layer.

Assignees

• Intel Corp

Inventors

• Miele Ralph V
• Payne David G
• Courtney Brandon
• Simpson Isaac A
• Larson Andrew
• Pidwerbecki David
• Chewning Patrick

Classifications

• H02J50/70

  involving the reduction of electric, magnetic or electromagnetic leakage fields · CPC title

• H02J50/005

  Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices · CPC title

• H02J7/70

  characterised by the mechanical construction · CPC title

• H02J50/10

  using inductive coupling · CPC title

• H01F41/005

  Impregnating or encapsulating (insulating of windings H01F41/12) · CPC title