Semiconductor device and power module

Patent metadata

Field	Value
Publication number	US-10026673-B2
Application number	US-201515522972-A
Country	US
Kind code	B2
Filing date	Nov 20, 2015
Priority date	Nov 21, 2014
Publication date	Jul 17, 2018
Grant date	Jul 17, 2018

Abstract

A semiconductor device of a double-side cooling structure having a bus bar electrically connected, and coolers independently arranged on both sides of the semiconductor device for cooling is provided. The semiconductor device includes: a semiconductor chip including an element, and has a first main surface and a second main surface; a sealing resin body having a first surface and a second surface and also having a side surface; a first heatsink arranged facing the first main surface and electrically connected to the first main electrode; and a second heatsink arranged facing the second main surface and electrically connected to the second main electrode. The first heatsink is exposed only to the first surface. The second heatsink is exposed only to the second surface. An exposed surface of a heatsink to be electrically connected to the bus bar has a heat dissipation region, and an electrical connection region.

First claim

The invention claimed is:

1. A semiconductor device of a double-side cooling structure having a bus bar electrically connected as an electrical relay member, and coolers independently arranged on both sides of the semiconductor device for cooling, the semiconductor device comprising:
a semiconductor chip that includes an element, and has a first main surface on which a first main electrode of the element is arranged and a second main surface on which a second main electrode of the element is arranged, the second main surface being opposite to the first main surface;
a sealing resin body that has a first surface facing the first main surface of the semiconductor chip and a second surface facing the second main surface of the semiconductor chip in a thickness direction of the semiconductor chip and also has a side surface connecting between the first surface and the second surface, the sealing resin body being configured to seal the semiconductor chip;
a first heatsink that is arranged facing the first main surface of the semiconductor chip and electrically connected to the first main electrode; and
a second heatsink that is arranged facing the second main surface of the semiconductor chip and electrically connected to the second main electrode,
wherein:
the first heatsink is exposed only to the first surface of the sealing resin body, of the first surface, the second surface, and the side surface of the sealing resin body, to have a first exposed surface opposite to a surface facing the semiconductor chip;
the second heatsink is exposed only to the second surface of the sealing resin body, of the first surface, the second surface, and the side surface of the sealing resin body, to have a second exposed surface opposite to a surface facing the semiconductor chip, the second exposed surface being exposed from the second surface;
one or both of the first exposed surface and the second exposed surface is electrically connected to the bus bar;
one or both of the first exposed surface and the second exposed surface includes a heat dissipation region and an electrical connection region;
the heat dissipation region overlaps with the semiconductor chip as seen in projection view from the thickness direction and is thermally connected with the coolers; and
the electrical connection region is a peripheral region around the heat dissipation region and is electrically connected with the bus bar.

2. The semiconductor device according to claim 1 , wherein:
both the first exposed surface and the second exposed surface are electrically connected to the bus bar, and
the semiconductor device further comprises a spacer that is interposed between the first heatsink and the second heatsink in correspondence with the electrical connection regions, the spacer being configured to electrically separate the first heatsink and the second heatsink while being connected to each of the heatsinks.

3. A power module comprising:
the semiconductor device according to claim 1 ;
coolers that are independently arranged on the heat dissipation region of the first exposed surface and the second exposed surface, and configured to cool the semiconductor device;
a first bus bar that is connected to the electrical connection region of the first exposed surface;
a second bus bar that is connected to the electrical connection region of the second exposed surface; and
insulating plates that are independently interposed between the heat dissipation region of the first exposed surface and the second exposed surface and each of the coolers, and configured to transmit heat of the semiconductor device to the coolers and to electrically separate the semiconductor device and the coolers from each other,
wherein:
the insulating plates have extended parts extending more outward than clearances between the heat dissipation regions and the coolers to separate the heat dissipation regions and the electrical connection regions from each other.

4. The semiconductor device according to claim 1 , wherein:
the heat dissipation region and the electrical connection region are arranged flush with each other.

5. The semiconductor device according to claim 1 , wherein:
the heat dissipation region and the electrical connection region are arranged on an identical height in the thickness direction of the first heastsink and the second heatsink.

6. The semiconductor device according to claim 1 , wherein:
the heat dissipation region and the electrical connection region are separated from each other by the sealing resin body.

7. The semiconductor device according to claim 6 , wherein:
at least one of the first heatsink and the second heatsink has a groove provided between the heat dissipation region and the electrical connection region; and
the sealing resin body is arranged in the groove to separate the heat dissipation region and the electrical connection region from each other.

8. The semiconductor device according to claim 1 , wherein:
both the first exposed surface and the second exposed surface are electrically connected to the bus bar, and
the electrical connection region of the first heatsink and the electrical connection region of the second heatsink are in a positional relation of overlapping each other as seen in projection view from the thickness direction.

9. A power module comprising:
the semiconductor device according to claim 8 ;
coolers that are independently arranged on the heat dissipation region of the first exposed surface and the second exposed surface and configured to cool the semiconductor device;
a first bus bar that is connected to the electrical connection region of the first exposed surface; and
a second bus bar that is connected to the electrical connection region of the second exposed surface,
wherein:
the first bus bar and the second bus bar extend more outward than the semiconductor device in a single direction orthogonal to the thickness direction, and are in a positional relation of overlapping each other as seen in projection view from the thickness direction.

10. The power module according to claim 9 , wherein:
at least one of the first bus bar and the second bus bar has a bent part provided more outward than the semiconductor device; and
a clearance between the first bus bar and the second bus bar facing each other is narrower than a position overlapping with the semiconductor device, on an outside of the semiconductor device.

Assignees

• Denso Corp

Inventors

• Okumura Tomomi

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/755

  between a chip and a laterally-adjacent insulating package substrate, interpose or RDL · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/111

  the semiconductor body being completely enclosed · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title