Device comprising an encapsulation unit

Patent metadata

Field	Value
Publication number	US-10026625-B2
Application number	US-201414150291-A
Country	US
Kind code	B2
Filing date	Jan 8, 2014
Priority date	Jan 30, 2008
Publication date	Jul 17, 2018
Grant date	Jul 17, 2018

Abstract

A device that includes a component and an encapsulation arrangement for the encapsulation of the component with respect to moisture and/or oxygen, wherein the encapsulation arrangement has a first layer and thereabove a second layer on at least one surface of the component, the first layer and the second layer each comprise an inorganic material, and the second layer is arranged directly on the first layer.

First claim

What is claimed is:

1. A device comprising:
a component; and
an encapsulation arrangement for the encapsulation of the component with respect to moisture and/or oxygen;
wherein the encapsulation arrangement has a first layer and thereabove a second layer on a third layer on at least one surface of the component;
wherein the first layer, the second layer and the third layer each comprise an inorganic material;
wherein the first layer is arranged directly on the third layer;
wherein the second layer is arranged directly on the first layer; and
wherein a protective layer made of plastics is arranged on the second layer and has a thickness of greater than or at least 10 micrometers.

2. A device comprising:
a component; and
an encapsulation arrangement for the encapsulation of the component with respect to moisture and/or oxygen;
wherein the encapsulation arrangement has a first layer and thereabove a second layer on a third layer on at least one surface of the component;
wherein the third layer is arranged directly on the component;
wherein the first layer is arranged directly on the third layer;
wherein the second layer is arranged directly on the first layer;
wherein the first layer and the second layer each comprise an inorganic material;
wherein the third layer comprises an amorphous inorganic material; and
wherein a protective layer made of plastics is arranged on the second layer and has a thickness of greater than or at least 10 micrometers.

3. The device as claimed in claim 2 , wherein the second layer and the third layer are embodied identically.

4. A device comprising:
a component; and
an encapsulation arrangement for the encapsulation of the component with respect to moisture and/or oxygen;
wherein the encapsulation arrangement has a first layer and thereabove a second layer on a third layer on at least one surface of the component;
wherein the first layer, the second layer and the third layer each comprise an inorganic material;
wherein the second layer is arranged directly on the first layer and the first layer is arranged directly on the third layer;
wherein a protective layer made of plastics is arranged on the second layer and has a thickness of greater than or at least 10 micrometers; and wherein the encapsulation arrangement is hermetically impermeable at a temperature of greater than or equal to 60° C. and at a relative air humidity of greater than or equal to 85% for longer than 500 hours.

5. The device as claimed in any of claims 1 , 2 and 4 , wherein the protective layer has a thickness of less than 100 micrometers.

6. The device as claimed in any of claims 1 , 2 and 4 , wherein the protective layer is embodied as a spray coating.

7. The device as claimed in any of claims 1 , 2 and 4 , wherein the protective layer comprises a material which is incompatible with the component.

8. The device as claimed in any of claims 1 , 2 , and 4 , wherein the second layer has a thickness having a thickness variation which is independent of a surface structure and/or a volume structure of the first layer.

9. The device as claimed in claim 8 , wherein the thickness variation is less than or equal to 10%.

10. The device as claimed in any of claims 1 , 2 and 4 , wherein the encapsulation arrangement has a plurality of first layers and a plurality of second layers, and the first and second layers are applied alternately one above another.

11. The device as claimed in any of claims 1 , 2 and 4 , wherein the encapsulation arrangement completely encloses the component.

12. The device as claimed in any of claims 1 , 2 and 4 , wherein the device has a plurality of encapsulation arrangements arranged on different surfaces of the component.

13. The device as claimed in any of claims 1 , 2 and 4 , wherein the component comprises a substrate, and the encapsulation arrangement is applied directly on the substrate.

14. The device as claimed in any of claims 1 , 2 and 4 , wherein the component has a covering on a substrate, and the encapsulation arrangement is arranged between the covering and the substrate.

15. The device as claimed in claim 14 , wherein a connecting material is arranged between the covering and the substrate, and the encapsulation arrangement encapsulates an interface between the substrate and the connecting material and/or between the covering and the connecting material.

16. The device as claimed in any of claims 1 , 2 and 4 , wherein the first layer comprises silicon nitride, the second and third layer each comprise at least one of aluminum oxide and titanium oxide, and the first layer comprises a layer sequence of at least two layers comprising different materials.

17. The device of claim 16 , wherein the protective layer comprises an UV-curable acrylate.

18. The device of claim 16 , wherein each of the layers of the first layer has a thickness of greater than or equal to 50 nanometers and the first layer has a thickness of less than or equal to 2 micrometers.

19. A device with a component on a substrate and an encapsulation arrangement for the encapsulation of the component, wherein the component has at least one element or partial region which is sensitive to moisture and/or oxygen, comprising at least one first layer on at least one surface of the component and thereabove at least one second layer on a third layer on at least one surface of the component,
wherein the second layer is arranged directly on the first layer and the first layer is arranged directly on the third layer,
wherein the first layer has a layer sequence composed of at least two layers comprising different materials, each of the layers of the layer sequence of the first layer having a thickness of greater than or equal to 100 nanometers,
wherein the encapsulation arrangement comprises at least one layer having a thickness of greater than 10 micrometers and being formed of an epoxy resin and being transparent,
wherein a covering in the form of a glass film or glass plate is arranged above the substrate so that the encapsulation arrangement is arranged between the covering and the substrate,
wherein the substrate comprises a laminate with more than one plastic films,
wherein the component comprises an organic light emitting diode with a functional layer sequence on the substrate, the functional layer sequence comprising an active region for generating electromagnetic radiation during operation of the device,
wherein the encapsulation arrangement is at least partly transparent to the electromagnetic radiation emitted during operation,
wherein the component is embodied as a display with an active luminous area of more than one square decimeter.

Assignees

• Schmid Christian
• Schlenker Tilman
• Zull Heribert
• Paetzold Ralph
• Klein Markus
• Heuser Karsten
• Osram Oled Gmbh

Inventors

• Schmid Christian
• Schlenker Tilman
• Zull Heribert
• Paetzold Ralph
• Klein Markus
• Heuser Karsten

Classifications

• H10P14/6342

  Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating · CPC title

• H10P14/6336

  in the presence of a plasma [PECVD] · CPC title

• H10W74/121

  by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation · CPC title

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title