Multilayer capacitor and board having the same mounted thereon

Patent metadata

Field	Value
Publication number	US-10026558-B1
Application number	US-201815879100-A
Country	US
Kind code	B1
Filing date	Jan 24, 2018
Priority date	Apr 11, 2017
Publication date	Jul 17, 2018
Grant date	Jul 17, 2018

Abstract

A multilayer capacitor includes a capacitor body including a dielectric layer and a first internal electrode and a second internal electrode; a first via electrode exposed through first and second surfaces of the capacitor body, connected to the first internal electrode and spaced apart from the second internal electrode, a second via electrode exposed through the first and second surfaces of the capacitor body, and connected to the second internal electrode and spaced apart from the first internal electrode, a first and second external electrodes disposed on the first surface of the capacitor body to be spaced apart from each other, and connected to the first and the second via electrodes, respectively, and first and second covers disposed in sequence from a bottom in the second surface of the capacitor body, wherein the first and second cover are formed of different materials.

First claim

What is claimed is:

1. A multilayer capacitor, comprising: a capacitor body including a dielectric layer, a first internal electrode and a second internal electrode alternately disposed with the dielectric layer interposed therebetween, the capacitor body having a first surface and a second surface opposing each other, a third surface and a fourth surface opposing each other and each connected to the first surface and the second surface, and a fifth surface and a sixth surface opposing each other and each connected to the first surface, and the second surface, the third surface and the fourth surface; a first via electrode passing through the first internal electrode and the second internal electrode and exposed through the first surface and the second surface of the capacitor body, the first via electrode being connected to the first internal electrode and being spaced apart from the second internal electrode; a second via electrode passing through the first internal electrode and the second internal electrode and exposed through the first surface and the second surface of the capacitor body, the second via electrode being connected to the second internal electrode and being spaced apart from the first internal electrode; a first external electrode and a second external electrode disposed on the first surface of the capacitor body to be spaced apart from each other and connected to the first via electrode and the second via electrode, respectively; and a first cover and a second cover disposed in sequence from a bottom on the second surface of the capacitor body, wherein the first cover and the second cover are formed of different materials.

2. The multilayer capacitor of claim 1 , wherein the first cover is formed of a ceramic or a dielectric, and the second cover is formed of resin.

3. The multilayer capacitor of claim 2 , wherein the second cover is formed of epoxy resin.

4. The multilayer capacitor of claim 1 , wherein the dielectric layer has a first via through-hole and a second via through-hole formed to allow the first via electrode and the second via electrode to pass therethrough,
the first internal electrode includes a first via hole formed in a position corresponding to the first via through-hole and having a size corresponding to the first via through-hole, and a first via spacing hole formed in a position corresponding to the second via through-hole and formed to be larger than the second via through-hole, and
the second internal electrode includes a second via hole formed in a position corresponding to the second via through-hole and having a size corresponding to the second via through-hole, and a second via spacing hole formed in a position corresponding to the first via through-hole and formed to be larger than the first via through-hole.

5. The multilayer capacitor of claim 1 , wherein the first internal electrode and the second internal electrode are exposed through the third surface and the fourth surface of the capacitor body, respectively,
the multilayer capacitor further comprises a third external electrode and a fourth external electrode disposed on the third surface and the fourth surface of the capacitor body, respectively, and
the third external electrode and the fourth external electrode are connected to the first external electrode and the second external electrode, respectively.

6. The multilayer capacitor of claim 1 , wherein the first internal electrode and the second internal electrode are exposed through the third surface and the fourth surface of the capacitor body, respectively, and
the first external electrode and the second external electrode are extended onto the third surface and the fourth surface of the capacitor body, respectively.

7. The multilayer capacitor of claim 1 , wherein ends of the first via electrode and the second via electrode are in contact with the first cover.

8. The multilayer capacitor of claim 1 , wherein a thickness of the first cover is in a range from 9 μm to 15 μm, and a thickness of the second cover is in a range from 1 μm to 3 μm.

9. A board having a multilayer capacitor mounted thereon, comprising:
a board having a first electrode pad and a second electrode pad disposed to be spaced apart from each other; and
the multilayer capacitor according to claim 1 mounted on the board as a first external electrode and a second external electrode are connected to the first electrode pad and the second electrode pad, respectively.

10. The board of claim 9 , wherein the first cover is formed of a ceramic or a dielectric, and the second cover is formed of resin.

11. The board of claim 10 , wherein the second cover is formed of epoxy resin.

12. The board of claim 9 , wherein the dielectric layer has a first via through-hole and a second via through-hole formed to allow the first via electrode and the second via electrode to pass therethrough,
the first internal electrode includes a first via hole formed in a position corresponding to the first via through-hole and having a size corresponding to the first via through-hole, and a first via spacing hole formed in a position corresponding to the second via through-hole and formed to be larger than the second via through-hole, and
the second internal electrode includes a second via hole formed in a position corresponding to the second via through-hole and having a size corresponding to the second via through-hole, and a second via spacing hole formed in a position corresponding to the first via through-hole and formed to be larger than the first via through-hole.

13. The board of claim 9 , wherein the first internal electrode and the second internal electrode are exposed through the third surface and the fourth surface of the capacitor body, respectively,
the multilayer capacitor further comprises a third external electrode and a fourth external electrode disposed on the third surface and the fourth surface of the capacitor body, respectively, and
the third external electrode and the fourth external electrode are connected to the first external electrode and the second external electrode, respectively.

14. The board of claim 9 , wherein the first internal electrode and the second internal electrode are exposed through the third surface and the fourth surface of the capacitor body, respectively, and
the first external electrode and the second external electrode are extended onto the third surface and the fourth surface of the capacitor body, respectively.

15. The board of claim 9 , wherein ends of the first via electrode and the second via electrode are in contact with the first cover.

16. The board of claim 9 , wherein a thickness of the first cover is in a range from 9 μm to 15 μm, and a thickness of the second cover is in a range from 1 μm to 3 μm.

Assignees

• Samsung Electro Mech

Inventors

• LEE Hyo Youn
• Lee Taek Jung
• Lee Won Young
• An Sung Kwon
• Joo Jin Kyung
• Jung Jin Man

Classifications

• H01G4/242 Primary

  the capacitive element surrounding the terminal · CPC title

• H05K2201/10015

  Non-printed capacitor · CPC title

• H01G4/224

  Housing; Encapsulation · CPC title

• H01G2/065

  for surface mounting, e.g. chip capacitors · CPC title

• H05K2201/10636

  Leadless chip, e.g. chip capacitor or resistor · CPC title