Optical fiber alignment device

Patent metadata

Field	Value
Publication number	US-10025045-B2
Application number	US-201715467061-A
Country	US
Kind code	B2
Filing date	Mar 23, 2017
Priority date	Jan 12, 2016
Publication date	Jul 17, 2018
Grant date	Jul 17, 2018

Abstract

A fiber alignment or “fiberposer” device enables the passive alignment of one or more optical fibers to a photonic integrated circuit (PIC) device using mating hard-stop features etched into the two devices. Accordingly, fiber grooves can be provide separate from the electrical and optical elements, and attached to the PIC with sub-micron accuracy. Fiberposers may also include a hermetic seal for a laser or other device on the PIC. All of these features significantly reduce the typical cost of an actively aligned optical device sealed in an hermetic package.

First claim

We claim:

1. A photonic integrated chip (PIC) assembly comprising:
a PIC, including:
a substrate;
an electronic or opto-electronic component mounted on the substrate;
an optical waveguide mounted on the substrate; and
first alignment features comprising openings in the PIC, down to a waveguide layer;
wherein the waveguide layer comprises a hard stop layer;

an optical fiber alignment device mounted on the PIC comprising:
a base;
a groove in said base for receiving a portion of an optical fiber, whereby a core of the optical fiber is aligned with a core of the optical waveguide of the PIC;
second alignment features extending from the base for abutting the hard stop layer on the PIC.

2. The assembly according to claim 1 , further comprising:
first bonding pads mounted on the base; and
second bonding pads on the PIC for bonding with the first bonding pads via a bonding material disposed therebetween.

3. The assembly according to claim 2 , further comprising recesses in the base;
wherein the first bonding pads are disposed within the recesses, whereby excess adhesive material is trapped in the recesses during and after assembly.

4. The assembly according to claim 1 , further comprising a trough extending from an outer free end of the groove for collecting excess material used to bond the optical fiber in the groove.

5. The assembly according to claim 1 , further comprising a cavity in the base for receiving the electronic or opto-electronic component extending from the PIC.

6. The assembly according to claim 5 , further comprising a hermetically sealable material surrounding an opening to the cavity for hermetically sealing the electronic or opto-electronic component within the cavity.

7. The assembly according to claim 5 , further comprising a ground connection between the cavity in the base and the electronic or opto-electronic component extending from the PIC, for grounding the electronic or opto-electronic component to the fiber alignment device.

8. The assembly according to claim 1 , wherein the first alignment features comprise pillars extending from the base for abutting the hard stop layer on the PIC.

9. A method of aligning an optical fiber to a waveguide on a photonic optical chip (PIC) comprising:
providing an optical fiber alignment device for aligning an optical fiber with an optical waveguide on a photonic integrated circuit (PIC) comprising:
a base;
a groove in said base for receiving a portion of the optical fiber, whereby a core of the optical fiber is aligned with a core of the optical waveguide of the PIC;
first alignment features extending from the base for abutting a hard stop layer on the PIC;

providing the PIC comprising:
openings in the PIC, down to a waveguide layer, which comprises the hard stop layer for abutting with the first alignment features;

mounting the optical fiber alignment device on the PIC with the first alignment features aligned with the hard stop layer; and
fixing the optical fiber alignment device to the PIC.

10. The method according to claim 9 , wherein the optical fiber alignment device further comprises first bonding pads mounted on the base; and
wherein the PIC further comprises second bonding pads for bonding with corresponding first bonding pads on the optical fiber alignment device via an adhesive material disposed therebetween; and
wherein the method further comprises activating the adhesive, whereby the adhesive flows and the first alignment features of the fiber alignment device move into contact with the hard stop layer of the PIC.

11. The method according to claim 10 , wherein the fiber alignment device further comprises recesses in the base;
wherein the first bonding pads are disposed within the recesses, whereby excess adhesive is trapped in the recesses during activation.

12. The method according to claim 9 , further comprising aligning the fiber alignment device to the PIC in an X-Y plane.

13. The method according to claim 9 , further comprising mounting the optical fiber in the groove;
aligning the optical fiber with the optical waveguide; and
fixing the optical fiber to the optical fiber alignment device.

14. The method according to claim 13 , wherein a trough extends from an outer free end of the groove for collecting excess material used to bond the optical fiber in the groove.

15. The method according to claim 9 , wherein the fiber alignment device further comprises a cavity, and a hermetic seal, surrounding the cavity for hermetically sealing the electronic or opto-electronic component; and
wherein the step of fixing the optical fiber alignment device to the PIC includes forming the hermetic seal around the cavity.

16. The method according to claim 9 , wherein the first alignment features comprise pillars extending from the base for abutting the hard stop layer on the PIC.

Assignees

• Elenion Tech Llc

Inventors

• Nuttall Nathan A
• Blumenthal Daniel J
• Novack Ari
• Klein Holger N

Classifications

• G02B6/4239

  Adhesive bonding; Encapsulation with polymer material · CPC title

• G02B6/4249

  comprising arrays of active devices and fibres · CPC title

• G02B6/428

  containing printed circuit boards [PCB] · CPC title

• G02B6/4274

  Electrical aspects (G02B6/4263 and G02B6/4265 take precedence) · CPC title

• G02B6/4253

  by embedding housing components in an adhesive or a polymer material (G02B6/4212 takes precedence) · CPC title