Pressure ports and related methods

Patent metadata

Field	Value
Publication number	US-10024747-B2
Application number	US-201615185713-A
Country	US
Kind code	B2
Filing date	Jun 17, 2016
Priority date	Jun 19, 2015
Publication date	Jul 17, 2018
Grant date	Jul 17, 2018

Abstract

A pressure port assembly and related components and methods are disclosed. In some instances, the pressure port assembly may comprise a pressure port body, including pressure port bodies composed of a continuous material. Pressure port bodies within the scope of this disclosure may be coupled to pressure sensing elements, including pressure transducers. Apertures or other flow paths may be provided across a pressure port body. Methods of integrally forming a pressure port body comprising a continuous material are also disclosed.

First claim

The invention claimed is:

1. A sensor assembly comprising:
a monolithic sensor mounting body comprising:
a first flat surface;
a second flat surface disposed opposite the first flat surface;
a protrusion extending from the second flat surface and away from the first flat surface; and
an aperture that extends across the sensor mounting body from an opening in the first flat surface to an opening in the protrusion;

a metallized coating disposed on at least a portion of the first flat surface of the sensor mounting body;
a pressure sensor that is coupled to the first flat surface such that the pressure sensor is in fluid communication with the aperture; and
a cover that partially covers the first flat surface,
wherein a first portion of the metallized coating is disposed within the cover and a second portion of the metallized coating is disposed outside the cover.

2. The sensor assembly of claim 1 , wherein the monolithic sensor mounting body is formed from a fluid-impermeable ceramic material.

3. The sensor assembly of claim 1 , wherein the metallized coating is configured for electrical communication with the pressure sensor.

4. The sensor assembly of claim 1 , further comprising an integrated circuit that is mounted to the first flat surface of the sensor mounting body.

5. The sensor assembly of claim 4 , wherein the pressure sensor is disposed between the first flat surface and the integrated circuit.

6. The sensor assembly of claim 5 , wherein the pressure sensor is electrically coupled to the integrated circuit via a first plurality of leads and the integrated circuit is electrically coupled to electrical contacts on the sensor mounting body via a second plurality of leads.

7. A sensor mounting body comprising:
a first flat surface that extends to a perimeter;
a second flat surface disposed opposite the first flat surface and extends to the perimeter;
a protrusion extending from the second flat surface; and
an aperture extending through the sensor mounting body from a distal end of the protrusion to a location on the first flat surface,
wherein the sensor mounting body comprises a continuous material.

8. The sensor mounting body of claim 7 , wherein the continuous material comprises a ceramic material.

9. The sensor mounting body of claim 7 , wherein the continuous material is impermeable to fluid flow across the continuous material.

10. The sensor mounting body of claim 7 , wherein the continuous material is impermeable to liquid flow across the continuous material.

11. A sensor assembly comprising:
a sensor mounting body comprising:
an electronics mounting surface;
a protrusion extending away from the electronics mounting surface; and
an aperture extending from a surface of the protrusion to the electronics mounting surface;

a pressure sensor mounted to the electronics mounting surface such that a portion of the pressure sensor is in fluid communication with the aperture;
one or more electronic contacts mounted to the electronics mounting surface such that the electronic contacts do not extend beyond the electronics mounting surface; and
a cover that partially covers the electronics mounting surface,
wherein a first portion of the one or more electronic contacts is disposed within the cover and a second portion of the one or more electronic contacts is disposed outside the cover.

12. The sensor assembly of claim 11 , wherein the sensor mounting body comprises a single continuous material.

13. The sensor assembly of claim 11 , wherein the sensor mounting body and pressure sensor isolate the electronics mounting surface from fluid communication with the surface of the protrusion when the sensor mounting body is disposed such that fluid cannot communicate around the periphery of the sensor mounting body.

14. The sensor assembly of claim 11 , wherein the one or more electronic contacts are disposed on a membrane coupled to the electronics mounting surface.

15. The sensor assembly of claim 11 , wherein the one or more electronic contacts are directly deposited on the electronics mounting surface.

16. The sensor assembly of claim 11 , further comprising a sealing component disposed around the protrusion.

17. The sensor assembly of claim 12 , wherein the continuous material comprises a ceramic material that is impermeable to fluid flow across the continuous material.

18. The sensor assembly of claim 11 , wherein the pressure sensor is disposed between the electronics mounting surface and an integrated circuit.

19. The sensor assembly of claim 11 , further comprising a metallized coating on at least a portion of the electronics mounting surface.

20. A method of forming a sensor assembly, the method comprising:
integrally forming a sensor mounting body, the sensor mounting body comprising:
a flat portion defining a first side and a second side;
a protrusion extending from the second side of the flat portion, the protrusion integrally formed with the flat portion; and
an aperture extending from a surface of the protrusion to the first side of the flat portion,
wherein the first side and the second side extend to a perimeter.

21. The method of claim 20 , further comprising coupling a sensor to the first side of the flat portion, such that a portion of the sensor is in fluid communication with the aperture.

22. The method of claim 20 , further comprising coupling one or more electronic components to the first flat surface.

23. The method of claim 22 , wherein the one or more electronic components are coupled to a membrane which is coupled to the first flat surface.

24. The method of claim 20 , further comprising coupling a sealing member around the protrusion.

25. The method of claim 20 , wherein integrally forming the sensor mounting body comprises forming the sensor mounting body from a continuous ceramic material.

26. The method of claim 20 , wherein integrally forming the sensor mounting body comprises injection-molding the sensor mounting body.

27. The method of claim 21 , further comprising coupling an integrated circuit to the sensor such that the sensor is disposed between the integrated circuit and the first side of the flat portion.

28. The method of claim 20 , further comprising applying a metallized coating to at least a portion of the first side of the flat portion.

Assignees

• Merit Medical Systems Inc

Inventors

• Russell Rick
• Cheney Jonathan
• Sidwell Scott
• Salmaso Luca
• Chance Jeff
• Liddiard Greg

Classifications

• H10W90/752

  between stacked chips · CPC title

• H10W72/07553

  changes in shapes · CPC title

• H10W72/537

  Multiple bond wires having different shapes · CPC title

• G01L19/147 Primary

  Details about the mounting of the sensor to support or covering means · CPC title

• G01L19/143

  Two part housings · CPC title