Sequential die cut and slitting for improved collation

Patent metadata

Field	Value
Publication number	US-10022883-B2
Application number	US-201615358317-A
Country	US
Kind code	B2
Filing date	Nov 22, 2016
Priority date	Nov 22, 2016
Publication date	Jul 17, 2018
Grant date	Jul 17, 2018

Abstract

A system and process for cutting and slitting media into individualized signage members without leaving material cut from said media attached to said media includes pre-die cut openings or cut outs placed in the media based upon adhesive and liner layout of the media and cutter slitter blades used in order to create a consistent break point for slit waste.

First claim

What is claimed is:

1. A method for cleanly removing material cut from adhesive signage for store shelving, comprising:
providing multilayer substrates that include a polymer lined and fully backed adhesive layer;
providing row gutters on said multilayer substrates;
placing openings at lead and trail edges of said row gutters;
providing a first cutter for placing dynamic slits into said multilayer substrates; and
using said first cutter to slit said multilayer substrates from said lead edge to said trail edge of said openings in said row gutters to thereby provide a clean slit cut without waste material being left attached to said multilayer substrates.

2. The method of claim 1 , including providing column gutters on said multilayer substrates.

3. The method of claim 2 , including providing a second cutter for placing slits in said column gutters using gutter cutting blades.

4. The method of claim 3 , including conveying said multilayer substrates to a collator.

5. The method of claim 3 , including providing slits in said substrates with said first cutter in a direction orthogonal to slits provided in said multilayer substrates by said second cutter.

6. The method of claim 1 , including providing said openings as die cut and using said die cut openings to define end points of said dynamic slits.

7. The method of claim 6 , wherein said die cut openings are circular in shape.

8. The method of claim 6 , including placing said die cut openings into said multilayer substrates to create a consistent break point for said waste material.

9. The method of claim 1 wherein said die cut openings are rectangular in shape.

10. The method of claim 1 , wherein said die cut openings are square in shape.

11. A method for removing excess material from slits cut in media, comprising:
providing multilayer media for receiving slits therein, said multilayer media including a polymer carrier and a fully lined adhesive;
providing a first cutter for cutting slits into said multilayer media; and
providing openings in said multilayer media at predetermined ends of said slits so that said polymer carrier and adhesive are cleanly cut at the beginning and ending of said slits and thereby preventing media material resulting said cutting of slits into said multilayer media from hanging onto said substrates.

12. The method of claim 11 , including die cutting said openings into said media.

13. The method of claim 12 , including shaping said openings selected from a group consisting of squares, circles, ovals, semi-circles and rectangles.

14. The method of claim 12 , including using said die cut openings as end points for said slits.

15. The method of claim 14 , including providing row gutters on said multilayer media.

16. The method of claim 15 , including placing said openings at lead and trail edges of said row gutters.

17. The method of claim 16 , including providing including providing column gutters on said multilayer media.

18. The method of claim 17 , including providing a second cutter for slitting said column gutters using gutter cutting blades.

19. The method of claim 18 , including providing slits made by said first cutter orthogonal to slits made by said second cutter in said multilayer media.

20. A method for removing unwanted material from slits created in media in order to prevent jamming when said media is fed into a downstream collator, comprising:
providing multilayer media, said multilayer media including a polymer layer and adhesive layer;
providing row gutters on said multilayer media;
placing die cut openings at lead and trail edges of said row gutters;
providing a cutter for placing dynamic slits into said multilayer media; and
using said cutter to slit said multilayer media up to the point of said openings and thereby cleanly remove leftover material cut from said slits.

Assignees

• Xerox Corp

Inventors

• Herrmann Douglas K
• St Martin Kevin

Classifications

• B26D7/18

  Means for removing cut-out material or waste · CPC title

• B26D1/626 Primary

  for thin material, e.g. for sheets, strips or the like · CPC title

• B31D1/026

  Cutting or perforating (B31D1/022 takes precedence) · CPC title

• B31D1/021

  Making adhesive labels having a multilayered structure, e.g. provided on carrier webs · CPC title

• B31D2201/02

  the articles being labels or tags · CPC title