Wired circuit board and producing method thereof

Patent metadata

Field	Value
Publication number	US-10021780-B2
Application number	US-201715800680-A
Country	US
Kind code	B2
Filing date	Nov 1, 2017
Priority date	Nov 2, 2016
Publication date	Jul 10, 2018
Grant date	Jul 10, 2018

Abstract

A wired circuit board includes an insulating layer and a conductive layer. The insulating layer continuously has a first insulating portion, a second insulating portion having a thickness smaller than that of the first insulating portion, and a third insulating portion disposed between the first insulating portion and the second insulating portion and having a thickness that gradually becomes smaller from the first insulating portion toward the second insulating portion. The conductive layer continuously has a first conductive portion disposed at one-side surface of the first insulating portion and a second conductive portion disposed at one-side surface of the second insulating portion and having a thickness smaller than that of the first conductive portion. The first conductive portion is disposed at one-side surface of the second insulating portion and the third insulating portion or is disposed at one-side surface of the first insulating portion and the third insulating portion.

First claim

What is claimed is:

1. A wired circuit board comprising: an insulating layer and a conductive layer disposed at one-side surface in a thickness direction of the insulating layer, wherein the insulating layer continuously has a first insulating portion, a second insulating portion having a thickness smaller than that of the first insulating portion, and a third insulating portion disposed between the first insulating portion and the second insulating portion and having a thickness that tapers gradually and becomes smaller from the first insulating portion toward the second insulating portion; the conductive layer continuously has a first conductive portion disposed at one-side surface in the thickness direction of the first insulating portion and a second conductive portion disposed at one-side surface in the thickness direction of the second insulating portion and having a thickness smaller than that of the first conductive portion; and the first conductive portion is further disposed at one-side surfaces in the thickness direction of the second insulating portion and the third insulating portion or the second conductive portion is further disposed at one-side surfaces In the thickness direction of the first insulating portion and the third insulating portion.

2. A method for producing a wired circuit board comprising; a first step of preparing an insulating layer and a second step of disposing a conductive layer at one-side surface in a thickness direction of the insulating layer, wherein the insulating layer continuously has a first insulating portion, a second Insulating portion having a thickness smaller than that of the first insulating portion, and a third insulating portion disposed between the first insulating portion and the second insulating portion and having a thickness that tapers gradually and becomes smaller from the first, insulating portion toward the second insulating portion; the conductive layer continuously has a first conductive portion disposed at one-side surface in the thickness direction of the first insulating portion and a second conductive portion disposed at one-side surface in the thickness direction of the second insulating portion and having a thickness smaller than that of the first conductive portion; the first conductive portion is further disposed at one-side surfaces in the thickness direction, of the second insulating portion and the third insulating portion or the second conductive portion is further disposed at one-side surfaces in the thickness direction of the first insulating portion and the third insulating portion; the second step includes a third step of disposing a first conductive layer having the same thickness as that of the second conductive portion at one-side surface in the thickness direction of the insulating layer, a fourth step of disposing a photoresist at the entire one-side surface in the thickness direction of the first conductive layer, a fifth step of forming a plating resist in a pattern reverse to the first conductive portion by exposing the photoresist to light to be developed, and a sixth step of forming a second conductive layer at one-side surface in the thickness direction of the first conductive layer exposed from the plating resist by plating; and in the sixth step, plating is performed so that the total thickness of the first conductive layer and the second conductive layer is the same as die thickness of the first conductive portion.

3. A method for producing a wired circuit board comprising: a first step of preparing an Insulating layer and a second step of forming a conductive layer at one-side surface in a thickness direction of the insulating layer, wherein tire insulating layer continuously has a first insulating portion, a second insulating portion having a thickness smaller than that of the first Insulating portion, and a third insulating portion disposed between tire first insulating portion and the second insulating portion and having a thickness that tapers gradually and becomes smaller from the first insulating portion toward the second insulating portion; the conductive layer continuously has a first conductive portion disposed at one-side surface in the thickness direction of the first insulating portion and a second conductive portion disposed at one-side surface in the thickness direction of the second insulating portion and having a thickness smaller than that of the first conductive portion; the first conductive portion is farther disposed at one-side surfaces in the thickness direction of the second Insulating portion and the third insulating portion or the second conductive portion is further disposed at one-side surfaces in the thickness direction of the first insulating portion and the third insulating portion; the second step includes a third step of disposing a third conductive layer having the same thickness as that of the first conductive portion at one-side surface in the thickness direction of the insulating layer, an fourth step of forming an etching resist at one-side surface in the thickness direction of the third conductive layer in the same pattern as that of the first conductive portion, and a fifth step of etching a one-side portion in the thickness direction of the third conductive layer exposed from the etching resist; and in the fifth step, the third conductive layer is etched by a portion corresponding to the thickness obtained by subtracting the thickness of the second conductive portion from that of the first conductive portion.

Assignees

• Nitto Denko Corp

Inventors

• Yamauchi Daisuke
• Tanabe Hiroyuki

Classifications

• H05K1/028 Primary

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title

• H05K3/064

  Photoresists · CPC title

• H05K2201/09736

  Varying thickness of a single conductor; Conductors in the same plane having different thicknesses · CPC title

• H05K2201/0191

  wherein the thickness of the dielectric plays an important role · CPC title

• H05K3/18

  using precipitation techniques to apply the conductive material · CPC title