Circuit board and fan frame connection structure

Patent metadata

Field	Value
Publication number	US-10021775-B1
Application number	US-201715627399-A
Country	US
Kind code	B1
Filing date	Jun 19, 2017
Priority date	Jun 19, 2017
Publication date	Jul 10, 2018
Grant date	Jul 10, 2018

Abstract

A circuit board and fan frame connection structure includes a fan frame, a circuit board and an adhesive member having multiple through holes. The fan frame includes a bottom board, a bearing cup disposed at the center of the bottom board and multiple perforations formed through the bottom board. The bottom board has an upper surface and a lower surface. The circuit board is adhered to the lower surface of the bottom board via the adhesive member. The electronic components arranged on the circuit board pass through the aligned through holes and perforations.

First claim

What is claimed is:

1. A circuit board and fan frame connection structure comprising:
a fan frame including a bottom board, a bearing cup and multiple perforations, the bottom board having an upper surface and a lower surface opposite to the upper surface, the bearing cup being disposed at a center of the bottom board, the perforations being formed through the bottom board between the upper and lower surfaces;
a circuit board disposed outside the fan frame, the circuit board having a circuit board main body and multiple electronic components, the circuit board main body facing the lower surface of the bottom board, the electronic components being arranged on the circuit board main body; and
an adhesive member adhered to the lower surface of the bottom board and the circuit board main body and positioned between the bottom board of the fan frame and the circuit board main body, the adhesive member having multiple through holes formed through the adhesive member in alignment with and in communication with the perforations, the electronic components passing through the aligned through holes and perforations.

2. The circuit board and fan frame connection structure as claimed in claim 1 , wherein the circuit board main body has a top face and a bottom face opposite to the top face, the electronic components being arranged on the top face of the circuit board main body, the top face of the circuit board main body being adhered to the lower surface of the bottom board of the fan frame via the adhesive member.

3. The circuit board and fan frame connection structure as claimed in claim 2 , wherein the adhesive member has a first adhesive face and a second adhesive face, the first adhesive face being adhered to the lower surface of the bottom board of the fan frame, while the second adhesive face being adhered to the top face of the circuit board main body, the electronic components being received in the through holes and the perforations.

4. The circuit board and fan frame connection structure as claimed in claim 1 , wherein the adhesive member is adhesive glue or a thin sheet with adhesive glue.

5. The circuit board and fan frame connection structure as claimed in claim 1 , wherein the fan frame includes a top board, a bottom board and a sidewall connected between the top board and the bottom board, the centers of the top board and the bottom board being respectively formed with an air inlet and an air outlet, the sidewall upward extending from the periphery of the bottom board, the sidewall and the bottom board defining a receiving space in communication with the air inlet and the air outlet, the fan impeller being received in the receiving space, the fan impeller having a shaft and the bearing cup having a shaft hole corresponding to the shaft, the shaft being rotatably disposed in the shaft hole.

6. The circuit board and fan frame connection structure as claimed in claim 1 , wherein the fan frame includes a sidewall upward extending from the outer periphery of the bottom board and a top board secured on the sidewall, the sidewall being formed with an air outlet and an air inlet, the sidewall and the bottom board defining a receiving space in communication with the air outlet and the air inlet, the fan impeller being received in the receiving space, the fan impeller having a shaft and the bearing cup having a shaft hole corresponding to the shaft, the shaft being rotatably disposed in the shaft hole.

7. The circuit board and fan frame connection structure as claimed in claim 1 , wherein the circuit board main body is a hard printed circuit board or a flexible printed circuit board.

8. The circuit board and fan frame connection structure as claimed in claim 1 , wherein the electronic components are arranged on the circuit board in a position in alignment with the positions of the perforations and the through holes.

9. The circuit board and fan frame connection structure as claimed in claim 1 , wherein the through holes have an area larger than the area of the electronic components and the perforations have an area larger than the area of the electronic components.

10. The circuit board and fan frame connection structure as claimed in claim 1 , wherein the perforations have a size equal to the size of the through holes.

Assignees

• Asia Vital Components Co Ltd

Inventors

• Shen Meng

Classifications

• H05K7/20172 Primary

  Fan mounting or fan specifications · CPC title

• H05K7/20136

  Forced ventilation, e.g. by fans (H05K7/202 takes precedence) · CPC title

• G06F1/203

  for portable computers, e.g. for laptops · CPC title

• H05K7/20545

  Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards · CPC title

• H05K7/20554

  Forced ventilation of a gaseous coolant (in closed loop H05K7/206 or H05K7/20609 or H05K7/20618) · CPC title