Integrated speakers

Patent metadata

Field	Value
Publication number	US-10021480-B2
Application number	US-201414495777-A
Country	US
Kind code	B2
Filing date	Sep 24, 2014
Priority date	Sep 24, 2014
Publication date	Jul 10, 2018
Grant date	Jul 10, 2018

Abstract

An enclosure for an electronic device is enclosed. The enclosure includes rib structures configured to improve structural support to prevent damage and to dissipate vibration throughout the enclosure. The rib structure can receive a speaker module and a cap member. The rib structure and the speaker module can combine to form a three-dimensional volume allowing the speaker module in which the speaker module may project sound, thereby enhancing acoustic performance. Also, the cap member may be adhesively attached to the rib structure to provide additional structural support against vibration and abuse caused by load forces associated with a drop event.

First claim

What is claimed is:

1. An electronic device, comprising:
an enclosure comprising:
a plurality of ribs comprising:
a first rib structure engaged with a sidewall of the enclosure and at least partially defining a first chamber;
a second rib structure at least partially defining a second chamber different from the first chamber; and
a shared rib defining a portion of both the first chamber and the second chamber;

an audio device comprising a cover in contact with and forming an acoustic seal over a top of the first rib structure, the audio device defining:
a first opening configured to project first sound waves in a first direction towards an area of the sidewall where a speaker opening is located; and
a second opening configured to project second sound waves in a second direction opposite the first direction and towards the shared rib; and

a cap member covering the second rib structure.

2. The electronic device as recited in claim 1 , further comprising an underpass through the first rib structure, wherein the underpass opens the first chamber to the second chamber.

3. The electronic device as recited in claim 2 , wherein when the audio device is positioned within the first chamber, the audio device is capable of emitting sound through the underpass.

4. The electronic device as recited in claim 1 , further comprising means for securing the audio device to the first rib structure, and means for securing the cap member to the second rib structure.

5. The electronic device as recited in claim 4 , wherein the means for securing the cap member to the second rib structure comprises a flange receiving the cap member and an adhesive securing the cap member to the flange.

6. The electronic device as recited in claim 5 , wherein the cap member comprises a composite material and defines a plurality of protrusions adhesively secured to the enclosure.

7. The electronic device as recited in claim 5 , further comprising:
an additional plurality of ribs comprising:
a third rib structure engaged with the sidewall of the enclosure and at least partially defining a third audio chamber; and
a fourth rib structure at least partially defining a fourth chamber different from the third chamber;
and

an additional shared rib defining a portion of both the third chamber and the fourth chamber;

an additional audio device comprising an additional cover in contact with and forming an additional acoustic seal over a top of the third rib structure; and
a cap member covering the fourth rib structure.

8. The electronic device of claim 1 , wherein the cap member forms an acoustic seal over a top of the second chamber.

9. The electronic device of claim 1 , wherein a top of the first rib structure and a top of the second rib structure together define a single plane.

10. An electronic device, comprising:
an enclosure, comprising:
a plurality of sidewalls integrally formed around an outer peripheral portion of the enclosure and comprising a sidewall having an aperture therethrough;

a first plurality of ribs integrally formed on a rear portion of the enclosure and including:
a first rib structure engaged with the sidewall of the enclosure and at least partially defining a first chamber;
a second rib structure at least partially defining a second chamber different from the first chamber; and
a shared rib defining a portion of both the first chamber and the second chamber and positioned opposite the aperture in the sidewall;

a speaker module comprising:
a cover in contact with and forming an acoustic seal over a top of the first rib structure;
a first wall defining a first opening that faces the aperture in the sidewall; and
a second wall defining a second opening that faces the shared rib; and

a cap member in contact with and forming an acoustic seal over a top of the second rib structure.

11. The electronic device as recited in claim 10 , wherein the cap member is adhesively secured to the second rib structure.

12. The electronic device as recited in claim 10 , further comprising an underpass in the shared rib, the first underpass opening to the first chamber and the second chamber.

13. The electronic device as recited in claim 12 , wherein the speaker module emits sound through the aperture and the underpass.

14. The electronic device of claim 10 , wherein a top of the first rib structure and a top of the second rib structure together define a single plane.

15. The electronic device of claim 10 , wherein the first wall and the second wall are substantially parallel to one another.

16. The electronic device of claim 10 , wherein:
the first wall is substantially parallel to the sidewall; and
the second wall is substantially parallel to the shared rib.

17. A method comprising:
forming an enclosure, comprising:
removing a portion of an aluminum substrate to form a plurality of sidewalls, the plurality of sidewalls having a first sidewall;
removing a portion of the plurality of sidewalls to define a location that receives a cover glass;
removing a portion of the aluminum substrate to define a continuous rib structure defining:
a first rib structure at least partially defining a first chamber;
a second rib structure at least partially defining a second chamber; and
a third rib structure defining a portion of each of the first and the second chambers, wherein the first, second, and third rib structures each extend substantially a same height above a back surface of the enclosure;

forming an aperture in the first sidewall, the aperture opening into the first chamber; and
removing a portion of the third rib structure to define an underpass in the third rib structure while maintaining the first, second, and third rib structures at the same height above the back surface of the enclosure;

attaching an audio device to the first rib structure such that a first opening in the audio device faces the aperture and a second opening in the audio device faces the third rib structure; and
attaching a cap member to the second rib structure to acoustically seal the second chamber.

18. The method as recited in claim 17 , further comprising:
removing a portion of the second rib structure to define a flange member; and
securing the cap member to the flange member using an adhesive.

19. The method as recited in claim 17 , wherein the aperture allows sound from the audio device to escape the enclosure.

20. The method as recited in claim 17 , wherein attaching the audio device to the first rib structure acoustically seals the first chamber.

Assignees

• Apple Inc

Inventors

• Lobisser G Kyle
• Keats Jason S
• Mihelich Ryan J
• Vieites Pablo Seoane
• Kenney Kevin M
• Raff John
• Uttermann Erik A
• Kuna Melody L
• Ross Oliver C

Classifications

• H04R1/2888 Primary

  for loudspeaker transducers · CPC title

• H04R2201/029

  Manufacturing aspects of enclosures transducers · CPC title

• H04R1/2834

  for loudspeaker transducers · CPC title

• H04R2499/11

  Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's · CPC title