Composite thermoelectric material, thermoelectric element and module including the same, and preparation method thereof

Patent metadata

Field	Value
Publication number	US-10020435-B2
Application number	US-201414185233-A
Country	US
Kind code	B2
Filing date	Feb 20, 2014
Priority date	May 28, 2013
Publication date	Jul 10, 2018
Grant date	Jul 10, 2018

Abstract

A composite thermoelectric material comprising a matrix comprising a thermoelectric semiconductor; and a nanoscale heterophase dispersed in the matrix, wherein the thermoelectric semiconductor comprises an element belonging to Group 15 of the Periodic Table of the Elements, and the heterophase comprises a transition metal element.

First claim

What is claimed is:

1. A composite thermoelectric material comprising:
a matrix comprising a thermoelectric semiconductor; and
a nanoscale heterophase dispersed in the matrix,
wherein the nanoscale heterophase comprises a compound represented by Formula 1:
M a X b   Formula 1

wherein M is a transition metal element, X is S, Se, Te, or a combination thereof, 0<a≤1, and 0.1<b≤1, and
wherein the thermoelectric semiconductor comprises an element belonging to Group 15 of the Periodic Table of the Elements, and
wherein the heterophase is disposed within an intragrain region of an individual grain of the matrix.

2. The composite thermoelectric material of claim 1 , wherein an average particle size of the heterophase is in a range from about 1 nanometer to about 600 nanometers.

3. The composite thermoelectric material of claim 1 , wherein the heterophase is contained in the matrix in an amount of at least 0.01 part by weight, based on 100 parts by weight of the matrix.

4. The composite thermoelectric material of claim 1 , wherein the heterophase comprises a compound comprising a transition metal element and an element belonging to Groups 13 to 16 of the Periodic Table of the Elements.

5. The composite thermoelectric material of claim 1 , wherein the heterophase comprises a compound represented by Formula 2:
M′ a X b   Formula 2

wherein M′ is an element belonging to Groups 10 and 11 of the Periodic Table of the Elements, X is S, Se, Te, or a combination thereof, 0<a≤1, and 0.1<b≤1.

6. The composite thermoelectric material of claim 5 , wherein the heterophase comprises a compound represented by Formula 3:
M″ a X b   Formula 3

wherein M″ is Cu, Ag, Pd, or a combination thereof, X is S, Se, Te, or a combination thereof, 0<a≤1, and 0.1<b≤1.

7. The composite thermoelectric material of claim 6 , wherein X is Te.

8. The composite thermoelectric material of claim 1 , wherein the thermoelectric semiconductor is an n-type semiconductor.

9. The composite thermoelectric material of claim 1 , wherein the thermoelectric semiconductor comprises elements belonging to Groups 15 and 16 of the Periodic Table of the Elements.

10. The composite thermoelectric material of claim 9 , wherein the thermoelectric semiconductor comprises a chalcogenide compound.

11. The composite thermoelectric material of claim 9 , wherein the thermoelectric semiconductor comprises a compound represented by Formula 4:
Bi 2-x Sb x Se 3-y Te y   Formula 4

wherein in Formula 4 0≤x≤2, and 0≤y≤3.

12. The composite thermoelectric material of claim 11 , wherein the thermoelectric semiconductor comprises a compound represented by Formulas 5 to 7, or a combination thereof:
Bi 2-x Te 3-y ,  Formula 5

wherein in Formula 5 0≤x<2 and 0≤y<3,
Bi 2-x Se 3-y ,  Formula 6

wherein in Formula 6 0≤x<2 and 0≤y<3, or
Bi 2-x Se 3-y Te 3-z ,  Formula 7

wherein in Formula 7 0≤x<2, 0≤y<3, and 0≤z<3.

13. The composite thermoelectric material of claim 1 , further comprising an epitaxial junction between the matrix and the heterophase.

14. The composite thermoelectric material of claim 1 , wherein a figure of merit ZT is at least 1.0 at a temperature in a range from about 300 K to about 450 K.

15. A composite thermoelectric material comprising:
a matrix comprising a thermoelectric semiconductor of Formula 4,
Bi 2-x Sb x Se 3-y Te y   Formula 4

wherein 0≤x≤2, and 0≤y≤3, and
a heterophase dispersed in the matrix and comprising compound of Formula 1,
M a X b   Formula 1

wherein M is a transition metal element, X is S, Se, Te, or a combination thereof, 0≤a≤1, and 0.1≤b≤1, and
wherein the heterophase is disposed within an intragrain region of an individual grain of the matrix.

16. The composite thermoelectric material of claim 15 , wherein x is 0.

17. The composite thermoelectric material of claim 16 , wherein M is an element belonging to Groups 10 and 11 of the Periodic Table of the Elements.

18. A thermoelectric element comprising the composite thermoelectric material of claim 1 .

19. A thermoelectric module comprising:
a first electrode;
a second electrode; and
the thermoelectric element of claim 18 , wherein the thermoelectric element is interposed between the first electrode and the second electrode.

20. A method of preparing a composite thermoelectric material, the method comprising:
providing a composite base material comprising a thermoelectric semiconductor and a transition metal element; and
sintering the composite base material to prepare the composite thermoelectric material, wherein the composite thermoelectric material comprises
a matrix comprising a thermoelectric semiconductor; and
a nanoscale heterophase dispersed in the matrix,
wherein the nanoscale heterophase comprises a compound represented by Formula 2:
M′ a X b   Formula 2

wherein M′ is an element belonging to Groups 10 and 11 of the Periodic Table of the Elements, X is S, Se, Te, or a combination thereof, 0<a≤1, and 0.1<b≤1, and
wherein the thermoelectric semiconductor comprises an element belonging to Group 15 of the Periodic Table of the Elements, and
wherein the heterophase is disposed within an intragrain region of an individual grain of the matrix.

21. The method of claim 20 , wherein the providing the composite base material comprises:
heating the thermoelectric semiconductor, the transition element, and S, Se, Te, or a combination thereof to prepare a melt, and
solidifying the melt to provide the composite base material.

22. The method of claim 21 , wherein the solidifying is by melt spinning, gas atomization, plasma deposition, centrifugal atomization, or splat quenching.

23. The method of claim 20 , wherein the sintering is performed at a temperature in a range from about 300° C. to about 800° C. and at a pressure in a range from about 1 megaPascal to about 100 megaPascals for about 1 minute to about 10 minutes.

24. The method of claim 23 , wherein the sintering comprises spark plasma sintering.

25. The method of claim 20 , wherein the composite base material is in the form of a powder.

26. The composition thermoelectric material of claim 1 , wherein the thermoelectric semiconductor comprises Bi 2 Te 2.7 Se 0.3 .

27. The composition thermoelectric material of claim 1 , wherein X is Te and M is selected from the group consisting of Cu, Ag, Pd, or a combination thereof.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Shin Weon-Ho
• Roh Jong Wook
• Lee Kyu-Hyoung
• Yang Dae-Jin
• Kim Sang-Il

Classifications

• C01P2006/40

  Electric properties · CPC title

• C01P2006/32

  Thermal properties · CPC title

• C01P2004/80

  Particles consisting of a mixture of two or more inorganic phases · CPC title

• C01P2004/04

  obtained by TEM, STEM, STM or AFM · CPC title

• C01P2004/03

  obtained by SEM · CPC title