Microelectronics package with integrated sensors

Patent metadata

Field	Value
Publication number	US-10020405-B2
Application number	US-201715408560-A
Country	US
Kind code	B2
Filing date	Jan 18, 2017
Priority date	Jan 19, 2016
Publication date	Jul 10, 2018
Grant date	Jul 10, 2018

Abstract

The present disclosure relates to a microelectronics package with optical sensors and/or thermal sensors. The disclosed microelectronics package includes a module substrate, a thinned flip-chip die with an upper surface that includes a first surface portion and a second surface portion surrounding the first surface portion, and a first mold compound component. The thinned flip-chip die is attached to the module substrate and includes a device layer with sensor structure integrated at a top portion of the device layer. Herein, the sensor structure is below the first surface portion and not below the second surface portion. The first mold compound component is formed over the second surface portion to define a first cavity over the upper surface of the thinned flip-chip die. The first mold compound component is not over the first surface portion, and the first surface portion is exposed at the bottom of the first cavity.

First claim

What is claimed is:

1. An apparatus comprising:
a module substrate;
a thinned flip-chip die, which has an upper surface including a first surface portion and a second surface portion surrounding the first surface portion, comprising:
a device layer including a first sensor structure integrated at a top portion of the device layer, wherein the first sensor structure is below the first surface portion and is not below the second surface portion;
a dielectric layer over an upper surface of the device layer; and
a plurality of interconnects extending from a lower surface of the device layer and coupled to the module substrate; and

a first mold compound component formed over the second surface portion to define a first cavity over the upper surface of the thinned flip-chip die, wherein the first mold compound component is not over the first surface portion, and the first surface portion is exposed at the bottom of the first cavity.

2. The apparatus of claim 1 further comprising a second mold compound component that resides over an upper surface of the module substrate and surrounds the thinned flip-chip die and the first mold compound component.

3. The apparatus of claim 2 further comprising an underfilling layer residing between the thinned flip-chip die and the upper surface of the module substrate.

4. The apparatus of claim 3 wherein the underfilling layer encapsulates the plurality of interconnects and further resides between the second mold compound component and the upper surface of the module substrate.

5. The apparatus of claim 3 wherein the underfilling layer is formed from a same material as the second mold compound component.

6. The apparatus of claim 3 wherein the underfilling layer is formed from a different material from the second mold compound component.

7. The apparatus of claim 2 wherein the first mold compound component and the second mold compound component are formed from a same material.

8. The apparatus of claim 2 wherein the first mold compound component and the second mold compound component are formed from different materials.

9. The apparatus of claim 1 further comprising a transparent material in the first cavity and residing over the first surface portion, wherein the first mold compound component is surrounding the transparent material.

10. The apparatus of claim 9 wherein the transparent material is formed from polymide.

11. The apparatus of claim 9 wherein the transparent material is configured to filter at least a portion of ambient light that passes through the transparent material.

12. The apparatus of claim 9 wherein the transparent material is configured to direct at least a portion of ambient light that passes through the transparent material toward a first area of the first surface portion.

13. The apparatus of claim 12 further comprising an integrated metal grating and the first sensor structure comprising at least one optical sensor below the first area of the first surface position, wherein the integrated metal grating is below the at least one optical sensor.

14. The apparatus of claim 1 wherein:
the upper surface of the thinned flip-chip die further includes a third surface portion surrounded by the second surface portion;
the device layer further comprises a second sensor structure integrated at the top portion of the device layer, wherein the second sensor structure is below the third surface portion and not below the second surface portion; and
the first mold compound component over the second surface portion forms a second cavity over the upper surface of the thinned flip-chip die, wherein the third surface portion is exposed at the bottom of the second cavity.

15. The apparatus of claim 14 wherein the first sensor structure is the same as the second sensor structure.

16. The apparatus of claim 14 wherein the first sensor structure is different from the second sensor structure.

17. The apparatus of claim 1 wherein the upper surface of the thinned flip-chip die is an upper surface of the dielectric layer.

18. The apparatus of claim 1 wherein the device layer further comprises a multi-layer metal structure.

19. The apparatus of claim 1 wherein the first sensor structure comprises a thermistor sensor or a bolometer sensor.

20. The apparatus of claim 1 wherein the first sensor structure comprises at least one optical sensor.

21. The apparatus of claim 20 wherein the at least one optical sensor is formed from at least one PIN diode.

22. The apparatus of claim 20 wherein the device layer further comprises an integrated metal grating below the at least one optical sensor, wherein the integrated metal grating is configured to reflect received light passing through the dielectric layer back toward the at least one optical sensor.

23. The apparatus of claim 22 wherein the integrated metal grating is formed from a metal layer within the device layer.

24. The apparatus of claim 22 wherein the integrated metal grating is on a first plane and the optical sensor is on a second plane, which is above and separated from the first plane by at least 2 μm.

25. The apparatus of claim 20 wherein the device layer further comprises an integrated metal grating on a first plane and the at least one optical sensor comprises a first sensor portion and a second sensor portion on a second plane, which is above the first plane, wherein the integrated metal grating is configured to separate and reflect colors for the first sensor portion and the second sensor portion.

26. The apparatus of claim 25 wherein the integrated metal grating is configured to separate and reflect received light passing through the dielectric layer back toward the first sensor portion and the second sensor portion such that light in a first spectrum of the received light is predominantly directed toward the first sensor portion and light in a second spectrum of the received light is predominantly directed toward the second sensor portion.

27. The apparatus of claim 1 wherein the first sensor structure comprises an optical sensor array.

28. The apparatus of claim 27 further comprising a transparent material in the first cavity and residing over the first surface portion, wherein the first mold compound component is surrounding the transparent material.

29. The apparatus of claim 28 wherein the transparent material is configured to filter at least a portion of ambient light that passes through the transparent material.

30. The apparatus of claim 28 wherein the transparent material is configured to direct at least a portion of ambient light that passes through the transparent material toward a first area of the first surface portion.

31. The apparatus of claim 1 wherein the first sensor structure comprises a first optical sensor and a second optical sensor, wherein;
the first optical sensor and the second optical sensor are below the first surface portion; and
the first optical sensor is laterally adjacent to the second optical sensor.

Assignees

• Qorvo Us Inc

Inventors

• Leipold Dirk Robert Walter
• Maxim George
• Costa Julio C
• Scott Baker

Classifications

• H01L31/0203 Primary

  Electricity · mapped topic

• H01L31/105

  Electricity · mapped topic

• H01L31/02005

  Electricity · mapped topic

• H01L31/02327

  Electricity · mapped topic

• H01L37/02

  Electricity · mapped topic