Method of manufacturing a carrier tape

Patent metadata

Field	Value
Publication number	US-10020280-B2
Application number	US-201514791862-A
Country	US
Kind code	B2
Filing date	Jul 6, 2015
Priority date	Nov 2, 2009
Publication date	Jul 10, 2018
Grant date	Jul 10, 2018

Abstract

The present invention relates to a method of manufacturing a carrier tape, wherein a TAB tape including a base film having a central area and edge areas at both directions of the central area, a wiring pattern formed at the central area of the base film, a transfer area formed at the edge area of the base film and exposed by the base film, a plurality of sprocket holes arranged in a row on the transfer area and a metal pattern discretely formed from the wiring pattern, and formed at the edge areas of the base film, wherein the metal pattern is formed with a paired structure formed at both sides of the plurality of sprocket holes, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.

First claim

What is claimed is:

1. A method of manufacturing a carrier tape, comprising steps of:
forming a circuit pattern at a central area of a base film;
forming a plurality of sprocket holes in a row on a transfer area formed at a periphery of the circuit pattern;
forming a metal plating layer pattern on an external periphery of the sprocket hole in the transfer area;
forming an exposure area exposing the base film and a metal pattern discretely from the circuit pattern in the transfer area; and
forming the exposure area to expose the base film except for the metal plating layer pattern in the transfer area;
wherein the transfer area is configured to be continuously attached to the circuit pattern, and
wherein the exposure area is continuous between the sprocket holes such that the base film is exposed continuously between each sprocket hole and its adjacent sprocket holes.

2. The method of claim 1 , further comprising forming the metal pattern with a pair of plating lines at both sides of the row of the plurality of sprocket holes.

3. The method of claim 2 , wherein the metal pattern is formed to extend along a length direction of the row of the plurality of sprocket holes.

4. The method of claim 3 , wherein the structure is formed adjacent to the row of the plurality of sprocket holes.

5. The method of claim 3 , wherein the metal pattern is a predetermined spaced apart from the row of the plurality of sprocket holes.

6. The method of claim 3 , wherein the metal pattern is discrete from the row of the plurality of sprocket holes.

7. The method of claim 1 , wherein the metal pattern comprises the metal plating layer pattern.

8. The method of claim 1 , wherein the metal plating layer pattern is formed around a periphery of each of the plurality of sprocket holes.

9. The method of claim 1 , wherein the metal plating layer pattern is formed with a structure of at least one plating line.

10. The method of claim 9 , wherein the structure is formed with a plurality of the plating lines formed between each sprocket hole and its adjacent sprocket holes.

Assignees

• Lg Innotek Co Ltd

Inventors

• Hong Tae Ki
• Jo Dong Guk
• Koo Han Mo
• Lim Jun Young
• Park Ki Tae
• Cho Sang Ki
• Yoo Dae Sung
• Song Nak Ho
• Kim Joo Chul
• Jo Jae Sung

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title

• H10W72/077

  Connecting of TAB connectors · CPC title

• H10W70/688

  Flexible insulating substrates · CPC title

• H10W72/701 Primary

  Tape-automated bond [TAB] connectors · CPC title