Immersion cooling arrangements for electronic devices

Patent metadata

Field	Value
Publication number	US-10020242-B2
Application number	US-201615098810-A
Country	US
Kind code	B2
Filing date	Apr 14, 2016
Priority date	Apr 14, 2016
Publication date	Jul 10, 2018
Grant date	Jul 10, 2018

Abstract

An electronics cooling arrangement includes a housing configured to contain a coolant and an electronic device disposed within the housing. The electronic device has a passageway with at least one inlet and at least one outlet and is configured to allow fluid flowing between the inlet and the outlet to cool the electronic device.

First claim

What is claimed is:

1. An electronics cooling arrangement, comprising:
a housing configured to contain a coolant;
a dielectric coolant sealed within the housing; and
an electronic device with a printed circuit board (PCB) having a chip package coupled thereto, the electronic device disposed within the housing and submerged within the coolant,
wherein the PCB defines an inlet,
wherein the chip package defines an outlet, wherein the PCB and the chip package define within their interiors a passageway fluidly coupling the inlet with the outlet to allow fluid flowing between the inlet and the outlet to cool the electronic device,
wherein the inlet and the outlet are in fluid communication with one another externally of the passageway through an interior of the housing, wherein the outlet opens directly to the interior of the housing.

2. The electronics cooling arrangement as recited in claim 1 , further including a pump in fluid communication with the passageway.

3. The electronics cooling arrangement as recited in claim 2 , wherein the pump is configured to urge fluid through the passageway.

4. The electronics cooling arrangement as recited in claim 2 , wherein the pump is contained within the housing.

5. The electronics cooling arrangement as recited in claim 2 , further including a control module operatively connected with the pump and configured to selectively operate the pump according to heat generated by the electronic device.

6. The electronics cooling arrangement as recited in claim 1 , wherein the electronic component being submerged within a liquid phase of the dielectric coolant.

7. The electronics cooling arrangement as recited in claim 1 , wherein the electronic device includes an integrated circuit exposed to an interior of the housing.

8. The electronics cooling arrangement as recited in claim 1 , wherein the chip package includes a microchannel cooler in fluid communication with the passageway.

9. The electronics cooling arrangement as recited in claim 1 , wherein the chip package includes an integrated circuit.

10. An electronics cooling arrangement, comprising:
a housing configured to contain a coolant;
an electronic device disposed within the housing having a passageway with at least one inlet and at least one outlet, the passageway configured to allow fluid flowing between the inlet and the outlet to cool the electronic device; and
a hypodermic needle segment fluidly coupling the inlet with the passageway.

11. An immersion cooling arrangement, comprising:
a sealed housing;
a dielectric coolant disposed within the housing;
an electronic device disposed within the housing having a passageway with at least one inlet and at least one outlet, wherein the inlet is submerged within the dielectric coolant, wherein the outlet is submerged within the dielectric coolant, and wherein the inlet and the outlet are in fluid communication with one another externally of the passageway through an interior of the housing; and
a hypodermic needle segment fluidly coupling the inlet with the passageway.

12. A method of cooling an electronic device, comprising:
introducing fluid from an interior of a housing into a passageway defined by the electronic device, the electronic device including a printed circuit board (PCB) with a chip package coupled to by the PCB, wherein the coolant enters the passageway through an inlet defined by PCB,
flowing fluid through the passageway;
transferring heat from the electronic device to the fluid flowing through the passageway; and
flowing heated coolant through an outlet defined by the chip package, wherein the outlet opens directly to the interior of the housing.

13. The method of cooling an electronic device as recited in claim 12 , further comprising flowing heated coolant from the passageway into the interior of the housing.

14. The method of cooling an electronic device as recited in claim 12 , further comprising pumping coolant through the passageway.

Assignees

• Hamilton Sundstrand Corp

Inventors

• Katsumata Shin
• Shepard Charles

Classifications

• H05K7/203 Primary

  by immersion · CPC title

• H05K7/20236

  by immersion · CPC title

• H05K1/0203

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K7/20936

  Liquid coolant with phase change · CPC title

• H05K7/20327

  Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title