Composition for forming silica layer, silica layer, and electronic device

Patent metadata

Field	Value
Publication number	US-10020185-B2
Application number	US-201514720674-A
Country	US
Kind code	B2
Filing date	May 22, 2015
Priority date	Oct 7, 2014
Publication date	Jul 10, 2018
Grant date	Jul 10, 2018

Abstract

A composition for forming a silica layer including a silicon-containing polymer having a weight average molecular weight of about 20,000 to about 70,000 and a polydispersity index of about 5.0 to about 17.0 and a solvent; a silica layer manufactured using the same; and an electronic device including the silica layer.

First claim

What is claimed is:

1. A composition for forming a silica layer, comprising:
a silicon-containing polymer and a solvent, the silicon-containing polymer comprising a silicon-containing polymer having a weight average molecular weight of about 20,000 to about 50,000 and a polydispersity index of about 5.0 to about 14.0, a silicon-containing polymer having a weight average molecular weight of greater than about 50,000 and less than or equal to about 70,000 and a polydispersity index of about 11.5 to about 17.0, or a combination thereof.

2. The composition of claim 1 , wherein the silicon-containing polymer is polysilazane, polysiloxazane, or a combination thereof.

3. The composition of claim 2 , wherein the oxygen content of the silicon-containing polymer ranges from about 0.01 wt % to about 3 wt % based on 100 wt % of the silicon-containing polymer, and
the —SiH 3 group content of the silicon-containing polymer ranges from about 15% to about 40% based on the total amount of a Si—H bond in the silicon-containing polymer.

4. The composition of claim 1 , wherein the silicon-containing polymer has a polydispersity index of about 5.3 to about 15.5.

5. The composition of claim 1 , wherein the solvent comprises at least one selected from benzene, toluene, xylene, ethylbenzene, diethylbenzene, trimethylbenzene, triethylbenzene, cyclohexane, cyclohexene, decahydro naphthalene, dipentene, pentane, hexane, heptane, octane, nonane, decane, ethylcyclohexane, methylcyclohexane, cyclohexane, cyclohexene, p-menthane, dipropylether, dibutylether, anisole, butyl acetate, amyl acetate, methylisobutylketone, and a combination thereof.

6. The composition of claim 1 , wherein the silicon-containing polymer is included in an amount of about 0.1 to about 30 wt % based on the total amount of the composition for forming a silica layer.

7. A silica layer manufactured from the composition of claim 1 .

8. An electronic device comprising the silica layer of claim 7 .

9. A method of manufacturing a silica layer, the method comprising:
forming a composition for forming a silica layer, the composition comprising:
a solvent, and
a silicon-containing polymer comprising a silicon-containing polymer having a weight average molecular weight of about 20,000 to about 50,000 and a polydispersity index of about 5.0 to about 14.0, a silicon-containing polymer having a weight average molecular weight of greater than about 50,000 and less than or equal to about 70,000 and a polydispersity index of about 11.5 to about 17.0, or a combination thereof,

coating the composition on a substrate;
drying the coated substrate;
curing the dried substrate, and
forming the silica layer from the cured substrate.

10. The method of claim 9 , wherein the silicon-containing polymer is polysilazane, polysiloxazane, or a combination thereof.

11. The method of claim 10 , wherein the oxygen content of the silicon-containing polymer ranges from about 0.01 wt % to about 3 wt % based on 100 wt % of the silicon-containing polymer, and
the —SiH 3 group content of the silicon-containing polymer ranges from about 15% to about 40% based on the total amount of a Si—H bond in the silicon-containing polymer.

12. The method of claim 9 , wherein the silicon-containing polymer has a polydispersity index of about 5.3 to about 15.5.

13. The method of claim 9 , wherein the silicon-containing polymer has a weight average molecular weight of about 22,000 to about 65,000.

14. The method of claim 9 , wherein the solvent comprises at least one selected from benzene, toluene, xylene, ethylbenzene, diethylbenzene, trimethylbenzene, triethylbenzene, cyclohexane, cyclohexene, decahydro naphthalene, dipentene, pentane, hexane, heptane, octane, nonane, decane, ethylcyclohexane, methylcyclohexane, cyclohexane, cyclohexene, p-menthane, dipropylether, dibutylether, anisole, butyl acetate, amyl acetate, methylisobutylketone, and a combination thereof.

15. The method of claim 9 , wherein the silicon-containing polymer is included in an amount of about 0.1 to about 30 wt % based on the total amount of the composition for forming a silica layer.

16. A composition for forming a silica layer, comprising:
a silicon-containing polymer and a solvent, wherein the silicon-containing polymer comprises a silicon-containing polymer having a weight average molecular weight of about 46,000 to about 65,000 and a polydispersity index of about 5.0 to about 17.0.

Assignees

• Samsung Sdi Co Ltd

Inventors

• Yun Hui-Chan
• Kim Woo-Han
• Koh Sang-Ran
• Kwak Taek-Soo
• Kim Bo-Sun
• Kim Jin-Gyo
• Na Yoong-Hee
• Noh Kun-Bae
• Park Sae-Mi
• Bae Jin-Hee
• Sakong Jun
• Lee Eun-Seon
• Lim Wan-Hee
• Jang Jun-Young
• Jung Il
• Hwang Byeong-Gyu

Classifications

• H10P14/69215

  the material being a silicon oxide, e.g. SiO2 · CPC title

• H10P14/6922

  the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC · CPC title

• H10P14/6686

  the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane · CPC title

• H10P14/6342

  Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating · CPC title

• H10P14/6689 Primary

  the compound being a silazane · CPC title