Conductive particles, method of manufacturing the same, conductive resin composition containing the same, and conductive coated object

US10020090B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10020090-B2
Application numberUS-201414780403-A
CountryUS
Kind codeB2
Filing dateMar 20, 2014
Priority dateMar 28, 2013
Publication dateJul 10, 2018
Grant dateJul 10, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention relates to conductive particles. The conductive particles contain core particles containing aluminum and a metal film covering the core particles, the metal film is higher in conductivity than the core particles, and a surface coverage of the core particles with the metal film is not lower than 80%.

First claim

Opening claim text (preview).

The invention claimed is: 1. Conductive particles, comprising: core particles containing aluminum; and a metal film covering said core particles, said metal film being higher in conductivity than said core particles, a surface coverage of said core particles with said metal film being not lower than 80%, and said conductive particles having an L* value not smaller than 40. 2. The conductive particles according to claim 1 , wherein said core particles have an average particle size not smaller than 0.1 μm and not greater than 50 μm. 3. The conductive particles according to claim 1 , wherein said metal film contains at least one selected from the group consisting of gold, silver, copper, nickel, platinum, palladium, tin, zinc, cobalt, chromium, and an alloy thereof. 4. The conductive particles according to claim 1 , wherein said metal film has a thickness not smaller than 10 nm. 5. The conductive particles according to claim 1 , wherein an amount of the metal film covering said core particles is not lower than 1 mass % and not higher than 80 mass % in said conductive particles. 6. A conductive resin composition comprising the conductive particles according to claim 1 as a conductive material. 7. A coated object having a coating formed of the conductive resin composition according to claim 6 on a substrate.

Assignees

Inventors

Classifications

  • Metallic particles coated with metal · CPC title

  • Spherical particles · CPC title

  • Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties · CPC title

  • on hard metal substrates · CPC title

  • Operations & Transport · mapped topic

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Frequently asked questions

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What does patent US10020090B2 cover?
The present invention relates to conductive particles. The conductive particles contain core particles containing aluminum and a metal film covering the core particles, the metal film is higher in conductivity than the core particles, and a surface coverage of the core particles with the metal film is not lower than 80%.
Who is the assignee on this patent?
Toyo Aluminium Kk
What technology area does this patent fall under?
Primary CPC classification H01B1/22. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jul 10 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).