Connection device for a pressure sensor, pressure sensor, and method for producing a connection device

Patent metadata

Field	Value
Publication number	US-10018526-B2
Application number	US-201515119459-A
Country	US
Kind code	B2
Filing date	Feb 17, 2015
Priority date	Feb 17, 2014
Publication date	Jul 10, 2018
Grant date	Jul 10, 2018

Abstract

A connection device for a pressure sensor includes a supporting unit and a circuit board. The circuit board carries an electronic circuit having at least one of at least one electronic component and at least one electrical component. The supporting unit includes a multi-part main body that is electrically and mechanically connected to the circuit board via at least one soldered connection. The supporting unit further forms an external interface having at least one electrical contact point that enables tapping of at least one electrical output signal of the electronic circuit, and that is electrically connected to a corresponding contact point of the circuit board via an electrical connection. A pressure sensor includes such a connection device, and a method pertains to producing such a connection device.

First claim

The invention claimed is:

1. A connection device for a pressure sensor, comprising:
a supporting unit including a multi-part base body;
a circuit board electrically and mechanically connected to the multi-part base body of the supporting unit via at least one solder connection; and
an electronic circuit supported by the circuit board, and having at least one component that is at least one of electronic and electrical;
wherein:
the supporting unit defines an external interface having at least one electrical contact site that enables tapping at least one electrical output signal of the electronic circuit;
the at least one electrical contact site is electrically connected to at least one corresponding contact site of the circuit board;
the base body defines at least one mating contact site;
the base body includes at least one via that forms the at least one electrical connection between the at least one contact site of the external interface and the at least one corresponding contact site of the circuit board by;
the via is electrically connected to the at least one mating contact site in the base body; and
the at least one mating contact site is electrically and mechanically connected by at least one solder connection to the at least one corresponding contact site of the circuit board.

2. The connection device as claimed in claim 1 , wherein:
the base body of the supporting unit includes two half shells; and
each half shell respectively defines at least one contact site of the external interface.

3. The connection device as claimed in claim 2 , wherein:
each half shell includes at least one first joining geometry;
the circuit board includes at least one second joining geometry that corresponds to each at least one first joining geometry, each first joining geometry configured to cooperate with a corresponding second joining geometry to locate the half shells relative to each other and enable the mechanical connection between the half shells of the main body and the circuit board.

4. The connection device as claimed in claim 3 , wherein:
each half shell includes a third joining geometry and a fourth joining geometry, the third joining geometry of each half shell configured to cooperate with the fourth joining geometry of the other half shell to locate the half shells with respect to each other.

5. The connection device as claimed in claim 1 , further comprising:
at least one EMC contact positioned on an outer contour of the base body.

6. A pressure sensor, comprising:
a protective sleeve that defines an inner contour;
at least one measuring cell;
a circuit carrier that includes an internal interface that taps at least one electrical output signal of the at least one measuring cell; and
a connection device that includes:
a circuit board that is positioned in the protective sleeve so as to be perpendicular to the circuit carrier;
a supporting unit positioned in said protective sleeve, the supporting unit including a multi-part base body that is electrically and mechanically connected to the circuit board via at least one solder connection; and
an electronic circuit supported by the circuit board and having at least one component that is at least one of electronic and electrical, wherein the internal interface of the circuit carrier supplies the at least one electrical output signal to the electronic circuit;
the supporting unit defining an external interface having at least one electrical contact site that enables tapping at least one output signal of the electronic circuit; and
the supporting unit defining an outer contour that supports the circuit board against the inner contour of the protective sleeve;
wherein:
the base body of the supporting unit includes two half shells; and
each half shell respectively defines at least one contact site of the external interface.

7. The pressure sensor as claimed in claim 6 , wherein the base body of the supporting unit defines a protruding edge that closes the protective sleeve in a joined state.

8. The pressure sensor as claimed in claim 6 further comprising at least one EMC contact positioned on an outer contour of the base body and connected in an electrically conductive fashion on the outer contour of the base body to the inner contour of the protective sleeve.

9. The pressure sensor as claimed in claim 6 , wherein:
the base body defines at least one mating contact site;
the base body includes at least one via that forms the at least one electrical connection between the at least one contact site of the external interface and the at least one corresponding contact site of the circuit board;
the via is electrically connected to the at least one mating contact site in the base body; and
the at least one mating contact site is electrically and mechanically connected by at least one solder connection to the at least one corresponding contact site of the circuit board.

10. The pressure sensor as claimed in claim 6 , wherein:
each half shell includes at least one first joining geometry; and
the circuit board includes at least one second joining geometry that corresponds to each at least one first joining geometry, each first joining geometry configured to cooperate with a corresponding second joining geometry to locate the half shells relative to each other and enable the mechanical connection between the half shells of the main body and the circuit board.

11. The pressure sensor as claimed in claim 10 , wherein each half shell includes a third joining geometry and a fourth joining geometry, the third joining geometry of each half shell configured to cooperate with the fourth joining geometry of the other half shell to locate the half shells with respect to each other.

12. A method for producing a connection device for a pressure sensor that has a supporting unit that includes a multi-part base body having two half shells, a circuit board that is electrically and mechanically connected to the multi-part base body of the supporting unit via at least one solder connection, and an electronic circuit supported by the circuit board, and having at least one component that is at least one of electronic and electrical, the supporting unit defining an external interface having at least one electrical contact site that enables tapping at least one electrical output signal of the electronic circuit, and the at least one electrical contact site electrically connected to at least one corresponding contact site of the circuit board, the method comprising:
electrically and mechanically connecting the half shells to the circuit board when populating the circuit board with the at least one electronic component.

Assignees

• Bosch Gmbh Robert

Inventors

• Schlitzkus Michael
• Lehenberger Stefan
• Aranovich Dmitriy
• Brinks Gerald
• Diesel Peter

Classifications

• G01L19/14

  Housings {(G01L19/0007, G01L19/0084, G01L19/0092, G01L19/04, G01L19/06 take precedence)} · CPC title

• G01L19/148

  Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation · CPC title

• G01D11/30

  Supports specially adapted for an instrument; Supports specially adapted for a set of instruments · CPC title

• G01L19/0061 Primary

  Electrical connection means · CPC title

• G01L19/0084

  to the outside of the housing (other details about the housing see G01L19/14) · CPC title