Heat transfer system and method incorporating tapered flow field

Patent metadata

Field	Value
Publication number	US-10018430-B2
Application number	US-201414210616-A
Country	US
Kind code	B2
Filing date	Mar 14, 2014
Priority date	Mar 14, 2013
Publication date	Jul 10, 2018
Grant date	Jul 10, 2018

Abstract

A heat transfer system including a fluid inlet; a fluid outlet; and a substrate in fluid communication with the fluid inlet and fluid outlet, the substrate including a heat exchange region having a heat transfer surface and a flow field adjacent the heat transfer surface, the flow field including a fluid flow area including an open region at the inlet, a heat transfer region in thermal communication with the heat exchange region, and a taper of the flow field cross-sectional area in the flow direction, wherein the flow field heat transfer region includes a plurality of spaced apart open enhancement features from 1 micron to 3 mm in size, and method for enhancing the heat transfer performance of an apparatus is disclosed.

First claim

What is claimed is:

1. A method for enhancing the flow boiling heat transfer performance of an apparatus, comprising:
providing a heat transfer system comprising:
a fluid inlet;
a fluid outlet;
a substrate through which heat is transferred across, a portion of the substrate surface comprising a heat transfer region, which comprises a heat transfer surface having a plurality of enhancement features from about 1 micron to about 3 mm in height on the surface of the substrate; and
a flow field comprising an open region extending between the fluid inlet and fluid outlet and a fluidic region comprising the area between the enhancement features, the fluidic region in fluid communication with and adjacent to the open region, wherein in any cross-section of the heat transfer region fluid in the heat transfer region is in fluid communication with the open region and wherein the flow field cross-sectional area increases in the fluid flow direction by increasing the height normal to the substrate of the flow field and the open region;

flowing fluid in the fluid inlet through the flow field;
nucleating bubbles in the fluid within the heat transfer region, wherein a plurality of bubbles emerge into the open region and liquid refills the space vacated by the bubbles over the heat transfer surfaces causing the heat transfer surfaces to rewet;
flowing liquid and vapor out the fluid outlet in a manner to transfer heat through the substrate to the flow field which reduces the acceleration pressure drop as well as total pressure drop and enhances the critical heat flux and heat transfer coefficient during flow boiling.

2. The method of claim 1 , wherein the enhancement features comprise at least one of micro fins and microchannels.

3. The method of claim 1 , wherein the plurality of enhancement features is comprised of a plurality of open channels.

4. The method of claim 1 , wherein a taper is comprised of varying the density of the plurality of enhancement features.

5. The method of claim 1 , wherein a taper is comprised of varying the geometry of the plurality of enhancement features.

6. The method of claim 1 , wherein a taper comprises a ratio of the maximum fluid flow cross-sectional area to the minimum fluid flow cross-sectional area in a range of from about 1.0001 to about 1000.

7. The method of claim 6 , wherein the range is from about 1.001 to about 100.

Assignees

• Kandlikar Satish G
• Rochester Institute Tech

Inventors

• Kandlikar Satish G

Classifications

• H10W40/226

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• H10W40/73

  for cooling by change of state · CPC title

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• F28F3/02

  Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations (F28F3/08 takes precedence) · CPC title

• H01L2924/00

  Electricity · mapped topic