Method and apparatus for heat spreaders having a vapor chamber with a wick structure to promote incipient boiling

Patent metadata

Field	Value
Publication number	US-10018428-B2
Application number	US-201113169581-A
Country	US
Kind code	B2
Filing date	Jun 27, 2011
Priority date	Jun 27, 2011
Publication date	Jul 10, 2018
Grant date	Jul 10, 2018

Abstract

Methods and apparatus for a heat spreader including a vapor chamber, a fluid in the vapor chamber, a wick disposed in the vapor chamber, the wick comprising a metal wick structure, and a coating on wick comprising carbon nanotubes for promoting incipient boiling of the fluid.

First claim

What is claimed is:

1. A heat spreader system, comprising:
a vapor chamber;
a fluid in the vapor chamber;
a wick disposed in the vapor chamber, the wick comprising a metal wick structure; and
a coating disposed over one or more surfaces of the wick, the coating comprising carbon nanotubes for promoting incipient boiling of the fluid.

2. The system according to claim 1 , where the vapor chamber comprises a frame, a cover and a base, wherein the frame is formed from a first material having a first coefficient of thermal expansion (CTE) and the cover is formed form a second material having a second CTE, wherein the first CTE is greater than a reference CTE and the second CTE is less than the reference CTE.

3. The system according to claim 2 , wherein the frame comprises copper.

4. The system according to claim 2 , wherein the cover comprises a multi-layer laminate.

5. The system according to claim 4 , wherein the laminate layers comprise a first layer comprising copper and a second layer comprising molybdenum.

6. The system according to claim 1 , wherein the vapor chamber has a composite CTE matched to a CTE of a substrate for circuitry.

7. The system according to claim 6 , wherein the CTE of the substrate corresponds to GaAs.

8. The system according to claim 1 , wherein the wick is bi-porous.

9. The system according to claim 1 , wherein the wick comprises sintered copper particles.

10. The system according to claim 1 , wherein interior surfaces of the vapor chamber are copper.

11. A heat spreader system, comprising:
a vapor chamber;
a fluid in the vapor chamber;
a wick disposed in the vapor chamber, the wick comprising a metal wick structure; and
a coating disposed over one or more surfaces of the wick, the coating comprising carbon nanotubes for decreasing thermal resistance of the wick and increasing throughput of the fluid through the wick to promote incipient boiling of the fluid within the wick.

12. The system according to claim 11 , wherein the wick is bi-porous.

13. The system according to claim 11 , wherein the wick comprises sintered copper particles.

Assignees

• Altman David H
• Wasniewski Joseph R
• Gupta Anurag
• Raytheon Co

Inventors

• Altman David H
• Wasniewski Joseph R
• Gupta Anurag

Classifications

• F28F21/08

  of metal · CPC title

• F28F2265/26

  for allowing differential expansion between elements · CPC title

• F28D15/046 Primary

  characterised by the material or the construction of the capillary structure · CPC title

• F28F2255/20

  with nanostructures · CPC title

• F28F2255/18

  sintered · CPC title