Copper alloy and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-10017840-B2
Application number	US-201514694038-A
Country	US
Kind code	B2
Filing date	Apr 23, 2015
Priority date	Nov 1, 2012
Publication date	Jul 10, 2018
Grant date	Jul 10, 2018

Abstract

A copper alloy of the present invention contains 5.00 to 8.00 atomic percent of Zr and includes Cu and a Cu—Zr compound, and two phases of the Cu and the Cu—Zr compound form a mosaic-like structure which includes no eutectic phase and in which when viewed in cross section, crystals having a size of 10 μm or less are dispersed. This copper alloy is formed by a manufacturing method including a sintering step of performing spark plasma sintering on a Cu—Zr binary system alloy powder at a temperature of 0.9 Tm ° C. or less (Tm(° C.): melting point of the alloy powder) by supply of direct-currant pulse electricity, the Cu—Zr binary system alloy powder having an average grain diameter of 30 μm or less and a hypoeutectic composition which contains 5.00 to 8.00 atomic percent of Zr. The Cu—Zr compound may include at least one of Cu 5 Zr, Cu 9 Zr 2 , and Cu 8 Zr 3 .

First claim

What is claimed is:

1. A copper alloy which contains 5.00 to 8.00 atomic percent of Zr and which includes Cu and a Cu—Zr compound,
wherein two phases of the Cu and the Cu—Zr compound form a mosaic structure which includes no eutectic phase and in which when viewed in cross section, crystals having a size of 10 μm or less are dispersed.

2. The copper alloy according to claim 1 ,
wherein the Cu—Zr compound includes at least one of Cu 5 Zr, Cu 9 Zr 2 , and Cu 8 Zr 3 .

3. The copper alloy according to claim 1 , being formed from a Cu—Zr binary system alloy powder having a hypoeutectic composition by spark plasma sintering.

4. The copper alloy according to claim 3 ,
wherein after spark plasma sintering is performed on a Cu—Zr binary system alloy powder, wire drawing is performed, so that the mosaic structure elongated in the drawing direction is formed.

5. The copper alloy according to claim 3 ,
wherein after spark plasma sintering is performed on a Cu—Zr binary system alloy powder, rolling is performed, so that the mosaic structure flattened in the rolling direction is formed.

6. A method for manufacturing a copper alloy including Cu and a Cu—Zr compound, the method comprising: a sintering step of performing spark plasma sintering on a Cu—Zr binary system alloy powder at a temperature of 0.9 Tm (° C.) or less, where Tm (° C.) is the melting point of the alloy powder, by supply of direct-current pulse electricity, the Cu—Zr binary system alloy powder having an average grain diameter of 30 μm or less and a hypoeutectic composition which contains 5.00 to 8.00 atomic percent of Zr,
wherein two phases of the Cu and the Cu—Zr compound form a mosaic structure which includes no eutectic phase and in which when viewed in cross section, crystals having a size of 10 μm or less are dispersed.

7. The method for manufacturing a copper alloy according to claim 6 ,
further comprising, before the sintering step, a powdering step of forming the Cu—Zr binary system alloy powder having an average grain diameter of 30 μm or less by performing a high-pressure atomizing method on a Cu—Zr binary system alloy having the hypoeutectic composition.

8. The method for manufacturing a copper alloy according to claim 6 ,
further comprising, after the sintering step, a wire drawing step of performing wire drawing on a spark plasma sintered copper alloy.

9. The method for manufacturing a copper alloy according to claim 8 ,
wherein in the wire drawing step, when a wire drawing degree η is represented by A 0 /A (A 0 : cross-sectional area before drawing, A: cross-sectional area after drawing), the wire drawing is performed at a wire drawing degree η of 3.0 or more.

10. The method for manufacturing a copper alloy according to claim 6 ,
further comprising, after the sintering step, a rolling step of performing rolling on a spark plasma sintered copper alloy at 500° C. or less.

Assignees

• Ngk Insulators Ltd
• Univ Tohoku

Inventors

• Goto Takashi
• Kimura Hisamichi
• Inoue Akihisa
• Muramatsu Naokuni

Classifications

• C22C9/00 Primary

  Alloys based on copper · CPC title

• H01B1/026

  Alloys based on copper · CPC title

• H01B13/00

  Apparatus or processes specially adapted for manufacturing conductors or cables · CPC title

• C22F1/08

  of copper or alloys based thereon · CPC title

• B22F3/24

  After-treatment of workpieces or articles {(B22F3/1146 takes precedence)} · CPC title