Moisture curable adhesive compositions

US10017674B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10017674-B2
Application numberUS-98230610-A
CountryUS
Kind codeB2
Filing dateDec 30, 2010
Priority dateDec 31, 2009
Publication dateJul 10, 2018
Grant dateJul 10, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An adhesive composition for adhesively bonding floor coverings to a variety of substrates. The composition includes 0.2 to 10 weight percent of a plurality of irregularly shaped spacer particles of size 0.5 mm to 10 mm; 10 to 50 weight percent of a moisture curable polymer system; and 40 to 90 weight percent of additives for modifying physical properties of the composition. The adhesive has a composition such that, when cured, results in an elastomeric film of uniform thickness that exhibits controlled moisture vapor transmission and sound abatement properties. A floor structure and a method for constructing the floor structure using the adhesive composition are also provided.

First claim

Opening claim text (preview).

We claim: 1. An adhesive composition for bonding a covering to a substrate to form a laminate structure with the adhesive composition disposed between said covering and said substrate, said adhesive composition comprising a blend of the following components: a. 10 to 50 weight percent of a moisture curable polymer system; b. 0.2 to 10 weight percent of a plurality of spacer particles, wherein said particles are irregularly shaped and between 0.5 mm and 1.5 mm in size for controlling the thickness of the composition when applied to the substrate, said spacer particles have a particle size distribution of 0-5% retained by a 10 mesh screen, 60-85% retained by a 16 mesh screen, and 10-30% retained by a 20 mesh screen, and said spacer particles are comprised of an elastomeric polymer that deforms from the original shape of the polymer under installation pressure, and said spacer particles deform not more than 25% from their original shape under said installation pressure so that a continuous layer of essentially uniform thickness of the composition is disposed between the covering and the substrate and the minimum thickness of said continuous layer of composition is regulated by the size of said spacer particles; and c. 40 to 80 weight percent of additives for modifying physical properties of the composition, said additives include a filler comprising 30 to 75 weight percent of the composition to increase strength of the composition and to provide thixotropic properties for the composition. 2. An adhesive composition for bonding a covering to a substrate to form a laminate structure with the adhesive composition disposed between said covering and said substrate, said adhesive composition comprising a blend of the following components: a. 10 to 50 weight percent of a moisture curable polymer system; b. 0.2 to 10 weight percent of a plurality of spacer particles, wherein said particles are irregularly shaped and between 1 mm and 3 mm in size for controlling the thickness of the composition when applied to the substrate, said spacer particles have a particle size distribution of 0-15% retained by a 6 mesh screen, 60-85% retained by a 10 mesh screen, and 10-30% retained by an 18 mesh screen, and said spacer particles are comprised of an elastomeric polymer that deforms from the original shape of the polymer under installation pressure, and said spacer particles deform not more than 25% from their original shape under said installation pressure so that a continuous layer of essentially uniform thickness of the composition is disposed between the covering and the substrate and the minimum thickness of said continuous layer of composition is regulated by the size of said spacer particles; and c. 40 to 80 weight percent of additives for modifying physical properties of the composition, said additives include a filler comprising 30 to 75 weight percent of the composition to increase strength of the composition and to provide thixotropic properties for the composition. 3. An adhesive composition for bonding a covering to a substrate to form a laminate structure with the adhesive composition disposed between said covering and said substrate, said adhesive composition comprising a blend of the following components: a. 10 to 50 weight percent of a moisture curable polymer system; b. 0.2 to 10 weight percent of a plurality of spacer particles, wherein said particles are irregularly shaped and between 1 mm and 4 mm in size for controlling the thickness of the composition when applied to the substrate, said spacer particles have a particle size distribution of 0-5% retained by a 5 mesh screen, 60-80% retained by an 8 mesh screen, 5-20% retained by a 10 mesh screen, and 5-20% retained by an 18 mesh screen, and said spacer particles are comprised of an elastomeric polymer that deforms from the original shape of the polymer under installation pressure, and said spacer particles deform not more than 25% from their original shape under said installation pressure so that a continuous layer of essentially uniform thickness of the composition is disposed between the covering and the substrate and the minimum thickness of said continuous layer of composition is regulated by the size of said spacer particles; and c. 40 to 80 weight percent of additives for modifying physical properties of the composition, said additives include a filler comprising 30 to 75 weight percent of the composition to increase strength of the composition and to provide thixotropic properties for the composition. 4. An adhesive composition for bonding a covering to a substrate to form a laminate structure with the adhesive composition disposed between said covering and said substrate, said adhesive composition comprising a blend of the following components: a. 10 to 50 weight percent of a moisture curable polymer system; b. 0.2 to 10 weight percent of a plurality of spacer particles, wherein said particles are irregularly shaped and between 1 mm and 5 mm in size for controlling the thickness of the composition when applied to the substrate, said spacer particles have a particle size distribution of 0-5% retained by a 4 mesh screen, 20-40% retained by a 6 mesh screen, 40-55% retained by an 8 mesh screen, 0-15% retained by a 10 mesh screen, and 0-15% retained by an 16 mesh screen, and said spacer particles are comprised of an elastomeric polymer that deforms from the original shape of the polymer under installation pressure, and said spacer particles deform not more than 25% from their original shape under said installation pressure so that a continuous layer of essentially uniform thickness of the composition is disposed between the covering and the substrate and the minimum thickness of said continuous layer of composition is regulated by the size of said spacer particles; and c. 40 to 80 weight percent of additives for modifying physical properties of the composition, said additives include a filler comprising 30 to 75 weight percent of the composition to increase strength of the composition and to provide thixotropic properties for the composition. 5. The composition of claim 1 wherein said elastomeric polymer is ethylene-propylene-diene monomer. 6. The composition of claim 1 wherein said elastomeric polymer is styrene-butadiene rubber. 7. The composition of claim 1 wherein the covering is a floor covering. 8. The composition of claim 7 wherein the substrate is a floor substrate selected from the group consisting of concrete, plywood, particle or chip board, vinyl and ceramic tile, cement backer board, gypsum patch underlayments, cement patch underlayments, radiant-heat flooring, and terrazzo. 9. The composition of claim 1 wherein the filler comprises calcium carbonate and wollastonite. 10. The composition of claim 2 wherein said moisture curable polymer system is selected from the group consisting of polyurethanes, silylated polyurethanes, and silylated polyethers. 11. The composition of claim 10 wherein said moisture curable polymer system further comprises 3 to 20 weight percent of an isocyanate-reactive compound. 12. The composition of claim 2 wherein said additives are selected from the group consisting of said fillers and plasticizers, rheological modifiers, diluents, adhesion promoters, tackifying resins, fungicides/biocides, catalysts, moisture scavengers, antioxidants, defoamers, pigments, ultraviolet absorbers and stabilizers, lubricants, extenders, and combinations thereof. 13. The composition of claim 2 wherein said elastomeric polymer is ethylene-propylene-diene monomer. 14. The composition of claim 2 wherein said elastomeric polymer is styrene-butadiene rubber.

Assignees

Inventors

Classifications

  • containing only one alkylene bisphenyl group · CPC title

  • Adhesive means specially adapted therefor, e.g. adhesive foils or strips · CPC title

  • Adhesives based on polyethers obtained by reactions forming an ether link in the main chain (based on polyacetals C09J159/00; based on epoxy resins C09J163/00; based on polythioether-ethers C09J181/02; based on polyethersulfones C09J181/06); Adhesives based on derivatives of such polymers · CPC title

  • for laying flooring (made of similar material to roads or pavements E01C {; arrangements for removing of previously fixed floor covering E04G23/00}) · CPC title

  • Polyalkylene oxides · CPC title

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What does patent US10017674B2 cover?
An adhesive composition for adhesively bonding floor coverings to a variety of substrates. The composition includes 0.2 to 10 weight percent of a plurality of irregularly shaped spacer particles of size 0.5 mm to 10 mm; 10 to 50 weight percent of a moisture curable polymer system; and 40 to 90 weight percent of additives for modifying physical properties of the composition. The adhesive has a c…
Who is the assignee on this patent?
Lontchar Michael S, Chronister Michael A, Ryan Kristin J, and 1 more
What technology area does this patent fall under?
Primary CPC classification C09J175/04. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jul 10 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).