Polymer fine particle-containing curable resin composition having improved bonding strength against impact peeling

US10017673B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10017673-B2
Application numberUS-201615564890-A
CountryUS
Kind codeB2
Filing dateApr 8, 2016
Priority dateApr 9, 2015
Publication dateJul 10, 2018
Grant dateJul 10, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention relates to a curable resin composition containing 100 parts by mass of an epoxy resin (A), 1 to 100 parts by mass of polymer fine particles (B), and 1 to 100 parts by mass of a blocked urethane (C), wherein the polymer fine particles have a core-shell structure of a core layer and a shell layer, the core layer contains diene rubber, the shell layer contains at least a hydroxyl group, and the content of the hydroxyl group of the polymer fine particles (B) is 0.01 to 0.8 mmol/g.

First claim

Opening claim text (preview).

The invention claimed is: 1. A curable resin composition comprising 100 parts by mass of an epoxy resin (A), 1 to 100 parts by mass of polymer fine particles (B), and 1 to 100 parts by mass of a blocked urethane (C), wherein the polymer fine particles have a core-shell structure of a core layer and a shell layer, the core layer comprises diene rubber, the shell layer comprises at least a hydroxyl group, and the content of the hydroxyl group of the polymer fine particles (B) is 0.01 to 0.8 mmol/g. 2. The curable resin composition according to claim 1 , wherein the polymer fine particles (B) have the shell layer graft-polymerized on the core layer, and the shell layer is polymerized with a monomer having a hydroxyl group and at least one monomer selected from the group consisting of an aromatic vinyl monomer, a vinyl cyanide monomer, and a (meth)acrylate monomer. 3. The curable resin composition according to claim 1 , wherein the diene rubber is butadiene rubber and/or butadiene-styrene rubber. 4. The curable resin composition according to claim 1 , wherein the blocked urethane (C) comprises a compound including a urethane prepolymer having a polyalkylene glycol structure capped with a blocking agent. 5. The curable resin composition according to claim 1 , wherein a mass ratio of polymer fine particles (B) to blocked urethane (C) is 0.2 to 5. 6. The curable resin composition according to claim 1 , wherein the epoxy resin (A) comprises a reactive diluent of a polyepoxide, and the amount of the reactive diluent is 0.5 to 20% by mass per 100% by mass of the epoxy resin (A). 7. The curable resin composition according to claim 1 , wherein the content of the hydroxyl group of the polymer fine particles (B) is 0.01 to 0.4 mmol/g. 8. The curable resin composition according to claim 1 , wherein an epoxy curing agent (D) is contained in an amount of 1 to 80 parts by mass per 100 parts by mass of the epoxy resin (A). 9. The curable resin composition according to claim 1 , wherein a curing accelerator (E) is contained in an amount of 0.1 to 10 parts by mass per 100 parts by mass of the epoxy resin (A). 10. The curable resin composition according to claim 1 , wherein the polymer fine particles (B) are dispersed at a state of primary particles in the curable resin composition. 11. The curable resin composition according to claim 1 , wherein dynamic resistance to cleavage is more than 19 kN/m after curing the curable resin composition. 12. A cured product obtained by curing the curable resin composition as defined in claim 1 . 13. A one pack curable resin composition comprising the curable resin composition as defined in claim 1 . 14. A structural adhesive containing the curable resin composition as defined in claim 1 . 15. The curable resin composition according to claim 2 , wherein the diene rubber is butadiene rubber and/or butadiene-styrene rubber. 16. The curable resin composition according to claim 2 , wherein the blocked urethane (C) comprises a compound including a urethane prepolymer having a polyalkylene glycol structure capped with a blocking agent. 17. The curable resin composition according to claim 3 , wherein the blocked urethane (C) comprises a compound including a urethane prepolymer having a polyalkylene glycol structure capped with a blocking agent. 18. The curable resin composition according to claim 4 , wherein the blocked urethane (C) comprises a compound including a urethane prepolymer having a polypropylene glycol structure or a polytetramethylene glycol structure capped with a blocking agent.

Assignees

Inventors

Classifications

  • C09J163/00Primary

    Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

  • Alcohols or phenols · CPC title

  • from polyethers · CPC title

  • Macromolecular compounds obtained by polymerising monomers on to preformed graft polymers · CPC title

  • Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

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Frequently asked questions

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What does patent US10017673B2 cover?
The present invention relates to a curable resin composition containing 100 parts by mass of an epoxy resin (A), 1 to 100 parts by mass of polymer fine particles (B), and 1 to 100 parts by mass of a blocked urethane (C), wherein the polymer fine particles have a core-shell structure of a core layer and a shell layer, the core layer contains diene rubber, the shell layer contains at least a hydr…
Who is the assignee on this patent?
Kaneka Corp
What technology area does this patent fall under?
Primary CPC classification C09J163/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jul 10 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).