Resin composition, and prepreg and laminated sheet using the same

US10017660B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10017660-B2
Application numberUS-201113701034-A
CountryUS
Kind codeB2
Filing dateMay 31, 2011
Priority dateJun 2, 2010
Publication dateJul 10, 2018
Grant dateJul 10, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

There is provided a resin composition that exhibits excellent heat resistance, heat conductivity, and water absorption. The resin composition comprises a cyanate ester resin (A) represented by formula (I), an epoxy resin (B), and an inorganic filler (C), the content of the inorganic filler (C) being 301 to 700 parts by weight based on 100 parts by weight in total of the cyanate ester resin (A) and the epoxy resin (B) wherein Rs each independently represent a hydrogen atom or a methyl group; and n is an integer of 1 to 50.

First claim

Opening claim text (preview).

The invention claimed is: 1. A resin composition comprising: a cyanate ester resin (A) represented by formula (I); an epoxy resin (B); an inorganic filler (C), and a maleimide compound (D); the content of the cyanate ester resin (A) being 30 to 70 parts by weight based on 100 parts by weight in total of the cyanate ester resin (A) and the epoxy resin (B), the content of the epoxy resin (B) being 30 to 70 parts by weight based on 100 parts by weight in total of the cyanate ester resin (A) and the epoxy resin (B), the content of the inorganic filler (C) being 562.5 to 700 parts by weight based on 100 parts by weight in total of the cyanate ester resin (A) and the epoxy resin (B), the content of the maleimide compound (D) being 10 to 70 parts by weight based on 100 parts by weight in total of the cyanate ester resin (A) and the maleimide compound (D), wherein each R independently represents a hydrogen atom; and n is an integer of 1 to 5, wherein the epoxy resin (B) comprises a biphenylaralkyl epoxy resin the inorganic filler (C) comprises aluminum oxide, and the maleimide compound (D) comprises bis(3-ethyl-5-methyl-4-maleimidephenyl) methane. 2. A prepreg comprising: a base material; and a resin composition according to claim 1 impregnated into or coated on the base material. 3. A laminated sheet comprising a cured product of the prepreg according to claim 2 . 4. A metal foil-clad laminated sheet comprising a laminated and cured product of the prepreg according to claim 2 and a metal foil.

Assignees

Inventors

Classifications

  • Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain (C09D107/00 - C09D157/00, C09D161/00 take precedence); Coating compositions based on derivatives of such polymers · CPC title

  • Additives being defined by their diameter · CPC title

  • Nitrogen containing compounds · CPC title

  • C08L65/00Primary

    Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain (C08L7/00 - C08L57/00, C08L61/00 take precedence); Compositions of derivatives of such polymers · CPC title

  • Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors · CPC title

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What does patent US10017660B2 cover?
There is provided a resin composition that exhibits excellent heat resistance, heat conductivity, and water absorption. The resin composition comprises a cyanate ester resin (A) represented by formula (I), an epoxy resin (B), and an inorganic filler (C), the content of the inorganic filler (C) being 301 to 700 parts by weight based on 100 parts by weight in total of the cyanate ester resin (A) …
Who is the assignee on this patent?
Sogame Masanobu, Ueyama Daisuke, OHTSUKA Hajime, and 1 more
What technology area does this patent fall under?
Primary CPC classification C08L65/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jul 10 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).