Polypropylene resin foamed particles and method for producing same

US10017619B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10017619-B2
Application numberUS-201715695293-A
CountryUS
Kind codeB2
Filing dateSep 5, 2017
Priority dateMar 13, 2015
Publication dateJul 10, 2018
Grant dateJul 10, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

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Expanded polypropylene resin particles include a polypropylene resin as a base material resin, wherein the polypropylene resin has a flexural modulus of 750 MPa to 1100 MPa. The flexural modulus and a melting point of the expanded polypropylene resin particles satisfy Expression (1): [Flexural modulus (MPa)]<31.19×[Melting point (° C.)]−3500, wherein the melting point of the expanded polypropylene resin particles is a melting point of 141.5° C. to 150.0° C. in a second differential scanning calorimetry (DSC) curve of a second temperature increase, the second DSC curve being obtained when the expanded polypropylene resin particles are heated from 40° C. to 220° C. at a temperature increase rate of 10° C./min in a first temperature increase, then cooled from 220° C. to 40° C. at a temperature decrease rate of 10° C./min, and heated again from 40° C. to 220° C. at a temperature increase rate of 10° C./min in the second temperature increase.

First claim

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What is claimed is: 1. Expanded polypropylene resin particles comprising a polypropylene resin as a base material resin, wherein the polypropylene resin has a flexural modulus of 750 MPa to 1100 MPa, wherein the flexural modulus and a melting point of the expanded polypropylene resin particles satisfy Expression (1): [Flexural modulus (MPa)]<31.19×[Melting point (° C.)]−3500 wherein the melting point of the expanded polypropylene resin particles is a melting point of 141.5° C. to 150.0° C. in a second differential scanning calorimetry (DSC) curve of a second temperature increase and the expanded polypropylene resin particles have a high temperature melting heat quantity ratio [(j/J)×100(%)] of 15% to less than 20% in the second DSC curve; or the melting point of the expanded polypropylene resin particles is a melting point of higher than 145.0° C. to 150.0° C. in the second DSC curve, wherein the second DSC curve is obtained when the expanded polypropylene resin particles are heated from 40° C. to 220° C. at a temperature increase rate of 10° C./min in a first temperature increase, then cooled from 220° C. to 40° C. at a temperature decrease rate of 10° C./min, and heated again from 40° C. to 220° C. at a temperature increase rate of 10° C./min in the second temperature increase, wherein the high temperature melting heat quantity ratio is a ratio of a melting heat quantity (j) from the melting point to a melting end temperature to an entire resin melting heat quantity (J) in the second DSC curve, wherein the expanded polypropylene resin particles have, in a first DSC curve obtained in the first temperature increase, a main endothermic peak having an apex temperature of 130.0° C. to 145.0° C. and at least one endothermic peak on a high temperature side of the main endothermic peak, and wherein the melting point in the second DSC curve is 5.0° C. to 15.0° C. higher than the apex temperature of the main endothermic peak in the first DSC curve. 2. The expanded polypropylene resin particles according to claim 1 , wherein the melting point of the second DSC curve is higher than 145.0° C. to 150.0° C. 3. The expanded polypropylene resin particles according to claim 1 , wherein the melting point in the second DSC curve is 5.5° C. to 10.0° C. higher than the apex temperature of the main endothermic peak in the first DSC curve. 4. The expanded polypropylene resin particles according to claim 3 , wherein the melting point in the second DSC curve is 5.5° C. to 8.0° C. higher than the apex temperature of the main endothermic peak in the first DSC curve. 5. The expanded polypropylene resin particles according to claim 1 , wherein the apex temperature of the main endothermic peak in the first DSC curve is 133.0° C. to 142.0° C. 6. The expanded polypropylene resin particles according to claim 1 , wherein the melting point in the second DSC curve is higher than 145.0° C. to 148.0° C. 7. The expanded polypropylene resin particles according to claim 1 , wherein the polypropylene resin has a flexural modulus of 800 MPa to 1050 MPa. 8. The expanded polypropylene resin particles according to claim 1 , wherein the base material resin comprises a polyethylene resin in an amount of 1 part by weight to 20 parts by weight with respect to 100 parts by weight of the polypropylene resin. 9. The expanded polypropylene resin particles according to claim 1 , wherein the polypropylene resin comprises a first polypropylene resin having a melting point of 130.0° C. to 140.0° C. and a second polypropylene resin having a melting point of 145.0° C. to 165.0° C. 10. The expanded polypropylene resin particles according to claim 9 , wherein the polypropylene resin comprises the first polypropylene resin and the second polypropylene resin in a total amount of 100 weight %, wherein the first polypropylene resin accounts for 50 weight % to 70 weight %, and the second polypropylene resin accounts for 30 weight % to 50 weight %. 11. The expanded polypropylene resin particles according to claim 1 , wherein a 1-butene-containing structural unit is present, as a comonomer, in an amount of 1 weight % to 15 weight % with respect to 100 weight % of polypropylene resin. 12. The expanded polypropylene resin particles according to claim 1 , wherein a 1-butene-containing structural unit is present, as a comonomer, in an amount of 1.5 weight % to 11 weight % with respect to 100 weight % of polypropylene resin. 13. A polypropylene resin in-mold expanded molded product obtained by molding the expanded polypropylene resin particles according to claim 1 . 14. The polypropylene resin in-mold expanded molded product according to claim 13 , wherein the polypropylene resin in-mold expanded molded product has a molded product density and a 50%-strained compressive strength that satisfy Expression (2): [50%-strained compressive strength (MPa)]≥0.0069×[Molded product density (g/L)]+0.018. 15. A method for producing expanded polypropylene resin particles, comprising: placing in a pressure-resistant vessel a mixture comprising polypropylene resin particles, water, and an inorganic gas foaming agent, the polypropylene resin particles comprising a polypropylene resin as a base material resin; dispersing the polypropylene resin particles by stirring the mixture, obtaining a dispersion liquid; increasing a temperature and an internal pressure of the pressure-resistant vessel; and releasing the dispersion liquid from the pressure-resistant vessel into a pressure region to expand the polypropylene resin particles, the pressure region having a pressure lower than the internal pressure of the pressure-resistant vessel, wherein the polypropylene resin has a flexural modulus of 750 MPa to 1100 MPa, wherein the flexural modulus and a melting point of the expanded polypropylene resin particles satisfy Expression (1): [Flexural modulus (MPa)]<31.19×[Melting point (° C.)]−3500 wherein the melting point of the expanded polypropylene resin particles is a melting point of 141.5° C. to 150.0° C. in a second differential scanning calorimetry (DSC) curve of a second temperature increase and the expanded polypropylene resin particles have a high temperature melting heat quantity ratio [(j/J)×100(%)] of 15% to less than 20% in the second DSC curve; or the melting point of the expanded polypropylene resin particles is a melting point of higher than 145.0° C. to 150.0° C. in the second DSC curve, wherein the second DSC curve is obtained when the expanded polypropylene resin particles are heated from 40° C. to 220° C. at a temperature increase rate of 10° C./min in a first temperature increase, then cooled from 220° C. to 40° C. at a temperature decrease rate of 10° C./min, and heated again from 40° C. to 220° C. at a temperature increase rate of 10° C./min in the second temperature increase, wherein the high temperature melting heat quantity ratio is a ratio of a melting heat quantity (j) from the melting point to a melting end temperature to an entire resin melting heat quantity (J) in the second DSC curve, wherein the expanded polypropylene resin particles have, in a first DSC curve obtained in the first temperature increase, a main endothermic peak having an apex temperature of 130.0° C. to 145.0° C. and at least one endothermic peak on a high temperature side of the main endothermic peak, and wherein the melting point in the second DSC curve is 5.0° C. to 15.0° C. higher than the apex temperature of the main endothermic peak in the first DSC curve. 16. The method according to claim 15 , wherein the releasing is performed at a temperature of the pressure region

Assignees

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Classifications

  • developing carbon dioxide · CPC title

  • Extrusion of the foamable blend · CPC title

  • Polyethene · CPC title

  • by impregnating polymer particles with the blowing agent · CPC title

  • Copolymers of propene (C08J2323/16 takes precedence) · CPC title

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What does patent US10017619B2 cover?
Expanded polypropylene resin particles include a polypropylene resin as a base material resin, wherein the polypropylene resin has a flexural modulus of 750 MPa to 1100 MPa. The flexural modulus and a melting point of the expanded polypropylene resin particles satisfy Expression (1): [Flexural modulus (MPa)]<31.19×[Melting point (° C.)]−3500, wherein the melting point of the expanded polypropyl…
Who is the assignee on this patent?
Kaneka Corp
What technology area does this patent fall under?
Primary CPC classification C08J9/16. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jul 10 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).