Modified phenolic resin, method for producing modified phenolic resin, modified epoxy resin, method for producing modified epoxy resin, curable resin composition, cured product of same, and printed wiring board

Patent metadata

Field	Value
Publication number	US-10017604-B2
Application number	US-201414784771-A
Country	US
Kind code	B2
Filing date	Feb 27, 2014
Priority date	Apr 19, 2013
Publication date	Jul 10, 2018
Grant date	Jul 10, 2018

Abstract

Provided are a modified epoxy resin and a modified epoxy resin whose cured products exhibit good heat resistance and dielectric properties, methods for producing these, a curable resin composition, a cured product of the curable resin composition, and a printed wiring substrate. A modified phenolic resin comprises a phenolic resin structure (A), wherein at least one aromatic nucleus (a) in the phenolic resin structure (A) has, as a substituent, a structural segment (1) represented by structural formula (1) below:

In the formula, Ar each independently represent a phenyl group, a naphthyl group, or a structural segment having, on an aromatic nucleus of a phenyl or naphthyl group, at least one substituent selected from the group consisting of an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, a halogen atom, a phenyl group, and an aralkyl group.

First claim

The invention claimed is:

1. A modified phenolic resin comprising a phenolic resin structure (A), wherein at least one aromatic nucleus (a) in the phenolic resin structure (A) has, as a substituent, a structural segment (1) represented by structural formula (1) below:

(In the formula, Ar each independently represent a phenyl group, a naphthyl group, or a structural segment having, on an aromatic nucleus of a phenyl or naphthyl group, at least one substituent selected from the group consisting of an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, a halogen atom, a phenyl group, and an aralkyl group).

2. The modified phenolic resin according to claim 1 , wherein the phenolic resin structure (A) is any one selected from a bisphenol-type resin structure (A1), a novolac-type phenolic resin structure (A2), an aralkyl-type phenolic resin structure (A3), a resin structure (A4) having phenolic skeletons connected through an alicyclic hydrocarbon group, and a resin structure (A5) that contains a structural segment represented by structural formula (2) below:
[Chem. 2]
-Ph-M-An-  (2)

(In the formula, Ph represents a phenolic-hydroxyl-group-containing aromatic hydrocarbon group, M represents a divalent hydrocarbon group selected from a methylene group, an alkylidene group, and an aromatic-hydrocarbon-structure-containing methylene group, and An represents an alkoxy-group-containing fused polycyclic aromatic hydrocarbon group).

3. A method for producing a modified phenolic resin, comprising inducing a phenolic resin (I) to react with a compound (II) represented by structural formula (3) below:

(In the formula, X represents a hydroxyl group or a halogen atom, and Ar each independently represent a phenyl group, a naphthyl group, or a structural segment having, on an aromatic nucleus of a phenyl or naphthyl group, at least one substituent selected from the group consisting of an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, a halogen atom, a phenyl group, and an aralkyl group),
the reaction being conducted in such a manner that there is 0.1 to 2.0 mol of the compound (II) per mole of a phenolic hydroxyl group contained in the phenolic resin (I).

4. A modified phenolic resin obtained by the method according to claim 3 .

5. A modified epoxy resin comprising a polyglycidyl ether structure (B) of a phenolic resin, wherein at least one aromatic nucleus (a) in the polyglycidyl ether structure (B) of a phenolic resin has, as a substituent, a structural segment (1) represented by structural formula (1) below:

(In the formula, Ar each independently represent a phenyl group, a naphthyl group, or a structural segment having, on an aromatic nucleus of a phenyl or naphthyl group, at least one substituent selected from the group consisting of an alkyl group having 1to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, a halogen atom, a phenyl group, and an aralkyl group).

6. The modified epoxy resin according to claim 5 , wherein the polyglycidyl ether structure (B) of a phenolic resin is any one selected from a polyglycidyl ether structure (B1) of a bisphenol-type resin, a polyglycidyl ether structure (B2) of a novolac-type phenolic resin, a polyglycidyl ether structure (B3) of an aralkyl-type phenolic resin, a polyglycidyl ether structure (B4) of a resin having phenolic skeletons connected through an alicyclic hydrocarbon group, and a resin structure (B5) represented by structural formula (2) below:
[Chem. 5]
-Ph-M-An-  (2)

(In the formula, Ph represents a glycidyl-ether-group-containing aromatic hydrocarbon group, M represents a divalent hydrocarbon group selected from a methylene group, an alkylidene group, and an aromatic-hydrocarbon-structure-containing methylene group, and An represents an alkoxy-group-containing fused polycyclic aromatic hydrocarbon group).

7. A method for producing a modified epoxy resin, comprising inducing a phenolic resin (I) to react with a compound (II) represented by structural formula (3) below:

(In the formula, X represents a hydroxyl group or a halogen atom, and Ar each independently represent a phenyl group, a naphthyl group, or a structural segment having, on an aromatic nucleus of a phenyl or naphthyl group, at least one substituent selected from the group consisting of an alkyl group having 1 to 4 carbon atoms, an alkoxy group having 1 to 4 carbon atoms, a halogen atom, a phenyl group, and an aralkyl group),
the reaction being conducted in such a manner that there is 0.1 to 2.0 mol of the compound (II) per mole of a phenolic hydroxyl group contained in the phenolic resin (I), and inducing the resulting modified phenolic resin to react with an epihalohydrin.

8. A modified epoxy resin obtained by the method according to claim 7 .

9. A curable resin composition comprising the modified phenolic resin according to claim 1 and a curing agent.

10. A curable resin composition comprising the modified epoxy resin according to claim 5 and a curing agent.

11. A cured product obtained by curing the curable resin composition according to claim 9 .

12. A printed wiring substrate obtained by impregnating a reinforcing substrate with a varnish composition containing the curable resin composition according to claim 9 and an organic solvent, placing a copper foil on the reinforcing substrate, and performing thermal press-bonding.

Assignees

• Dainippon Ink & Chemicals

Inventors

• Nakamura Takamitsu
• Watanabe Hajime
• Hayashi Koji
• Murata Yoshiaki

Classifications

• C08G8/28 Primary

  Chemically modified polycondensates · CPC title

• H05K3/22

  Secondary treatment of printed circuits {(H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107)} · CPC title

• C08G61/02 Primary

  Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• C08G59/08

  from phenol-aldehyde condensates · CPC title