System and method for a MEMS transducer

Patent metadata

Field	Value
Publication number	US-10017379-B2
Application number	US-201715492193-A
Country	US
Kind code	B2
Filing date	Apr 20, 2017
Priority date	Jun 24, 2015
Publication date	Jul 10, 2018
Grant date	Jul 10, 2018

Abstract

According to an embodiment, a microelectromechanical systems (MEMS) transducer includes a substrate with a first cavity that passes through the substrate from a backside of the substrate. The MEMS transducer also includes a perforated first electrode plate overlying the first cavity on a topside of the substrate, a second electrode plate overlying the first cavity on the topside of the substrate and spaced apart from the perforated first electrode plate by a spacing region, and a gas sensitive material in the spacing region between the perforated first electrode plate and the second electrode plate. The gas sensitive material has an electrical property that is dependent on a concentration of a target gas.

First claim

What is claimed is:

1. A method of fabricating a microelectromechanical systems (MEMS) sensor, the method comprising:
forming a first electrode plate on a substrate, wherein the first electrode plate comprises a perforated backplate and a perforated first electrode plate;
forming a second electrode plate spaced apart from the first electrode plate, wherein the second electrode plate comprises a deflectable membrane;
exposing a bottom surface of the first electrode plate by etching a cavity in a backside of the substrate;
releasing the first electrode plate and the second electrode plate; and
forming a gas sensitive material between the first electrode plate and the second electrode plate, wherein forming the gas sensitive material comprises forming the gas sensitive material in a first region over the perforated backplate and forming an air gap in a second region over the perforated backplate, and wherein forming the second electrode plate comprises forming the deflectable membrane over the air gap in the second region.

2. The method of claim 1 , wherein forming the gas sensitive material comprises dispensing the gas sensitive material as a liquid into a region between the first electrode plate and the second electrode plate after releasing the first electrode plate and the second electrode plate.

3. The method of claim 2 , wherein dispensing the gas sensitive material as a liquid comprises dispensing polyimide as a liquid.

4. The method of claim 1 , wherein forming the gas sensitive material comprises depositing the gas sensitive material on the first electrode plate before forming the second electrode plate.

5. The method of claim 1 , wherein the gas sensitive material comprises a gas sensitive dielectric material with a dielectric constant that is proportional to a concentration of a target gas.

6. The method of claim 1 , wherein the first region is a peripheral region and the second region is a central region.

7. The method of claim 1 , wherein the second region is a peripheral region and the first region is a central region.

8. The method of claim 1 , further comprising:
forming the perforated backplate simultaneous to forming the perforated first electrode plate, wherein the perforated backplate and the perforated first electrode plate are formed of a same semiconductor layer; and
forming the deflectable membrane simultaneous to forming the second electrode plate, wherein the deflectable membrane and the second electrode plate are formed of a same semiconductor layer, and wherein the deflectable membrane is spaced apart from the perforated backplate.

9. The method of claim 1 , further comprising forming a heating element thermally coupled to the gas sensitive material.

10. The method of claim 1 , further comprising forming a temperature sensing element on the substrate.

11. A method fabricating a microelectromechanical systems (MEMS) sensor, the method comprising:
depositing a first electrode layer over a topside of a substrate;
patterning the first electrode layer to form a first electrode plate;
forming a gas-sensitive material over the first electrode plate, wherein the gas-sensitive material has an electrical property that is dependent on a concentration of a target gas;
depositing a second electrode layer over the gas-sensitive material;
patterning the second electrode layer to form a second electrode plate;
etching the substrate from a backside of the substrate to form a first cavity, the first cavity exposing a surface of the first electrode layer directed away from the gas-sensitive material;
etching the substrate from the backside of the substrate to form a second cavity; and
integrating a MEMS acoustic transducer on the substrate, the MEMS acoustic transducer comprising a perforated backplate overlying the second cavity, and a deflectable membrane overlying the second cavity and spaced apart from the perforated backplate.

12. The method of claim 11 , wherein patterning the first electrode layer comprises a photolithographic process.

13. The method of claim 11 , wherein the first electrode layer comprises polysilicon.

14. The method of claim 11 , wherein etching the substrate from the backside of the substrate to form the first cavity is simultaneous to etching the substrate from the backside of the substrate to form the second cavity.

15. The method of claim 11 , wherein integrating the MEMS acoustic transducer on the substrate comprises:
patterning the first electrode layer to form the perforated backplate; and
patterning the second electrode layer to form the deflectable membrane.

16. The method of claim 11 , wherein the target gas is water vapor and the gas-sensitive material is a humidity sensitive material.

17. The method of claim 16 , wherein the humidity sensitive material comprises a polyimide.

18. The method of claim 5 , wherein the target gas comprises at least one of hydrogen, carbon dioxide, oxygen, ethylene, or ammonia.

19. The method of claim 18 , wherein the target gas comprises hydrogen, and wherein the gas sensitive material comprises a ferroelectric material.

20. The method of claim 18 , wherein the target gas comprises carbon dioxide, and wherein the gas sensitive material comprises a fluoropolymer material.

Assignees

• Infineon Technologies Ag

Inventors

• Rajaraman Vijaye Kumar
• Arnanthigo Yonsuang
• Dehe Alfons
• Kolb Stefan

Classifications

• B81B3/0018

  Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators · CPC title

• B81B2201/0278

  Temperature sensors · CPC title

• H04R19/04

  Microphones (H04R19/01 takes precedence) · CPC title

• H04R19/005

  using semiconductor materials · CPC title

• H04R31/003

  for diaphragms or their outer suspension · CPC title