Rotational assembly method and apparatus

US10016933B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10016933-B2
Application numberUS-201414183253-A
CountryUS
Kind codeB2
Filing dateFeb 18, 2014
Priority dateApr 23, 2013
Publication dateJul 10, 2018
Grant dateJul 10, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The described embodiments relate generally to methods of assembly of electronic devices. In particular, a rotationally induced pressure is used to activate a securing mechanism positioned between a component and an enclosure. The component and the securing mechanism may be located in an inaccessible region of the enclosure such that traditional, direct, assembly processes may not be feasible. The securing mechanism may take the form of a layer of pressure sensitive adhesive or a fastener between the component and an interior surface of the enclosure.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for rotationally assembling an electronic device having a housing, the housing having walls that define a cavity suitable for carrying a component including a securing feature, the method comprising: positioning the securing feature within the cavity such that the securing feature is radially disposed from an axis of rotation about which the housing is capable of being rotated; and securing the securing feature to at least one of the walls by rotating the housing about the axis of rotation, wherein rotation of the housing causes the component to exert an amount of compressive force at the securing feature in a direction radially disposed from the axis of rotation. 2. The method of claim 1 , wherein the housing includes an opening that leads into the cavity, and the securing feature and the component are inaccessible from the opening. 3. The method of claim 1 , wherein the rotation of the housing, further causes the at least one wall to exert an additional amount of compressive force at the securing feature that opposes the amount of compressive force. 4. The method of claim 1 , wherein the amount of compressive force that is exerted at the securing feature is perpendicular to the axis of rotation. 5. The method of claim 1 , wherein the amount of compressive force is related to a predetermined rotational velocity of the housing, and the predetermined rotational velocity includes at least one of a ramping up portion, a constant velocity portion, or a ramping down portion. 6. The method of claim 5 , wherein the constant velocity portion corresponds to a predetermined length of time for activating the securing feature. 7. The method of claim 3 , wherein the amount of compressive force includes a reactive force and the additional amount of compressive force includes a centripetal force. 8. An assembly apparatus for rotationally assembling a component within an enclosure for an electronic device, wherein the enclosure includes walls that define an internal cavity capable of carrying the component that includes a securing mechanism that is inaccessible from an opening of the enclosure, the assembly apparatus comprising: a rotary table that secures the enclosure that carries the component and the securing mechanism, wherein the securing mechanism is radially disposed from an axis of rotation of the rotary table; and a motor coupled to the rotary table, the motor capable of rotating the rotary table about the axis of rotation to generate a rotational compressive force at the securing mechanism in a direction that is radially disposed from the axis of rotation; thereby causing the component to become secured to at least one of the walls via the securing mechanism. 9. The assembly apparatus of claim 8 , wherein the enclosure is secured to the rotary table via fixtures. 10. The assembly apparatus of claim 9 , wherein the fixtures are coupled to the rotary table via a displaceable member. 11. The assembly apparatus of claim 10 , wherein the displaceable member comprises a spring. 12. The assembly apparatus of claim 8 , wherein the rotational compressive force is related to a rotational velocity of the enclosure. 13. The assembly apparatus of claim 8 , wherein the rotational compressive force is related to a distance from the axis of rotation and the securing mechanism. 14. The assembly apparatus of claim 8 , wherein the securing mechanism comprises a mechanical fastener or a pressure sensitive adhesive. 15. The method of claim 1 , wherein the securing feature includes a mechanical fastener or a pressure sensitive adhesive. 16. The method of claim 1 , wherein the securing feature is laterally compressed during the rotation of the housing. 17. The method of claim 1 , further comprising: securing the housing to a surface of a rotary table, wherein the housing is secured to the surface via a fixture; and securing the fixture to a displaceable member, the displaceable member being associated with the axis of rotation of the rotary table, wherein the displaceable member allows the fixture to move towards or away from the axis of rotation during rotation of the rotary table. 18. A system for rotationally assembling an electronic device, the system comprising: a controller unit that provides a control signal; and a rotary table coupled to a driving mechanism, the rotary table capable of carrying an enclosure for the electronic device, the enclosure including an internal cavity capable of carrying a component having a securing feature, wherein the driving mechanism causes the rotary table to rotate relative to an axis of rotation about which the enclosure is capable of being rotated when the control signal is received from the controller unit, thereby causing a compressive force having a direction that is radially disposed from the axis of rotation to be applied to the securing feature. 19. The system of claim 18 , wherein the compressive force is related to a predetermined rotational velocity of the enclosure. 20. The system of claim 18 , wherein the compressive force includes a reactive force and a centripetal force, and the reactive force and the centripetal force oppose each other.

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What does patent US10016933B2 cover?
The described embodiments relate generally to methods of assembly of electronic devices. In particular, a rotationally induced pressure is used to activate a securing mechanism positioned between a component and an enclosure. The component and the securing mechanism may be located in an inaccessible region of the enclosure such that traditional, direct, assembly processes may not be feasible. T…
Who is the assignee on this patent?
Apple Inc
What technology area does this patent fall under?
Primary CPC classification B29C65/4825. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 10 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).