Processing tool cleaning using laser ablation

US10016792B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10016792-B2
Application numberUS-201615293349-A
CountryUS
Kind codeB2
Filing dateOct 14, 2016
Priority dateOct 14, 2016
Publication dateJul 10, 2018
Grant dateJul 10, 2018

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

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Provided are methods for cleaning processing tools from residue using laser ablation. Also provided are processing tools comprising non-metal base portions and protective optical layers that cover and shield these base portions from laser ablation. For example, a protective optical layer may reflect a laser beam used for ablating the tool. Methods of forming these protective optical layers on non-metal base portions are also provided. In some embodiments, this protective optical layer is the outermost layer exposed to the environment. Alternatively, the protective optical layer may be covered by a release layer. The release layer may be retained or removed during laser ablation. In some embodiments, light emitted by a processing tool during laser ablation is analyzed to determine performance of its protective optical layer. This feedback may be used to control the laser ablation such as to control orientation of the laser beam relative to the processing tool.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for cleaning residue using laser ablation from a mold used for forming composite parts, the method comprising: providing the mold comprising a base portion, a protective optical layer disposed over the base portion, and a release layer disposed over the protective optical layer and forming a surface of the mold; wherein the base portion comprises a non-metal material, and wherein the release layer comprises a material selected from the group consisting of a silicone release agent, a fluoropolymer resin, and a polysilazane resin; and exposing the surface of the mold to a laser beam, wherein the protective optical layer comprises a reflective material and blocks the laser beam from reaching the base portion, and wherein exposing the surface comprises emitting a light by the mold and ablating the residue away from the surface, wherein the light emitted by the mold is at least in part reflected by the protective optical layer. 2. The method of claim 1 , wherein the reflective material is selected from the group consisting of metal flakes and ceramic flakes. 3. The method of claim 1 , wherein the release layer is transparent to the laser beam. 4. The method of claim 1 , wherein the release layer is retained while exposing the surface to the laser beam. 5. The method of claim 1 , wherein the release layer is removed while exposing the surface to the laser beam. 6. The method of claim 1 , further comprising monitoring the light emitted by the mold. 7. The method of claim 1 , wherein exposing the surface of the mold to the laser beam comprises removing the release layer from the protective optical layer and further comprising forming a replacement release layer over the protective optical layer after removing the release layer. 8. The method of claim 6 , wherein monitoring the light emitted by the mold comprises determining the wavelength of the light emitted by the mold. 9. The method of claim 6 , further controlling a position of the mold relative to the laser beam based on monitoring the light emitted by the mold. 10. The method of claim 8 , wherein the wavelength of the light emitted by the mold changes when the protective optical layer becomes exposed, while exposing the surface of the mold to the laser beam. 11. The method of claim 8 , wherein determining the wavelength of the light emitted by the mold comprises monitoring changes in the wavelength to determine when the residue is ablated away from the surface. 12. The method of claim 11 , wherein exposing the surface of the mold to the laser beam comprises removing the release layer from the protective optical layer, and wherein determining the wavelength of the light emitted by the mold further comprises monitoring changes in the wavelength to determine when the release layer is removed from the protective optical layer. 13. A method for cleaning residue using laser ablation from a mold used for forming composite parts the method comprising: providing the mold comprising a base portion and a protective optical layer disposed over the base portion and forming a surface of the mold, wherein the base portion comprises a non-metal material, and wherein the protective optical layer comprises a release material selected from the group consisting of a silicone release agent, a fluoropolymer resin, and a polysilazane resin; and exposing the surface of the mold to a laser beam, wherein the protective optical layer blocks the laser beam from reaching the base portion, and wherein exposing the surface comprises emitting a light by the mold and ablating the residue away from the surface, wherein the light emitted by the mold is at least in part reflected by the protective optical layer.

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What does patent US10016792B2 cover?
Provided are methods for cleaning processing tools from residue using laser ablation. Also provided are processing tools comprising non-metal base portions and protective optical layers that cover and shield these base portions from laser ablation. For example, a protective optical layer may reflect a laser beam used for ablating the tool. Methods of forming these protective optical layers on n…
Who is the assignee on this patent?
Boeing Co
What technology area does this patent fall under?
Primary CPC classification B08B7/0042. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jul 10 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).