Current, temperature or electromagnetic actuated fasteners

US10016024B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10016024-B2
Application numberUS-201615063265-A
CountryUS
Kind codeB2
Filing dateMar 7, 2016
Priority dateSep 10, 2013
Publication dateJul 10, 2018
Grant dateJul 10, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A method of bonding or debonding objects includes providing a first object including a first substrate with moveable features thereon which provide an actuated and a non-actuated state having different protrusion from the first substrate or a different curvature. A second object has an array of loops thereon. The moveable features while in one of the actuated state and non-actuated state are positioned, sized and shaped to fit within the loops. The moveable features include or are mechanically coupled to a material which responds to application of an actuating condition including electrical current, temperature, or an electromagnetic field by changing between the actuated state and the non-actuated state. Electrical current, temperature, or an electromagnetic field is automatically applied or changed to trigger a state change between the actuated state and non-actuated state that results in a bonding event or a debonding event between the first object and the second object.

First claim

Opening claim text (preview).

The invention claimed is: 1. A method of bonding or debonding objects, the method comprising: triggering a state change between an actuated state and a non-actuated state in a first object, said first object including a first substrate with a 2-dimensional (2D) array of rigid moveable engagers thereon that each provide said actuated state and said non-actuated state, said rigid moveable engagers including cat-claw shaped engagers, and said cat-claw shaped engagers being coupled to respective actuators, wherein: said rigid moveable engagers while in one of said actuated state and said non-actuated state are positioned, sized and shaped to fit within a 2D array of loops; said rigid moveable engagers respond to an actuating condition by changing between said actuated state and said non-actuated state; said cat-claw shaped engagers are rigid in both said actuated state and said non-actuated state; and said cat-claw shaped engagers have a same shape in both said actuated state and said non-actuated state; and said state change results in a bonding event or a debonding event between: said first object; and a second object having said 2D array of loops on a second substrate. 2. The method of claim 1 , wherein said actuating condition comprises an electromagnetic field. 3. The method of claim 1 , wherein said actuating condition comprises an electrical current. 4. The method of claim 1 , wherein said actuators include a bimetal actuator or a shape memory alloy (SMA) actuator. 5. A fastener, comprising: a first object including a first substrate with a 2-dimensional (2D) array of rigid moveable engagers thereon that each provide an actuated state and a non-actuated state, said rigid moveable engagers including cat-claw shaped engagers, and said cat-claw shaped engagers being coupled to respective actuators; and a second object having a 2D array of loops on a second substrate, wherein said rigid moveable engagers while in one of said actuated state and said non-actuated state are positioned, sized and shaped to fit within said array of loops; wherein: said rigid moveable engagers are responsive to an actuating condition by changing between said actuated state and said non-actuated state; said cat-claw shaped engagers are rigid in both said actuated state and said non-actuated state; said cat-claw shaped engagers have a same shape in both said actuated state and said non-actuated state; and triggering a state change between said actuated state and said non-actuated state results in a bonding event or a debonding event between said first object and said second object. 6. The fastener of claim 5 , wherein said actuators include a bimetal actuator or a shape memory alloy (SMA) actuator. 7. The fastener of claim 5 , wherein said actuating condition comprises an electromagnetic field. 8. The fastener of claim 5 , wherein said actuating condition comprises an electrical current.

Assignees

Inventors

Classifications

  • Attaching means · CPC title

  • Assembling or joining · CPC title

  • A44B18/008Primary

    Hooks or loops provided with means to reinforce the attachment, e.g. by adhesive means (tab fastener elements for absorbent pads combining adhesive and mechanical fastening A61F13/581) · CPC title

  • Shape memory materials · CPC title

  • having several, repeating, interlocking formations along length of filaments · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10016024B2 cover?
A method of bonding or debonding objects includes providing a first object including a first substrate with moveable features thereon which provide an actuated and a non-actuated state having different protrusion from the first substrate or a different curvature. A second object has an array of loops thereon. The moveable features while in one of the actuated state and non-actuated state are po…
Who is the assignee on this patent?
Texas Instruments Inc
What technology area does this patent fall under?
Primary CPC classification A44B18/008. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Jul 10 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).