Semiconductor microwave oven and microwave feeding structure thereof

Patent metadata

Field	Value
Publication number	US-10015846-B2
Application number	US-201214355270-A
Country	US
Kind code	B2
Filing date	Sep 14, 2012
Priority date	Oct 31, 2011
Publication date	Jul 3, 2018
Grant date	Jul 3, 2018

Abstract

A semiconductor microwave oven and a microwave feeding structure thereof are provided. The microwave feeding structure of the semiconductor microwave oven includes: a chamber body having a door; a semiconductor power source configured to generate a microwave; and a microwave feeding assembly connected between the semiconductor power source and the chamber body, and configured to feed the microwave generated by the semiconductor power source into the chamber body and to convert a first microwave mode output by the semiconductor power source into a second microwave mode adaptive to microwave heating.

First claim

What is claimed is:

1. A microwave feeding structure for a semiconductor microwave oven, comprising:
a chamber body having a door;
a semiconductor power source configured to generate a microwave; and
a microwave feeding assembly connected between the semiconductor power source and the chamber body, and configured to feed the microwave generated by the semiconductor power source into the chamber body and to convert a first microwave mode of TE11 output by the semiconductor power source into a second microwave mode of TE10 adaptive to microwave heating, and
a rectangular wave guide connected with the chamber body,
wherein the microwave feeding assembly is connected between the semiconductor power source and the rectangular wave guide, and includes;
a mounting tube;
a ceramic ring having a first end connected with the mounting tube and a second end;
a tube case connected with the second end of the ceramic ring; and
an antenna defining a first end connected with the semiconductor power source and a second end extended through the tube case, the ceramic ring and the mounting tube sequentially into the rectangular wave guide.

2. The microwave feeding structure according to claim 1 , wherein the semiconductor power source comprises:
a semiconductor power plate connected with the microwave feeding assembly;
a shield disposed above the semiconductor power plate; and
a radiator attached on a bottom surface of the semiconductor power plate.

3. The microwave feeding structure according to claim 1 , wherein an antenna cap is fitted over an end of the mounting tube adjacent to the rectangular wave guide, and
wherein the microwave feeding assembly further comprises:
a bottom plate mounted on the rectangular wave guide, the ceramic ring being mounted on one side of the bottom plate, and the tube case being mounted on the other side of the bottom plate;
a first fixing ring mounted on the semiconductor power source;
a second fixing ring fitted over the tube case and connected with the bottom plate and the first fixing ring, and
a filler in a space where the antenna passes through, and a blocking cover disposed on a right side of the first fixing ring for stopping the first fixing ring and the filler.

4. A microwave feeding structure for a semiconductor microwave oven, comprising:
a chamber body having a door;
a semiconductor power source configured to generate a microwave;
a microwave feeding assembly connected between the semiconductor power source and the chamber body, and configured to feed the microwave generated by the semiconductor power source into the chamber body and to convert a first microwave mode of TE11 output by the semiconductor power source into a second microwave mode of TE10 adaptive to microwave heating; and,
a rectangular wave guide connected with the chamber body,
wherein the microwave feeding assembly is connected between the semiconductor power source and the rectangular wave guide, and includes;
a bottom plate mounted on the rectangular wave guide;
a first fixing ring connected between the bottom plate and the semiconductor power source; and
a probe passing through the bottom plate and the first fixing ring, and defining a first end connected with the semiconductor power source and a second end extended into the rectangular wave guide.

5. The microwave feeding structure according to claim 4 , wherein the semiconductor power source comprises:
a semiconductor power plate connected with the microwave feeding assembly;
a shield disposed above the semiconductor power plate; and
a radiator attached on a bottom surface of the semiconductor power plate.

6. The microwave feeding structure according to claim 4 , wherein the first end of the probe is connected with a micro-strip line of the semiconductor power source directly or via a coaxial transmission cable,
wherein the microwave feeding assembly further comprises a filler in a space between the bottom plate and the first fixing ring where the antenna passes through, and a blocking cover for blocking the filler.

7. A microwave feeding structure for a semiconductor microwave oven, comprising:
a chamber body having a door;
a semiconductor power source configured to generate a microwave; and
a microwave feeding assembly connected between the semiconductor power source and the chamber body, and configured to feed the microwave generated by the semiconductor power source into the chamber body and to convert a first microwave mode of TE11 output by the semiconductor power source into a second microwave mode of TE10 adaptive to microwave heating,
wherein the microwave feeding assembly comprises an antenna defining a first end connected with the semiconductor power source via a coaxial transmission cable and a second end extended into the chamber body.

8. The microwave feeding structure according to claim 7 , wherein the semiconductor power source comprises:
a semiconductor power plate connected with the microwave feeding assembly;
a shield disposed above the semiconductor power plate; and
a radiator attached on a bottom surface of the semiconductor power plate.

9. The microwave feeding structure according to claim 7 , wherein a ceramic plate is disposed in the chamber body and divides an interior of the chamber body into a first chamber and a second chamber, the second end of the antenna being extended into the second chamber.

Assignees

• Tang Xiangwei
• Ou Junhui
• Liang Chunhua
• Guangdong Midea Kitchen Appliances Mfgt Co Ltd
• Midea Group Co Ltd

Inventors

• Tang Xiangwei
• Ou Junhui
• Liang Chunhua

Classifications

• H05B6/705 Primary

  using microwave tuning · CPC title

• H05B6/686

  Circuits comprising a signal generator and power amplifier, e.g. using solid state oscillators · CPC title

• H05B6/6408

  Supports or covers specially adapted for use in microwave heating apparatus · CPC title

• H05B6/707

  using waveguides · CPC title

• H05B6/702 Primary

  using coaxial cables · CPC title