Solid electrolytic capacitor including positive electrode connection member having recessed portion, and production method therefor

Patent metadata

Field	Value
Publication number	US-10014119-B2
Application number	US-201715655782-A
Country	US
Kind code	B2
Filing date	Jul 20, 2017
Priority date	Sep 28, 2012
Publication date	Jul 3, 2018
Grant date	Jul 3, 2018

Abstract

A solid electrolytic capacitor includes: an insulating substrate; a capacitor element; a positive electrode lead-out structure; and a negative electrode lead-out structure. The positive electrode lead-out structure includes: a positive electrode terminal formed on the insulating substrate; a first positive electrode connection member formed on the insulating substrate; a second positive electrode connection member electrically connecting the first positive electrode connection member to the positive electrode terminal; and a pillow member configured to electrically connect the capacitor element to the first positive electrode connection member. The first positive electrode connection member has a recessed portion or a through hole. The recessed portion or the through hole overlaps an edge of a bottom surface of the pillow member having a first end of the recessed portion or the through hole disposed outside the edge and a second end of the recessed portion or the through hole disposed inside the edge.

First claim

What is claimed is:

1. A solid electrolytic capacitor comprising:
an insulating substrate having an upper surface and a lower surface;
a capacitor element having a positive electrode member, a negative electrode member, and a dielectric member, and disposed on the upper surface of the insulating substrate;
a positive electrode lead-out structure having a positive electrode terminal formed on the lower surface of the insulating substrate, and electrically connected to the positive electrode member of the capacitor element; and
a negative electrode lead-out structure having a negative electrode terminal formed on the lower surface of the insulating substrate, and electrically connected to the negative electrode member of the capacitor element,
wherein the positive electrode lead-out structure further comprises:
a first positive electrode connection member having a main surface and a back surface, of which the back surface is in contact with the upper surface of the insulating substrate,
a second positive electrode connection member configured to electrically connect the first positive electrode connection member to the positive electrode terminal, and
a pillow member having a top surface and a bottom surface, and configured to electrically connect the positive electrode member of the capacitor element to the first positive electrode connection member,
wherein the first positive electrode connection member has a recessed portion formed by locally recessing the main surface and
at the recessed portion, a part of the main surface of the first positive electrode connection member is positioned below the upper surface of the insulating substrate.

2. The solid electrolytic capacitor according to claim 1 , wherein
the recessed portion overlaps an edge of the bottom surface of the pillow member.

3. The solid electrolytic capacitor according to claim 2 , wherein a center portion of the recessed portion overlaps the edge of the bottom surface of the pillow member.

4. The solid electrolytic capacitor according to claim 2 , wherein:
the recessed portion has a first end and a second end,
the first end is disposed outside the edge of the bottom surface of the pillow member, and
the second end is disposed inside the edge of the bottom surface of the pillow member.

5. The solid electrolytic capacitor according to claim 1 , wherein:
the positive electrode member includes a positive electrode lead,
the first positive electrode connection member has a plurality of recessed portions including the recessed portion and
in a planar view from an upper side of the insulating substrate, the plurality of recessed portions are arranged in line symmetry about the positive electrode lead.

6. The solid electrolytic capacitor according to claim 1 , wherein the bottom surface of the pillow member has a rounded polygonal shape that at least one of corners of polygonal shape is rounded.

7. The solid electrolytic capacitor according to claim 1 , wherein:
the bottom surface of the pillow member has a shape having a plurality of sides,
the first positive electrode connection member has a plurality of recessed portions including the recessed portion, and
at least two of the plurality of recessed portions overlap one of the plurality of sides.

8. A solid electrolytic capacitor comprising:
an insulating substrate having an upper surface and a lower surface;
a capacitor element having a positive electrode member, a negative electrode member, and a dielectric member, and disposed on the upper surface of the insulating substrate;
a positive electrode lead-out structure having a positive electrode terminal formed on the lower surface of the insulating substrate, and electrically connected to the positive electrode member of the capacitor element; and
a negative electrode lead-out structure having a negative electrode terminal formed on the lower surface of the insulating substrate, and electrically connected to the negative electrode member of the capacitor element,
wherein the positive electrode lead-out structure further comprises:
a first positive electrode connection member having a main surface and a back surface, of which the back surface is in contact with the upper surface of the insulating substrate,
a second positive electrode connection member configured to electrically connect the first positive electrode connection member to the positive electrode terminal, and
a pillow member having a top surface and a bottom surface, and configured to electrically connect the positive electrode member of the capacitor element to the first positive electrode connection member,
wherein the first positive electrode connection member has a recessed portion formed by locally recessing the main surface, and
a position of the back surface of the first positive electrode connection member at a center of the recessed portion is below a position of an upper surface of the second positive electrode connection member at a periphery of the recessed portion.

9. The solid electrolytic capacitor according to claim 8 , wherein the recessed portion overlaps an edge of the bottom surface of the pillow member.

10. The solid electrolytic capacitor according to claim 9 , wherein a center portion of the recessed portion overlaps the edge of the bottom surface of the pillow member.

11. The solid electrolytic capacitor according to claim 9 , wherein:
the recessed portion has a first end and a second end,
the first end is disposed outside the edge of the bottom surface of the pillow member, and
the second end is disposed inside the edge of the bottom surface of the pillow member.

12. The solid electrolytic capacitor according to claim 8 , wherein:
the positive electrode member includes a positive electrode lead,
the first positive electrode connection member has a plurality of recessed portions including the recessed portion and
in a planar view from an upper side of the insulating substrate, the plurality of recessed portions are arranged in line symmetry about the positive electrode lead.

13. The solid electrolytic capacitor according to claim 8 , wherein the bottom surface of the pillow member has a rounded polygonal shape that at least one of corners of polygonal shape is rounded.

14. The solid electrolytic capacitor according to claim 8 , wherein:
the bottom surface of the pillow member has a shape having a plurality of sides,
the first positive electrode connection member has a plurality of recessed portions including the recessed portion and
at least two of the plurality of recessed portions overlap one of the plurality of sides.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Fujii Eizo

Classifications

• B32B38/0004

  Cutting, tearing or severing, e.g. bursting; Cutter details (cutting in general B26D; laminating combined with punching or perforating B32B38/04; removing all or part of the layers B32B38/10; cutting in combination with laying up and registration B32B38/185 takes precedence) · CPC title

• Y10T156/1064

  Partial cutting [e.g., grooving or incising] · CPC title

• B32B37/12

  characterised by using adhesives · CPC title

• H01G9/10

  Sealing, e.g. of lead-in wires · CPC title

• B32B37/18

  involving the assembly of discrete sheets or panels only · CPC title