Electronic device sheet having insulation patch member on dielectric layer

US10014113B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10014113-B2
Application numberUS-201615288216-A
CountryUS
Kind codeB2
Filing dateOct 7, 2016
Priority dateOct 15, 2015
Publication dateJul 3, 2018
Grant dateJul 3, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The electronic device sheet comprises a pair of electrode layers, a dielectric layer provided between the pair of electrode layers, and one or more insulation patch members provided on one of principal surfaces of the dielectric layer, wherein the number of the insulation patch members is 1 or more and 1000 or less per 1 cm 2 of the principal surface, and the total area of the insulation patch members is 10 μm 2 or larger and 3 mm 2 or smaller per 1 cm 2 of the principal surface.

First claim

Opening claim text (preview).

What is claimed is: 1. An electronic device sheet, comprising a pair of electrode layers, a dielectric layer provided between the pair of electrode layers, and one or more insulation patch members provided on one of principal surfaces of the dielectric layer, wherein a number of the insulation patch members is 1 to 1000 per 1 cm 2 of the principal surface, a total area of the insulation patch members is 10 μm 2 to 3 mm 2 per 1 cm 2 of the principal surface, and the principal surface includes thereon two or more of the insulation patch members, and a closest distance between the insulation patch members is 100 μm to 5 mm. 2. The electronic device sheet according to claim 1 , wherein the dielectric layer includes a nucleus portion, and the nucleus portion is covered with the insulation patch member. 3. The electronic device sheet according to claim 2 , wherein the nucleus portion is a recessed portion or a projecting portion on a surface of the dielectric layer, or a hole penetrating the dielectric layer.

Assignees

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Classifications

  • based on alkaline earth titanates · CPC title

  • Electrodes · CPC title

  • Protection against electric or thermal overload (by cooling H01G2/08) · CPC title

  • H01G4/33Primary

    Thin- or thick-film capacitors {(thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)} · CPC title

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What does patent US10014113B2 cover?
The electronic device sheet comprises a pair of electrode layers, a dielectric layer provided between the pair of electrode layers, and one or more insulation patch members provided on one of principal surfaces of the dielectric layer, wherein the number of the insulation patch members is 1 or more and 1000 or less per 1 cm 2 of the principal surface, and the total area of the insulation patch…
Who is the assignee on this patent?
Tdk Corp
What technology area does this patent fall under?
Primary CPC classification H01G4/33. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jul 03 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).