Wireless communication module and wireless communication device

Patent metadata

Field	Value
Publication number	US-10013650-B2
Application number	US-201213598872-A
Country	US
Kind code	B2
Filing date	Aug 30, 2012
Priority date	Mar 3, 2010
Publication date	Jul 3, 2018
Grant date	Jul 3, 2018

Abstract

A wireless communication module and a wireless communication device that are less likely to become detached even when attached to a flexible base substrate and have a reduced height includes a flexible multilayer substrate including a plurality of stacked flexible base materials and a cavity provided therein, a wireless IC chip arranged in the cavity, and a sealant filled in the cavity so as to cover the wireless IC chip. The sealant is a material that is harder than the flexible base materials. The flexible multilayer substrate includes a loop-shaped electrode defined by coil patterns. The loop-shaped electrode is electrically connected to the wireless IC chip.

First claim

What is claimed is:

1. A wireless communication module comprising:
a flexible multilayer substrate including a plurality of stacked flexible base materials and a cavity provided therein;
a wireless IC chip disposed in the cavity;
a sealant filled in the cavity so as to cover the wireless IC chip, the sealant being harder than the flexible base materials; and
a loop-shaped electrode including a coil pattern provided on or in the flexible multilayer substrate, the loop-shaped electrode being coupled to the wireless IC chip; wherein
the coil pattern is provided outside the cavity when viewed in plan;
the coil pattern is made of a conductive material that is harder than the flexible base materials;
the coil pattern is wound a plurality of turns around a lateral portion of the sealant filled in the cavity; and
a density of the coil pattern increases continuously or step-wise from an outer circumference to an inner circumference in all radial directions of the coil pattern.

2. The wireless communication module according to claim 1 , wherein the flexible base materials are made of a thermoplastic resin, and the sealant is made of a thermosetting resin.

3. The wireless communication module according to claim 1 , wherein a depth of the cavity is greater than or equal to about half a thickness of the flexible multilayer substrate.

4. The wireless communication module according to claim 1 , wherein the coil pattern includes a plurality of layers provided in the flexible multilayer substrate, and at least portions of coil patterns provided on adjacent ones of the plurality of layers do not overlap each other when viewed in plan from a coil axis direction of the coil pattern.

5. The wireless communication module according to claim 1 , wherein the sealant includes a magnetic filler.

6. A wireless communication device comprising:
a wireless communication module; and
a flexible base substrate on which the wireless communication module is mounted; wherein
the wireless communication module includes:
a flexible multilayer substrate including a plurality of stacked flexible base materials and a cavity provided therein;
a wireless IC chip disposed in the cavity;
a sealant filled in the cavity so as to cover the wireless IC chip, the sealant being harder than the flexible base materials; and
a loop-shaped electrode including a coil pattern provided on or in the flexible multilayer substrate, the loop-shaped electrode being coupled to the wireless IC chip;

the coil pattern is provided outside the cavity when viewed in plan;
the coil pattern is made of a conductive material that is harder than the flexible base materials;
the coil pattern is wound a plurality of turns around a lateral portion of the sealant filled in the cavity; and
a density of the coil pattern increases continuously or step-wise from an outer circumference to an inner circumference in all radial directions of the coil pattern.

7. The wireless communication device according to claim 6 , wherein an antenna pattern is provided on the base substrate, and the antenna pattern is magnetically coupled to the loop-shaped electrode.

8. The wireless communication device according to claim 7 , wherein the wireless communication module is arranged on the base substrate so that, when viewed in plan, the wireless communication module includes a first region in which the coil pattern overlaps the antenna pattern and a second region in which the coil pattern does not overlap the antenna pattern.

9. The wireless communication device according to claim 6 , wherein the wireless communication module is mounted on the base substrate in a state in which an opening portion of the cavity faces the base substrate.

10. The wireless communication system according to claim 6 , wherein the flexible base materials are made of a thermoplastic resin, and the sealant is made of a thermosetting resin.

11. The wireless communication system according to claim 6 , wherein a depth of the cavity is greater than or equal to about half a thickness of the flexible multilayer substrate.

12. The wireless communication system according to claim 6 , wherein the coil pattern includes a plurality of layers provided in the flexible multilayer substrate, and at least portions of coil patterns provided on adjacent ones of the plurality of layers do not overlap each other when viewed in plan from a coil axis direction of the coil pattern.

13. The wireless communication system according to claim 6 , wherein the sealant includes a magnetic filler.

Assignees

• Murayama Hiromi
• Kato Noboru
• Murata Manufacturing Co

Inventors

• Murayama Hiromi
• Kato Noboru

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H01L2224/16225

  Electricity · mapped topic

• H01Q1/2283

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title

• G06K19/07749 Primary

  the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card · CPC title