Host chassis and a host

Patent metadata

Field	Value
Publication number	US-10013034-B2
Application number	US-201514801777-A
Country	US
Kind code	B2
Filing date	Jul 16, 2015
Priority date	Feb 2, 2015
Publication date	Jul 3, 2018
Grant date	Jul 3, 2018

Abstract

An embodiment of the invention provides a host chassis and a host, and refers to a display technical field, which can realize uniform heat dissipation, so as to improve the heat dissipation performance of the host. The host chassis comprises: a hollow column enclosure; heat dissipation covers situated at two ends of the column enclosure, the heat dissipation covers match with the column enclosure; a hollow column heat dissipating barrel which is situated inside the column enclosure and disposed in the same orientation with the column enclosure, the column heat dissipating barrel is used for disposing host accessories and for heat conduction for the host accessories; and a cooling fan fixed at one end of the column heat dissipating barrel, the fan is used for blowing cold air from external environment into the column heat dissipating barrel so as to take away heat.

First claim

The invention claimed is:

1. A host chassis comprising:
a hollow column enclosure;
heat dissipation covers situated at two ends of the column enclosure, the heat dissipation covers line up with the column enclosure;
a hollow column heat dissipating barrel which is situated inside the column enclosure and disposed in the same orientation with the column enclosure, the column heat dissipating barrel is used for disposing host accessories and for heat conduction for the host accessories;
and a cooling fan fixed at one end of the column heat dissipating barrel, the fan is used for blowing cold air from external environment into the column heat dissipating barrel so as to take away heat;
wherein the column heat dissipating barrel includes a supporting barrel and a heat conducting barrel which are embedded into one another;
the supporting barrel includes supporting surfaces for disposing the host accessories and adjoining surfaces for contacting with the column enclosure;
the heat conducting barrel contacts with the adjoining surfaces of the supporting barrel and is embedded inside the supporting barrel;
there are gaps between the supporting surfaces of the supporting barrel and each of the column enclosure and the heat conducting barrel.

2. The host chassis according to claim 1 , wherein the column enclosure is a cylinder enclosure, and the heat dissipation covers are cap-shaped cylinder heat dissipation covers which line up with the cylinder enclosure; wherein the cooling fan is situated inside one of the heat dissipation covers.

3. The host chassis according to claim 2 , wherein multiple heat sinks are provided inside the heat conducting barrel;
wherein air channels running through two ends of the heat conducting barrel are formed between the multiple heat sinks.

4. The host chassis according to claim 3 , wherein the multiple heat sinks are arranged like a sector.

5. The host chassis according to claim 2 , wherein the supporting barrel includes multiple supporting surfaces and multiple cambered adjoining surfaces adjoining the supporting surfaces;
wherein the multiple cambered adjoining surfaces contact completely with the inner surface of the cylinder enclosure.

6. The host chassis according to claim 5 , wherein the heat conducting barrel is a hollow heat conducting barrel of polygon prism, and at least three side edges of the heat conducting barrel of polygon prism get stuck at at least three adjoining surfaces of the supporting barrel respectively.

7. The host chassis according to claim 6 , wherein the supporting barrel includes three supporting surfaces and three cambered adjoining surfaces adjoining the supporting surfaces, and the heat conducting barrel is a heat conducting barrel of triangular prism; three sides of the heat conducting barrel of triangular prism are parallel to the three supporting surfaces of the supporting barrel respectively.

8. The host chassis according to claim 1 , wherein the heat dissipating covers include a first heat dissipating cover provided at the same side with the cooling fan and a second heat dissipating cover provided at a different side with the cooling fan; wherein a heat dissipating hole is provided at the center of the heat dissipating cover, and multiple ventilation openings are provided at the periphery thereof;
wherein the heat dissipating hole and the ventilation openings of the first heat dissipating cover are air inlets, and the heat dissipating hole and the ventilation openings of the second heat dissipating cover are air outlets.

9. The host chassis according to claim 8 , wherein the shape of the ventilation openings includes any of bar, circle and polygon shapes.

10. The host chassis according to claim 1 , wherein the host chassis has a shape of sectored column or polygon prism.

11. The host chassis according to claim 1 , wherein an interface panel is provided on the outer surface of the column enclosure, for connection of external components.

12. A host, comprising the host chassis according to claim 1 .

Assignees

• Boe Technology Group Co Ltd
• Beijing Boe Chatani Electronics Co Ltd
• Boe Technology Group Co Ltd

Inventors

• Meng Yingli

Classifications

• G06F1/20 Primary

  Cooling means · CPC title