Flexible substrate bonding method

Patent metadata

Field	Value
Publication number	US-10012853-B2
Application number	US-201415037582-A
Country	US
Kind code	B2
Filing date	Nov 18, 2014
Priority date	Nov 18, 2013
Publication date	Jul 3, 2018
Grant date	Jul 3, 2018

Abstract

The present invention relates to a flexible substrate bonding method and, more particularly, to a bonding method for bonding a flexible substrate to a carrier substrate in order to facilitate handling of the flexible substrate. To this end, the present invention provides a flexible substrate bonding method comprising: a substrate preparation step for preparing a carrier substrate and a flexible substrate; and a bonding step for bonding the carrier substrate to the flexible substrate, which rotates by being wound around a rotation roll, while moving the carrier substrate by a transfer unit, wherein the bonding step includes bringing one edge of the flexible substrate into contact with the carrier substrate, and then gradually bonding the flexible substrate to the carrier substrate in a direction from one side to the other side.

First claim

What is claimed is:

1. A bonding method for a flexible substrate comprising:
preparing a flexible substrate and a carrier substrate; and
bonding the flexible substrate wound on a rotating roller onto the carrier substrate while moving the carrier substrate using a transportation unit, wherein the roller comprises a concave portion on an outer surface of the roller,
wherein bonding the flexible substrate onto the carrier substrate comprises bringing one edge portion of the flexible substrate into contact with the carrier substrate, and gradually bonding the flexible substrate onto the carrier substrate in a direction from the one edge portion toward a second edge portion.

2. The bonding method according to claim 1 , wherein bonding the flexible substrate onto the carrier substrate is carried out in a vacuum atmosphere.

3. The bonding method according to claim 2 , wherein a vacuum pressure of the vacuum atmosphere ranges from 1*10 −3 to 1*10 −2 torr.

4. The bonding method according to claim 1 , wherein a plurality of air nozzles are provided in the concave portion of the roller.

5. The bonding method according to claim 4 , wherein the concave portion is formed at a central location or both end locations of the roller.

6. The bonding method according to claim 4 , wherein a width of a convex portion of the roller ranges from ⅕ to ⅓ of a width of the flexible substrate.

7. The bonding method according to claim 1 , wherein a plurality of electrostatic discharge chucks to generate static electricity are provided on an outer surface of the roller.

Assignees

• Corning Prec Materials Co Ltd

Inventors

• Kang Gyung Soo
• Kong Bo Kyung
• Choi Eun Heui
• Park Young Seon
• Lee Woo Jin

Classifications

• B65H3/10

  Suction rollers · CPC title

• G02F1/1303

  Apparatus specially adapted to the manufacture of LCDs · CPC title

• B65H20/12

  by suction roller · CPC title

• B32B2037/1072

  using a fluid jet · CPC title

• B32B37/003

  to avoid air inclusion · CPC title