Glass sealing with transparent materials having transient absorption properties

Patent metadata

Field	Value
Publication number	US-10011525-B2
Application number	US-201715584559-A
Country	US
Kind code	B2
Filing date	May 2, 2017
Priority date	Nov 30, 2012
Publication date	Jul 3, 2018
Grant date	Jul 3, 2018

Abstract

Transparent glass-to-glass hermetic seals are formed by providing a low melting temperature sealing glass along a sealing interface between two glass substrates and irradiating the interface with laser radiation. Absorption by the sealing glass and induced transient absorption by the glass substrates along the sealing interface causes localized heating and melting of both the sealing glass layer and the substrate materials, which results in the formation of a glass-to-glass weld. Due to the transient absorption by the substrate material, the sealed region is transparent upon cooling.

First claim

We claim:

1. A sealed device comprising:
a non-frit, low T g glass sealing layer formed over a surface of a first substrate; and
a device protected between the first substrate and a second substrate,
wherein the glass sealing layer is in contact with the second substrate, and
wherein the device is hermetically sealed between the first and second substrates as a function of a composition of impurities in the first or second substrates and as a function of a composition of the glass sealing layer through a local heating of the glass sealing layer with laser radiation having a predetermined wavelength.

2. The device of claim 1 , wherein the glass sealing layer comprises:
20-100 mol % SnO;
0-50 mol % SnF 2 ; and
0-30 mol % P 2 O 5 or B 2 O 3 .

3. The device of claim 1 , wherein the impurities in the first or second substrates are selected from the group consisting of As, Fe, Ga, K, Mn, Na, P, Sb, Ti, Zn, Sn and combinations thereof.

4. The device of claim 1 , wherein the first and second substrates have different lateral dimensions, different CTEs, different thicknesses, or combinations thereof.

5. The device of claim 1 , wherein one of the first and second substrates is a glass substrate.

6. The device of claim 5 , wherein the other of the first and second substrates is a ceramic substrate or a metal substrate.

7. The device of claim 1 , wherein at least one of the first and second substrates is a glass substrate having (a) an absorption of laser radiation having a predetermined wavelength that is less than 15% at room temperature and (b) an induced transient absorption of the laser radiation that is greater than 15% at a sealing temperature greater than 400° C.

8. The device of claim 7 , wherein the predetermined wavelength is chosen from UV wavelengths.

9. The device of claim 1 , wherein a thickness of the glass sealing layer ranges from about 100 nm to 10 microns.

10. The device of claim 1 , wherein the glass sealing layer is optically transparent.

11. The device of claim 1 , wherein the glass sealing layer is free of fillers.

12. The device of claim 1 , wherein the device is selected from the group consisting of a light emitting diode, an organic light emitting diode, a quantum dot, and combinations thereof.

13. A sealed device comprising:
a glass film formed over a surface of a first substrate; and
a device protected between the first substrate and a second substrate,
wherein the glass film is in contact with the second substrate,
wherein the device is hermetically sealed between the first and second substrates, and
wherein at least one of the first and second substrates is a glass substrate having (a) an absorption of laser radiation having a predetermined wavelength that is less than 15% at room temperature and (b) an induced transient absorption of the laser radiation that is greater than 15% at a sealing temperature greater than 400° C.

14. The device of claim 13 , wherein the glass film comprises a non-frit, low T g glass.

15. The device of claim 13 , wherein the glass film comprises:
20-100 mol % SnO;
0-50 mol % SnF 2 ; and
0-30 mol % P 2 O 5 or B 2 O 3 .

16. The device of claim 13 , wherein the glass film is optically transparent.

17. The device of claim 13 , wherein the glass film is free of fillers.

18. The device of claim 13 , wherein a thickness of the glass film ranges from about 100 nm to 10 microns.

19. The device of claim 13 , wherein one of the first and second substrates is a ceramic substrate or a metal substrate.

20. The device of claim 13 , wherein the device is selected from the group consisting of a light emitting diode, an organic light emitting diode, a quantum dot, and combinations thereof.

Assignees

• Corning Inc

Inventors

• Logunov Stephan Lvovich
• Quesada Mark Alejandro

Classifications

• H10P14/6538

  by exposure to UV light · CPC title

• C08K2003/023

  Silicon · CPC title

• C03C8/24

  Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders · CPC title

• C03C4/085

  for ultraviolet absorbing glass · CPC title

• C03C27/06 Primary

  Joining glass to glass by processes other than fusing (fusing C03B23/20; units for use as elements for closing wall or like openings and comprising two or more parallel glass panes in spaced relationship, the panes being permanently secured together E06B3/66) · CPC title