Method for evaluating concentration of defect in silicon single crystal substrate
US-2016300768-A1 · Oct 13, 2016 · US
US10008426B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10008426-B2 |
| Application number | US-201615254310-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 1, 2016 |
| Priority date | Nov 27, 2015 |
| Publication date | Jun 26, 2018 |
| Grant date | Jun 26, 2018 |
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An etching method for detecting crystal defects, the method includes providing a substrate with an etchant containing hydrogen fluoride, nitric acid, hydrogen chloride, and water. A concave portion on a part having a crystal defect of the substrate is formed by the etchant. The concave portion is examined by a microscope to locate a position of the crystal defect.
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What is claimed is: 1. An etching method for detecting crystal defects, the method comprising: providing a substrate with an etchant comprising hydrogen fluoride, nitric acid, hydrogen chloride, and water, the substrate having a crystal defect; and forming a concave portion on the crystal defect by the etchant, wherein weight composition ratios of hydrogen fluoride, nitric acid, hydrogen chloride, and water in the etchant are (1.7 to 2.4):(30.3 to 49.6):(1.4 to 9.2):(46.5 to 60.1), respectively, and wherein the etchant does not contain chromium or acetic acid in principle. 2. The method according to claim 1 , further comprising: using a microscope, locating a position of the crystal defect according to the concave portion. 3. The method according to claim 1 , wherein the size of the concave portion is 0.1 μm to 0.3 μm. 4. The method according to claim 1 , further comprising: forming a film on the part of the substrate having the crystal defect by the etchant; and removing the film by the etchant to form the concave portion on the substrate. 5. The method according to claim 4 , wherein the film is formed by oxidization of the substrate. 6. The method according to claim 1 , wherein a treatment time of the substrate by the etchant is 10 seconds to 10 minutes. 7. The method according to claim 1 , wherein the etchant does not contain an organic acid in principle. 8. The method according to claim 1 , wherein a weight composition ratio of chromium to H 2 O in the etchant is less than 1:500. 9. The method according to claim 1 , wherein at least one of hydrogen fluoride, nitric acid, hydrogen chloride in the etchant includes ionized molecules. 10. An etching method for detecting crystal defects, the method comprising: providing a substrate with an etchant comprising an oxidizing agent, an etching agent, hydrogen chloride, and water, the substrate having a crystal defect; and forming a concave portion on the crystal defect by the etchant, wherein weight composition ratios of hydrogen fluoride, nitric acid, hydrogen chloride, and water in the etchant are (1.7 to 2.4):(30.3 to 49.6):(1.4 to 9.2):(46.5 to 60.1), respectively, and wherein the etchant does not contain chromium or acetic acid in principle. 11. The method according to claim 10 , further comprising: using a microscope, locating a position of the crystal defect according to the concave portion. 12. The method according to claim 10 , wherein the oxidizing agent is nitric acid, and the etching agent is hydrogen fluoride. 13. The method according to claim 10 , wherein the size of the concave portion is 0.1 μm to 0.3 μm. 14. The method according to claim 10 , wherein a treatment time of the substrate by the etchant is 10 seconds to 10 minutes. 15. The method according to claim 10 , wherein the etchant does not contain an organic acid in principle. 16. The method according to claim 10 , wherein a weight composition ratio of chromium to H 2 O in the etchant is less than 1:500. 17. The method according to claim 10 , wherein at least one of hydrogen fluoride, nitric acid, hydrogen chloride in the etchant includes ionized molecules.
Chemical etching · CPC title
of silicon in uncombined form, i.e. pure silicon · CPC title
comprising optical enhancement of defects or not-directly-visible states · CPC title
containing a fluorine compound · CPC title
Electricity · mapped topic
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