Etching method and etchant

US10008426B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10008426-B2
Application numberUS-201615254310-A
CountryUS
Kind codeB2
Filing dateSep 1, 2016
Priority dateNov 27, 2015
Publication dateJun 26, 2018
Grant dateJun 26, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

An etching method for detecting crystal defects, the method includes providing a substrate with an etchant containing hydrogen fluoride, nitric acid, hydrogen chloride, and water. A concave portion on a part having a crystal defect of the substrate is formed by the etchant. The concave portion is examined by a microscope to locate a position of the crystal defect.

First claim

Opening claim text (preview).

What is claimed is: 1. An etching method for detecting crystal defects, the method comprising: providing a substrate with an etchant comprising hydrogen fluoride, nitric acid, hydrogen chloride, and water, the substrate having a crystal defect; and forming a concave portion on the crystal defect by the etchant, wherein weight composition ratios of hydrogen fluoride, nitric acid, hydrogen chloride, and water in the etchant are (1.7 to 2.4):(30.3 to 49.6):(1.4 to 9.2):(46.5 to 60.1), respectively, and wherein the etchant does not contain chromium or acetic acid in principle. 2. The method according to claim 1 , further comprising: using a microscope, locating a position of the crystal defect according to the concave portion. 3. The method according to claim 1 , wherein the size of the concave portion is 0.1 μm to 0.3 μm. 4. The method according to claim 1 , further comprising: forming a film on the part of the substrate having the crystal defect by the etchant; and removing the film by the etchant to form the concave portion on the substrate. 5. The method according to claim 4 , wherein the film is formed by oxidization of the substrate. 6. The method according to claim 1 , wherein a treatment time of the substrate by the etchant is 10 seconds to 10 minutes. 7. The method according to claim 1 , wherein the etchant does not contain an organic acid in principle. 8. The method according to claim 1 , wherein a weight composition ratio of chromium to H 2 O in the etchant is less than 1:500. 9. The method according to claim 1 , wherein at least one of hydrogen fluoride, nitric acid, hydrogen chloride in the etchant includes ionized molecules. 10. An etching method for detecting crystal defects, the method comprising: providing a substrate with an etchant comprising an oxidizing agent, an etching agent, hydrogen chloride, and water, the substrate having a crystal defect; and forming a concave portion on the crystal defect by the etchant, wherein weight composition ratios of hydrogen fluoride, nitric acid, hydrogen chloride, and water in the etchant are (1.7 to 2.4):(30.3 to 49.6):(1.4 to 9.2):(46.5 to 60.1), respectively, and wherein the etchant does not contain chromium or acetic acid in principle. 11. The method according to claim 10 , further comprising: using a microscope, locating a position of the crystal defect according to the concave portion. 12. The method according to claim 10 , wherein the oxidizing agent is nitric acid, and the etching agent is hydrogen fluoride. 13. The method according to claim 10 , wherein the size of the concave portion is 0.1 μm to 0.3 μm. 14. The method according to claim 10 , wherein a treatment time of the substrate by the etchant is 10 seconds to 10 minutes. 15. The method according to claim 10 , wherein the etchant does not contain an organic acid in principle. 16. The method according to claim 10 , wherein a weight composition ratio of chromium to H 2 O in the etchant is less than 1:500. 17. The method according to claim 10 , wherein at least one of hydrogen fluoride, nitric acid, hydrogen chloride in the etchant includes ionized molecules.

Assignees

Inventors

Classifications

  • Chemical etching · CPC title

  • of silicon in uncombined form, i.e. pure silicon · CPC title

  • H10P74/235Primary

    comprising optical enhancement of defects or not-directly-visible states · CPC title

  • containing a fluorine compound · CPC title

  • Electricity · mapped topic

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What does patent US10008426B2 cover?
An etching method for detecting crystal defects, the method includes providing a substrate with an etchant containing hydrogen fluoride, nitric acid, hydrogen chloride, and water. A concave portion on a part having a crystal defect of the substrate is formed by the etchant. The concave portion is examined by a microscope to locate a position of the crystal defect.
Who is the assignee on this patent?
Toshiba Memory Corp
What technology area does this patent fall under?
Primary CPC classification H10P74/235. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 26 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).