Method for producing a power semiconductor module

Patent metadata

Field	Value
Publication number	US-10008392-B2
Application number	US-201715424995-A
Country	US
Kind code	B2
Filing date	Feb 6, 2017
Priority date	Oct 30, 2014
Publication date	Jun 26, 2018
Grant date	Jun 26, 2018

Abstract

A power semiconductor module is produced by: providing an electrically conductive terminal block having a screw thread, a connecting conductor having first and second sections, a module housing, a circuit carrier having a dielectric insulation carrier and an upper metallization layer on an upper side of the insulation carrier, and a semiconductor component; fitting the semiconductor component on the circuit carrier; producing a firm and electrically conductive connection between the terminal block and the connecting conductor at the first section; producing a material-fit and electrically conductive connection between the circuit carrier or the semiconductor component and the connecting conductor at the second section; and arranging the terminal block and the circuit carrier fitted with the semiconductor component on the module housing so the semiconductor component is arranged in the module housing and the screw thread is accessible from an outer side of the module housing.

First claim

What is claimed is:

1. A method for producing a power semiconductor module, the method comprising:
providing an electrically conductive terminal block having a screw thread;
providing a connecting conductor having a first section and a second section;
providing a module housing;
providing a circuit carrier having a dielectric insulation carrier and an upper metallization layer applied onto an upper side of the dielectric insulation carrier;
providing a semiconductor component;
fitting the semiconductor component on the circuit carrier;
producing a firm and electrically conductive connection between the terminal block and the connecting conductor at the first section of the connecting conductor;
producing a material-fit and electrically conductive connection between the circuit carrier or the semiconductor component and the connecting conductor at the second section of the connecting conductor;
arranging the terminal block and the circuit carrier fitted with the semiconductor component on the module housing in such a way that the semiconductor component is arranged in the module housing and the screw thread is accessible from an outer side of the module housing,
wherein the module housing or a part of the module housing is produced by injection molding, while being provided with a holder into which the connecting conductor is placed after the production of the module housing or the part of the module housing.

2. The method of claim 1 , further comprising:
providing an electrically conductive further terminal block having a further screw thread that is accessible from the outer side of the module housing;
providing a further connecting conductor having a further first section and a further second section;
producing a firm and electrically conductive connection between the further terminal block and the further connecting conductor at the further first section;
producing a material-fit and electrically conductive connection between the circuit carrier and/or the semiconductor component and the further connecting conductor at the further second section; and
routing the connecting conductor and the further connecting conductor in parallel over a length of at least 30 mm.

3. The method of claim 2 , further comprising:
spacing the connecting conductor and the further connecting conductor by a distance of at most 5 mm in the region in which they are routed in parallel.

4. The method of claim 1 , wherein producing the firm and electrically conductive connection between the terminal block and the connecting conductor at the first section of the connecting conductor comprises soldering, welding, laser-welding or riveting the connecting conductor to the terminal block at the first section.

5. The method of claim 1 , wherein producing the material-fit and electrically conductive connection between the circuit carrier or the semiconductor component and the connecting conductor at the second section of the connecting conductor comprises soldering, sintering, welding, ultrasound-welding or electrically conductively adhesively bonding the connecting conductor to the circuit carrier or to the semiconductor component at the second section.

6. The method of claim 1 , wherein the screw thread has a screw-thread axis which extends perpendicularly to the upper side of the dielectric insulation carrier.

7. The method of claim 1 , wherein providing the terminal block comprises forming the terminal block in one piece.

8. A method for producing a power semiconductor module, the method comprising:
providing an electrically conductive terminal block having a screw thread;
providing a connecting conductor having a first section and a second section;
providing a module housing;
providing a circuit carrier having a dielectric insulation carrier and an upper metallization layer applied onto an upper side of the dielectric insulation carrier;
providing a semiconductor component;
fitting the semiconductor component on the circuit carrier;
producing a firm and electrically conductive connection between the terminal block and the connecting conductor at the first section of the connecting conductor;
producing a material-fit and electrically conductive connection between the circuit carrier or the semiconductor component and the connecting conductor at the second section of the connecting conductor;
arranging the terminal block and the circuit carrier fitted with the semiconductor component on the module housing in such a way that the semiconductor component is arranged in the module housing and the screw thread is accessible from an outer side of the module housing;
providing an electrically conductive further terminal block having a further screw thread that is accessible from the outer side of the module housing;
providing a further connecting conductor having a further first section and a further second section;
producing a firm and electrically conductive connection between the further terminal block and the further connecting conductor at the further first section;
producing a material-fit and electrically conductive connection between the circuit carrier and/or the semiconductor component and the further connecting conductor at the further second section;
routing the connecting conductor and the further connecting conductor in parallel over a length of at least 30 mm.

9. The method of claim 8 , further comprising:
spacing the connecting conductor and the further connecting conductor by a distance of at most 5 mm in the region in which they are routed in parallel.

10. The method of claim 8 , wherein producing the firm and electrically conductive connection between the terminal block and the connecting conductor at the first section of the connecting conductor comprises soldering, welding, laser-welding or riveting the connecting conductor to the terminal block at the first section.

11. The method of claim 8 , wherein producing the material-fit and electrically conductive connection between the circuit carrier or the semiconductor component and the connecting conductor at the second section of the connecting conductor comprises soldering, sintering, welding, ultrasound-welding or electrically conductively adhesively bonding the connecting conductor to the circuit carrier or o the semiconductor component at the second section.

12. The method of claim 8 , wherein the screw thread has a screw-thread axis which extends perpendicularly to the upper side of the dielectric insulation carrier.

13. The method of claim 8 , wherein providing the terminal block comprises forming the terminal block in one piece.

14. The method of claim 8 , wherein the connecting conductor and the module housing are provided by producing the module housing by injection molding while molding the connecting conductor into the module housing.

15. The method of claim 8 , wherein the module housing or a part of the module housing is produced by injection molding, while being provided with a holder into which the connecting conductor is placed after the production of the module housing or the part of the module housing.

16. A method for producing a power semiconductor module, the method comprising:
providing an electrically conductive terminal block having a screw thread;
providing a connecting conductor having a first end section disposed at a first level, a second end section disposed at a second level below the first level, and a middle section disposed at a third level between the first and the second levels;
providing a module housing;
providing a circuit carrier having a dielectric insulation carrier and an upper meta

Assignees

• Infineon Technologies Ag

Inventors

• Hoehn Alexander
• Borghoff Georg

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title

• H10W72/944

  Dispositions of multiple bond pads · CPC title

• H10W72/926

  Multiple bond pads having different sizes · CPC title