Bezel structure of touch screen and method for manufacturing the same, touch screen and display device

Patent metadata

Field	Value
Publication number	US-10007367-B2
Application number	US-201515129907-A
Country	US
Kind code	B2
Filing date	Jul 10, 2015
Priority date	Dec 26, 2014
Publication date	Jun 26, 2018
Grant date	Jun 26, 2018

Abstract

A bezel structure of a touch screen is disclosed by the invention. A touch screen having the bezel structure, a display device having the touch screen, and a method for manufacturing the bezel structure of the touch screen are also disclosed by the invention.

First claim

What is claimed is:

1. A bezel structure of a touch screen, the touch screen being provided with a substrate, and the bezel structure comprising:
a black matrix portion only provided on a single edge region on a back surface of the substrate;
a bonding area arranged on the black matrix portion and provided with a plurality of metal leads and a plurality of transparent conductive solder pads, each of the plurality of transparent conductive solder pads being electrically connected with corresponding one metal lead of the plurality of metal leads;
a first insulating photoresist layer arranged between the plurality of transparent conductive solder pads and the plurality of metal leads in a thickness direction of the substrate, the transparent conductive solder pads being electrically connected with corresponding metal leads via jumper holes provided in the first insulating photoresist layer; and
a plurality of transparent conductive edge-routing wires arranged on the back surface of the substrate, at both lateral sides thereof adjacent to the end side, each of the plurality of transparent conductive edge-routing wires extending to the bonding area and being constructed at a terminal end thereof as corresponding one of the plurality of transparent conductive solder pads located within the bonding area.

2. The bezel structure according to claim 1 ,
wherein the black matrix portion, the transparent conductive solder pads, the first insulating photoresist layer and the metal leads are arranged sequentially in a thickness direction of the substrate therefrom.

3. The bezel structure according to claim 2 , further comprising a second insulating photoresist layer, the second insulating photoresist layer being arranged on a side of the metal leads away from the first insulating photoresist layer.

4. The bezel structure according to claim 1 ,
wherein the black matrix portion, the metal leads, the first insulating photoresist layer and the transparent conductive solder pads are arranged sequentially in a thickness direction of the substrate therefrom.

5. The bezel structure according to claim 4 , further comprising a second insulating photoresist layer, the second insulating photoresist layer being arranged on a side of the transparent conductive solder pads away from the first insulating photoresist layer.

6. The bezel structure according to claim 1 , further comprising a plurality of X-direction transparent conducting bars and a plurality of Y-direction transparent conducting bars substantially parallel to the transparent conductive edge-routing wires, both of which are arranged in a central area on the back surface of the substrate, wherein the X-direction transparent conducting bars and the Y-direction transparent conducting bars being electrically isolated from each other.

7. The bezel structure according to claim 6 ,
wherein the plurality of X-direction transparent conducting bars are electrically connected with one another via corresponding transparent conductive bridges formed on the substrate, and the transparent conductive bridges are provided with an auxiliary insulating photoresist layers above which the Y-direction transparent conducting bars are arranged.

8. The bezel structure according to claim 7 ,
wherein the first insulating photoresist layer and the auxiliary insulating photoresist layer are arranged in a same layer and are formed by a same material.

9. The bezel structure according to claim 1 ,
wherein the bezel structure is in a form of an One Glass Solution bezel structure.

10. A touch screen, comprising the bezel structure according to claim 1 .

11. A display device, comprising the touch screen according to claim 10 .

12. A method for manufacturing a bezel structure of a touch screen, the touch screen being provided with a substrate, and the method comprising steps of:
forming a black matrix portion only provided on a single edge region on a back surface of the substrate, the black matrix portion being adapted to be formed with a bonding area thereon;
forming a plurality of transparent conductive edge-routing wires arranged on the back surface of the substrate, at both lateral sides thereof adjacent to the end side, each of the plurality of transparent conductive edge-routing wires extending to the bonding area and being constructed at a terminal end thereof as corresponding one of a plurality of transparent conductive solder pads located within the bonding area;
forming a first insulating photoresist layer on the back surface of the substrate, the first insulating photoresist layer being formed with jumper holes and each of the jumper holes being positioned at a site where each of the transparent conductive solder pads is located; and
disposing a plurality of metal leads on the bonding area;
wherein each of the transparent conductive solder pads is electrically connected with a corresponding metal leads via a jumper hole.

13. The method according to claim 12 ,
wherein the steps of forming the black matrix portion, forming the transparent conductive edge-routing wires, forming the first insulating photoresist layer and disposing the metal leads are performed sequentially.

14. The method according to claim 13 ,
wherein the step of forming the transparent conductive edge-routing wires further comprises forming a plurality of transparent conductive bridges within a central area on the back surface of the substrate by a same material as that used to form the transparent conductive edge-routing wires; and
wherein the step of forming the first insulating photoresist layer further comprises forming an auxiliary insulating photoresist layer which covers partially each of the plurality of transparent conductive bridges, by a same material as that used to form the first insulating photoresist layer.

15. The method according to claim 14 , further comprising an additional step after the step of forming the first insulating photoresist layer and before the step of disposing the metal leads, the additional step comprising:
forming a plurality of X-direction transparent conducting bars and a plurality of Y-direction transparent conducting bars within a central area on the back surface of the substrate, the plurality of X-direction transparent conducting bars being electrically connected with one another via corresponding transparent conductive bridges located at joints thereamong, the plurality of Y-direction transparent conducting bars being arranged above the corresponding auxiliary insulating photoresist layer, and the X-direction transparent conducting bars and the Y-direction transparent conducting bars being electrically isolated from each other via the auxiliary insulating photoresist layer.

16. The method according to claim 12 ,
wherein after the step of disposing the metal leads, a second insulating photoresist layer is formed to cover the back surface of the substrate.

17. The method according to claim 12 ,
wherein the steps of forming the black matrix portion, disposing the metal leads, forming the first insulating photoresist layer, and forming the transparent conductive edge-routing wires are performed sequentially.

18. The method according to claim 17
wherein the step of disposing metal leads further comprises forming a plurality of transparent conductive bridges within a central area on the back surface of the substrate by a same material as that used to form the metal leads; and
wherein the step of forming the first insulating photoresist layer further comprises forming an auxiliary insulating photoresist layer which cove

Assignees

• Boe Technology Group Co Ltd
• Hefei Xinsheng Optoelectronics Technology Co Ltd

Inventors

• Wu Lingyan
• Zhang Lei
• Xie Taofeng
• Liu Yang

Classifications

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title

• H05K2201/03

  Conductive materials · CPC title

• H05K1/111

  Pads for surface mounting, e.g. lay-out · CPC title

• H05K2201/0108

  Transparent · CPC title

• G06F2203/04103

  Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices · CPC title