Integrated mounting and cooling apparatus, electronic device, and vehicle

US10005355B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10005355-B2
Application numberUS-201514604846-A
CountryUS
Kind codeB2
Filing dateJan 26, 2015
Priority dateJan 28, 2014
Publication dateJun 26, 2018
Grant dateJun 26, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An integrated mounting and cooling apparatus includes a housing body having a first mounting surface configured to receive electronic components to be cooled and a heat dissipation channel extending through the housing body under the first mounting surface. An array of cooling fins is disposed in the heat dissipation channel. The apparatus is configured to serve as a mounting surface for the electronic components, as a housing for the electronic components, and a heat-sink to cool the electronic components.

First claim

Opening claim text (preview).

What is claimed is: 1. An apparatus, comprising: a housing including a housing body that defines a first mounting surface configured to receive plural first electronic components to be cooled, wherein the housing body further defines a heat dissipation channel that extends through the housing body under the first mounting surface, wherein the housing body comprises a monolithic metal body; and an array of cooling fins disposed in the heat dissipation channel; wherein the housing body is configured to conduct heat from the first electronic components to the cooling fins for transfer of the heat from the cooling fins to a first cooling fluid passing through the heat dissipation channel; and wherein: the first mounting surface is planar; the monolithic metal body is generally rectangular cuboid-shaped, and includes top and bottom sides, front and rear sides, and left and right sides; the monolithic metal body defines a first recess in the top side, wherein the first recess is at least partially bound by the first mounting surface and at least two top sidewalls that are perpendicular to the first mounting surface, the at least two top sidewalls being part of at least two of the front and rear sides and left and right sides of the monolithic metal body; and the heat dissipation channel extends through the monolithic metal body from the front side to the rear side under the first mounting surface, the heat dissipation channel being substantially coextensive with the first mounting surface. 2. The apparatus of claim 1 , wherein the housing body defines at least one cooling channel extending through the housing body, the at least one cooling channel being configured to receive a second cooling fluid that is different, and fluidly isolated, from the first cooling fluid. 3. The apparatus of claim 1 , wherein the housing body defines a second mounting surface configured to receive plural second electronic components to be cooled, the first mounting surface being positioned on a top side of the housing body and the second mounting surface being positioned on a bottom side of the housing body and with the heat dissipation channel positioned between the first mounting surface and the second mounting surface. 4. The apparatus of claim 3 , wherein: the monolithic metal body defines a second, recess, and the first mounting surface and the second mounting surface are positioned within the first and second recesses, respectively; and the monolithic metal body defines respective mounts in the first and second recesses, integral with the monolithic metal body, for mounting the plural first electronic components and the plural second electronic components to the first mounting surface and the second mounting surface, respectively. 5. The apparatus of claim 1 , wherein the housing further comprises a first cover configured for connection to top edges of the at least two top sidewalls, at the top side of the monolithic metal body, for at least partially enclosing the first recess. 6. The apparatus of claim 1 , wherein: the monolithic metal body defines a second mounting surface configured to receive plural second electronic components to be cooled, wherein the second mounting surface is planar and is positioned opposite the heat dissipation channel from the first mounting surface on the bottom side of the monolithic metal body; the monolithic metal body defines a second recess in the bottom side, wherein the second recess is at least partially bound by the second mounting surface and at least two bottom sidewalls that are perpendicular to the second mounting surface, the at least two bottom sidewalls being part of at least two of the front and rear sides and left and right sides of the monolithic metal body; and the heat dissipation channel is disposed under the second mounting surface and is substantially coextensive with the second mounting surface. 7. The apparatus of claim 6 , wherein the housing further comprises: a first cover configured for connection to top edges of the at least two top sidewalls, at the top side of the monolithic metal body, for at least partially enclosing the first recess; and a second cover configured for connection to top edges of the at least two bottom sidewalls, at the bottom side of the monolithic metal body, for at least partially enclosing the second recess. 8. An electronic device comprising: the apparatus of claim 6 ; and the plural first electronic components affixed to the first mounting surface; and the plural second electronic components affixed to the second mounting surface; wherein a power output of the electronic device, in at least one mode of operation, is from 10 kW to 3000 kW. 9. The electronic device of claim 8 , wherein the electronic device comprises an H-bridge power converter configured, in one or more of the at least one mode of operation, to convert an electrical input to the power output. 10. A vehicle comprising: at least one of: a traction motor and a drive system for electrically powering the traction motor to move the vehicle; or an auxiliary load and an auxiliary system for electrically powering the auxiliary load; wherein at least one of the drive system or the auxiliary system includes the electronic device of claim 8 , and wherein a gross operating weight of the vehicle is at least 150 metric tons. 11. An electronic device comprising: the apparatus of claim 1 ; and the plural first electronic components affixed to the first mounting surface; wherein a power output of the electronic device, in at least one mode of operation, is from 10 kW to 3000 kW. 12. The electronic device of claim 11 , wherein the electronic device comprises an H-bridge power converter configured, in one or more of the at least one mode of operation, to convert an electrical input to the power output. 13. A vehicle comprising: at least one of: a traction motor and a drive system for electrically powering the traction motor to move the vehicle; or an auxiliary load and an auxiliary system for electrically powering the auxiliary load; wherein at least one of the drive system or the auxiliary system includes the electronic device of claim 11 , and wherein a gross operating weight of the vehicle is at least 150 metric tons. 14. The apparatus of claim 1 , wherein the cooling fins are integral with the monolithic metal body such that the fins and housing body are formed of the same piece of metal. 15. An apparatus, comprising: a housing including a housing body that defines a first mounting surface configured to receive plural first electronic components to be cooled, wherein the housing body further defines a heat dissipation channel that extends through the housing body under the first mounting surface, and wherein the housing body comprises a monolithic metal body; and an array of cooling fins disposed in the heat dissipation channel; wherein the housing body is configured to conduct heat from the first electronic components to the cooling fins for transfer of the heat from the cooling fins to a first cooling fluid passing through the heat dissipation channel; and wherein the cooling fins are integral with the monolithic metal body such that the fins and housing body are formed of the same piece of metal. 16. An electronic device comprising: the apparatus of claim 15 ; and the plural first electronic components affixed to the first mounting surface; wherein a power output of the electronic device, in at least one mode of operation, is from 10 kW to 3000 kW. 17. The electronic device of claim 16 , wherein the electronic dev

Assignees

Inventors

Classifications

  • with means for cooling the electrical propulsion units · CPC title

  • Liquid coolant without phase change · CPC title

  • the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels · CPC title

  • B60K11/06Primary

    with air cooling · CPC title

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What does patent US10005355B2 cover?
An integrated mounting and cooling apparatus includes a housing body having a first mounting surface configured to receive electronic components to be cooled and a heat dissipation channel extending through the housing body under the first mounting surface. An array of cooling fins is disposed in the heat dissipation channel. The apparatus is configured to serve as a mounting surface for the el…
Who is the assignee on this patent?
Gen Electric
What technology area does this patent fall under?
Primary CPC classification B60K11/06. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jun 26 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).