Print module with air cooling arrangement

US10005299B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10005299-B2
Application numberUS-201715583031-A
CountryUS
Kind codeB2
Filing dateMay 1, 2017
Priority dateMay 2, 2016
Publication dateJun 26, 2018
Grant dateJun 26, 2018

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A print module includes: a body housing first and second opposed printed circuit boards (PCBs), each of the first and second PCBs having heat-generating electronic components; an air inlet and an air outlet positioned towards an upper part of the body; an air pathway extending between the air inlet and the air outlet; a plurality of heatsinks, each heatsink being thermally coupled with one of the heat-generating components and having an array of cooling fins extending into the air pathway; and an inkjet printhead receiving power and print data from at least one of the first and second PCBs. The inkjet printhead is positioned toward a lower part of the print module.

First claim

Opening claim text (preview).

The invention claimed is: 1. A print module comprising: a body housing first and second opposed printed circuit boards (PCBs), each of the first and second PCBs having heat-generating electronic components; an air inlet and an air outlet positioned towards an upper part of the body; an air pathway extending between the air inlet and the air outlet; a plurality of heatsinks, each heatsink being thermally coupled with one of the heat-generating components and having an array of cooling fins extending into the air pathway; and an inkjet printhead receiving power and print data from at least one of the first and second PCBs, wherein the inkjet printhead is positioned toward a lower part of the print module. 2. The print module of claim 1 , wherein a direction of ink droplet ejection is opposite to a direction of airflow through the air outlet. 3. The print module claim 1 , wherein the heat-generating electronic components are mounted on opposed surfaces of the first and second PCBs. 4. The print module of claim 3 , wherein: a first heatsink comprises a first base in thermal contact with a first heat-generating electronic component of the first PCB and first cooling fins extending from the first base into the air pathway; and a second heatsink comprises a second base in thermal contact with a second heat-generating electronic component of the second PCB and second cooling fins extending from the second base into the air pathway, wherein the first and second cooling fins extend from their respective first and second heatsink bases in opposite directions. 5. The print module of claim 4 , wherein the air pathway is defined by an air duct extending between air inlet and the air outlet. 6. The print module of claim 5 , wherein the air duct isolates the air pathway from the first and second PCBs. 7. The print module of claim 5 , wherein the air duct includes a constriction for dividing an airflow through the air inlet into first and second airflows for cooling the first and second arrays of cooling fins, respectively. 8. The print module of claim 5 , wherein the air duct has at least one aperture defined in each side thereof, each heatsink being at least partially received in a complementary respective opening. 9. The print module of claim 1 , wherein each heatsink comprises a base in thermal contact with one of the heat-generating electronic components, and wherein the array of cooling fins for each heatsink extends from the base into the air pathway. 10. The print module of claim 1 , further comprising a fan for generating an airflow through the air pathway. 11. The print module of claim 10 , wherein the fan is positioned at the air inlet or the air outlet. 12. The print module of claim 1 , wherein the first PCB is a power PCB comprising one or more drive transistors supplying power to the inkjet printhead. 13. The print module of claim 1 , wherein the second PCB is a logic PCB comprising one or microprocessors supplying print data to the inkjet printhead. 14. The print module of claim 1 , wherein the first and second PCBs are connected via one or more electrical connectors. 15. The print module of claim 1 comprising a supply module engaged with a replaceable printhead cartridge, the supply module comprising the body and the printhead cartridge comprising the inkjet printhead. 16. The print module of claim 15 , wherein the supply module comprises an ink inlet module and an ink outlet module flanking either side of the body, each of the ink inlet and ink outlet modules having a respective ink coupling engaged with complementary inlet and outlet couplings of the printhead cartridge.

Assignees

Inventors

Classifications

  • using wiping constructions (B41J2/16552 takes precedence) · CPC title

  • Ink pumps, ink valves · CPC title

  • for oscillating, e.g. page-width print heads provided with counter-balancing means or shock absorbers · CPC title

  • Cooling or ventilating arrangements · CPC title

  • Framework · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10005299B2 cover?
A print module includes: a body housing first and second opposed printed circuit boards (PCBs), each of the first and second PCBs having heat-generating electronic components; an air inlet and an air outlet positioned towards an upper part of the body; an air pathway extending between the air inlet and the air outlet; a plurality of heatsinks, each heatsink being thermally coupled with one of t…
Who is the assignee on this patent?
Memjet Technology Ltd, Memjet Technology Ltd
What technology area does this patent fall under?
Primary CPC classification B41J25/304. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Jun 26 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).